A connector assembly includes a connector, an optical waveguide and a circuit board having a through-hole and a transmitter/receiver configured to transmit and/or receive light signals. The connector is interlockingly and releasably connected to the circuit board via a fastening element which is passed through the through-hole and connected to the circuit board. The connector has a receiving chamber which at least partially borders the transmitter/receiver. A lens unit is disposed in the receiving chamber and light-conductively connects the transmitter/receiver to the optical waveguide. A locking element is movably disposed on the connector. The locking element is disposed at least partially within the receiving chamber and secures the lens unit in the receiving chamber. The locking element is movable into a final latched position in which the locking element extends at least partially into the through-hole and blocks release of the fastening element from the circuit board.

An optical module includes: a substrate; one or more light sources that produce light that is an optical signal; one or more light reflection units that change the direction of travel of the light to a direction substantially perpendicular to the substrate; one or more optical waveguides that optically connect the one or more light sources and the one or more light reflection units to each other; and a lid that is attached to the substrate to cover the one or more light sources, the one or more light reflection units and the one or more optical waveguides. The lid has one or more lenses that collimate light directed by the one or more light reflection units and transmit the light to the outside of the lid.

Microelectronic assemblies including photonic integrated circuits (PICs), related devices and methods, are disclosed herein. For example, in some embodiments, a photonic assembly may include a PIC in a first layer including an insulating material, wherein the PIC is embedded in the insulating material with an active surface facing up; a conductive pillar in the first layer; an integrated circuit (IC) in a second layer on the first layer, wherein the second layer includes the insulating material and the IC is embedded in the insulating material, and wherein the IC is electrically coupled to the active surface of the PIC and the conductive pillar; an optical component optically coupled to the active surface of the PIC; and a hollow channel surrounding the optical component, the hollow channel extending from the active surface of the PIC through the insulating material in the second layer.

Microelectronic assemblies including photonic integrated circuits (PICs), related devices and methods, are disclosed herein. For example, in some embodiments, a photonic assembly may include an integrated circuit (IC) in a first layer including an insulating material, wherein the IC is embedded in the insulating material; a PIC, having an active surface, in a second layer, wherein the second layer is on the first layer, the second layer includes the insulating material, and the PIC is embedded in the insulating material with the active surface facing the first layer and electrically coupled to the IC; and a housing, having an optical lens optically coupled to an internal surface of the housing, attached to the active surface of the PIC and extending from the active surface of the PIC through the insulating material in the first layer, wherein the internal surface of the housing is opposite the active surface of the PIC.

An electronic device comprises a photonic integrated circuit (PIC) including at least one waveguide, an emitting lens disposed on the PIC to emit light from the at least one waveguide in a direction substantially parallel to a first surface of the PIC, and an optical element disposed on the PIC and having a reflective surface configured to direct light emitted from the emitting lens in a direction away from the first surface of the PIC.

An electronic device comprises a photonic integrated circuit (PIC) including at least one optical signal source, an emitting lens disposed on the PIC to steer light emitted by the at least one optical signal source in a direction substantially parallel to a first surface of the PIC, and an optical element disposed on the PIC and having a curved surface in a shape of a quarter cylinder that is configured to steer light emitted from the emitting lens in a direction substantially orthogonal to the first surface of the PIC.

A photonic package and a method of manufacturing a photonic package are provided. The photonic package includes a carrier, an electronic component, and a photonic component. The carrier has a first surface and a recess portion exposed from the first surface. The electronic component is disposed in recessed portion. The photonic component is disposed on and electrically connected to the electronic component and is configured to communicate optical signals.

Optical device, that is provided between optical output element and optical propagation element, includes: first lens circuit configured to include one or more lenses through which output light of the optical output element passes; and second lens circuit configured to include one or more lenses and guide output light of the first lens circuit to the optical propagation element. When F11 represents distance between the optical output element and the first lens circuit, F12 represents distance between the first lens circuit and first beam waist position of the first lens circuit, F21 represents distance between the first beam waist position and the second lens circuit, and F22 represents distance between the second lens circuit and second beam waist position of the second lens circuit, F11 and F22 are equal to each other and F12 and F21 are equal to each other.

There is provided a highly convenient package for an optical module in which a device can be mounted as it is even when the number and mounting position thereof are different according to the device to be mounted. The package includes a base plate having a top surface on which devices are assembled, an optical fiber mounting component mounted on the top surface of the base plate, a direct current electrical interface component and a high frequency electrical interface component mounted on the top surface of the base plate. The optical fiber mounting component and the electrical interface components are separately manufactured, separately assembled on the top surface of the base plate, and fixed in different modes. The optical fiber mounting component is fixed by fastening with screws and fixed by soldering, and the electrical interface components are fixed by fastening with the screws.

Various embodiments provide methods for fabricating a couplable electro-optical device. An example method comprises fabricating a pillar on a substrate by forming a lens spacer portion about an electro-optical component fabricated on the substrate; and adhering unshaped lens material to an exposed surface of the pillar. The exposed surface of the pillar is disposed opposite the substrate. The example method further comprises maintaining the unshaped lens material at a reflow temperature for a reflow time to allow the lens material to reflow into a formed lens shape, and curing the lens material to form an integrated lens having the formed lens shape secured to the lens spacer portion and formed about the electro-optical component on the substrate.