An optical receptacle includes a first optical surface, a second optical surface, and an annular first cylindrical part disposed to surround a second central axis of the second optical surface. The first cylindrical part includes a first inner surface with a circular shape in a cross section perpendicular to the second central axis, and a second inner surface disposed on a second optical surface side than the first inner surface and provided with a circular shape in the cross section perpendicular to the second central axis. A diameter of the first inner surface is greater than a diameter of the second inner surface, and a length of the second inner surface in a direction along the second central axis is 0.5 to 4.0 mm.

A reusable laser probe with single-use optic fiber may include a reusable handle, an optic fiber fixture, and a single-use optic fiber. The single-use optic fiber may include an optic fiber having an optic fiber distal end and an optic fiber proximal end. The optic fiber may be disposed in a first transitory connector having a first transitory connector distal end and a first transitory connector proximal end wherein the optic fiber distal end extends a fixed distance from the transitory connector distal end. The optic fiber may be disposed in a second transitory connector having a second transitory connector distal end and a second transitory connector proximal end wherein the optic fiber proximal end extends a fixed distance from the second transitory connector distal end. The first transitory connector may be inserted in the reusable handle and the second transitory connector may be inserted in the optic fiber fixture.

A system comprises a first optical component comprising a component body; at least a first waveguide formed in the component body, wherein the first waveguide is substantially mirror-symmetrical in shape relative to a line at or near the center of the first waveguide; and a self-alignment feature configured to assist in optically-coupling the first waveguide with a second waveguide located outside of the component body.

An optical device according to one embodiment includes: a light-emitting element; first and second lenses optically coupled with the light-emitting element; an optical component provided between the light-emitting element and the second lens, optically coupling each of the light-emitting element and the second lens, and multiplexing input lights; and a base having a lower plate having a plurality of convex mounting surfaces with each of the light-emitting element, the first lens, the second lens, and the optical component being mounted thereon and a side wall with a receptacle being connected thereto.

An alignment structure of optical element is provided, including: an optical fiber, having a parallel fiber segment and a plurality of bare fiber segments; a cover plate, provided with a plurality of side-by-side guide grooves and a plurality of first coupling parts, the bare fiber segments of the optical fiber being arranged in the corresponding guide grooves, cross-sectional shapes of the guide grooves being at least one of U-shaped or V-shaped; and a silicon chip, provided with lines and a plurality of second coupling parts; when the cover plate is matched with the silicon chip, the first coupling parts and the second coupling parts being coupled and positioned with each other respectively, and the optical fiber being fixed between the silicon chip and the cover plate. As such, precise positioning and rapid assembly are achieved.

A method includes forming multiple photonic devices in a semiconductor wafer, forming a v-shaped groove in a first side of the semiconductor wafer, forming an opening extending through the semiconductor wafer, forming multiple conductive features within the opening, wherein the conductive features extend from the first side of the semiconductor wafer to a second side of the semiconductor wafer, forming a polymer material over the v-shaped groove, depositing a molding material within the opening, wherein the multiple conductive features are separated by the molding material, after depositing the molding material, removing the polymer material to expose the v-shaped groove, and placing an optical fiber within the v-shaped groove.

Provided is an optical element module comprising: a mold body having a first surface formed on an upper portion thereof and a second surface formed on a lower portion thereof; an external connection terminal formed on the first surface and electrically connected to the outside; an optical engine embedded and sealed between the first surface and the second surface and having a connection pad exposed to the second surface; a conductive vertical via formed to penetrate the first surface and the second surface and having one end portion electrically connected to the external connection terminal; a wiring layer formed on the second surface to interconnect the other end of the conductive vertical via and the connection pad of the optical engine; and a reflective surface integrally formed on the wiring layer and transmits an optical signal generated by the optical engine or received by the optical engine.

Embodiments described herein may be related to apparatuses, processes, and techniques related to multilevel dies, in particular to photonics integrated circuit dies with a thick portion and a thin portion, where the thick portion is placed within a cavity in a substrate and the thin portion serves as an overhang to physically couple with the substrate, to reduce a distance between electrical contacts on the thin portion of the die and electrical contacts on the substrate. Other embodiments may be described and/or claimed.

A system includes a plurality of wafer-scale modules and a plurality of optical fibers. Each wafer-scale module includes an optical backplane and one or more die stacks on the optical backplane. The optical backplane includes a substrate and at least one optical waveguide layer configured to transport and/or manipulate photonic quantum systems (e.g., photons, qubits, qudits, large entangled states, etc.). Each die stack of the one or more die stacks includes a photonic integrated circuit (PIC) die optically coupled to the at least one optical waveguide layer of the optical backplane. The plurality of optical fibers is coupled to the optical backplanes of the plurality of wafer-scale modules to provide inter-module and/or intra-module interconnects for the photonic quantum systems.

An optical circuit module in which an optical fiber array and an optical circuit substrate are connected, the optical fiber array including a groove substrate in which a groove for optical fiber alignment is formed, a pressing plate stacked on and bonded to the groove substrate, and an optical fiber bonded to and fixed in the groove of the groove substrate, and the optical circuit substrate including an input/output waveguide. In a connection surface of the optical circuit module, an area of a common portion in a cross section of the optical circuit substrate and the pressing plate is larger than an area of a common portion in a cross section of the optical circuit substrate and the groove substrate.