A transceiver assembly for mounting on a mother board, said transceiver assembly comprising: (a) a frame defining a first plane configured for mounting parallel to said motherboard, said frame defining a plurality of slots perpendicular to said first plane; and (b) one or more opto-electric cards, each of said one or more opto-electric cards disposed in one of said plurality of slots and comprising at least, (i) a substrate having a first edge parallel to said first plane when said opto-electric card is mounted in said slot, (ii) an electrical interface along said first edge, (iii) and an interposer electrically connected to said electrical interface and comprising at least one optical component operatively connected to said electrical interface, and (iv) at least one optical fiber extending freely from said interposer.

A connector for a system circuit board or a power module is provided. The connector includes a main body and an optical connection mechanism. The main body includes a first connecting terminal and a second connecting terminal. The first connecting terminal and the second connecting terminal are power contacts or signal contacts. The optical fiber connection mechanism is embedded within the main body. The optical fiber connection mechanism is disposed between the first connecting terminal and the second connecting terminal. Since the optical fiber connection mechanism is embedded within the main body, it is not necessary to specifically remove the optical fiber cable when the power module is detached from the cabinet. Moreover, the appearance of the product is more aesthetically-pleasing, and the maintaining speed and the product reliability are increased.

The invention provides an optical module which is less likely to be damaged, and can be assembled at low cost. The optical module comprises a housing having an electrical signal port for inputting and/or outputting an electrical signal and an optical signal port for inputting and/or outputting an optical signal, a first substrate arranged in the housing so as to connect to the electrical signal port, an optical fiber arranged in the housing so as to connect to the optical signal port, and a second substrate provided with an optical device which connects to the optical fiber to input the optical signal from the optical fiber and output the optical signal to the optical fiber, and arranged in the housing so as to electrically connect to the first substrate, and to be inclined with respect to a base plane of the housing.

Embodiments include an optical apparatus and associated method of assembling. The optical apparatus comprises a substrate defining a first surface and a channel formed relative thereto, the substrate including one or more waveguides extending to a sidewall partly defining the channel, a plurality of first electrical contacts formed on the first surface. The optical apparatus further comprises a carrier member defining a second surface and at least a third surface, the second surface coupled with the first surface of the substrate. The optical apparatus further at least one optical component coupled with the second surface and at least partly disposed within the channel, wherein the at least one optical component is optically coupled with the one or more waveguides and electrically connected with the first electrical contacts via a plurality of second electrical contacts at the third surface of the carrier member.

An optoelectronic device includes an optoelectronic die, a laser die, and electrical interconnects. The optoelectronic device has a surface. A trench having first and second walls and a floor is formed in the surface, and an electrically conductive layer extends from the floor, via the first wall, to the surface. The laser die includes first and second electrodes and a laser output aperture. The laser die is mounted in the trench and is configured to emit a laser beam. The first electrode is coupled to the electrically conductive layer and the laser output aperture is mechanically aligned with a waveguide that extends from the second wall. The interconnects are formed on the second electrode of the laser die and on selected locations on the surface of the optoelectronic die. The interconnects are coupled to a substrate, and are configured to conduct electrical signals between the optoelectronic die and the substrate.

A method for manufacturing an electronic component includes preparing a mounting substrate provided with a first region to mount an electronic component thereon and a second region having conductivity, covering the second region with resin, applying a metal paste on the first region, mounting the electronic component on the first region with the metal paste, and removing the resin covering the second region. The mounting includes heating the mounting substrate to cure the metal paste with the electronic components being placed on the metal paste applied on the first region. The resin peeled from the second region by the heating is removed in the removing.

Presented herein are a submount architecture for an electro-optical engine, which may be embodied as an apparatus in the form of at least an electro-optical engine and a multimode node, and a method for providing the same. According to at least one example, an apparatus includes a printed circuit board (PCB), a substrate with a finer structuring than the PCB, and electro-optical components. A bottom surface of the substrate is coupled to the PCB and electro-optical components are mounted on or in a top surface of the substrate. The electro-optical components include one or more optical components arranged to emit optical signals towards and/or receive optical signals from an area above the top surface of the substrate.

Presented herein are a submount architecture for an electro-optical engine, which may be embodied as an apparatus in the form of at least an electro-optical engine and a multimode node, and a method for providing the same. According to at least one example, an apparatus includes a printed circuit board (PCB), a substrate with a finer structuring than the PCB, and electro-optical components. A bottom surface of the substrate is coupled to the PCB and electro-optical components are mounted on a top surface of the substrate. The electro-optical components include one or more optical components arranged to emit optical signals towards and/or receive optical signals from an area above the top surface of the substrate.

An interposer PIC structure having a fanout waveguide structure is described for which the patterned planar waveguides of the fanout waveguide structure is formed from a same hard mask patterning step comprising a patterned area for a lateral alignment aid used to align the linearly configured cores of a multicore fiber with a terminal end of the fanout waveguide structure. Areas of the same patterned hard mask may optionally include one or more fiducials and one or more alignment pillars for aligning mounted devices onto the PIC structure. Interposer PIC assemblies are described comprising the interposer PIC structure, multicore fibers having linearly configured arrays of cores, and devices mounted or otherwise formed on the interposer PIC structure. Methods of forming the interposer PIC structures and assemblies are also disclosed. The linearly configured cores of a multicore fiber are aligned in interposer PIC assemblies with a fanout waveguide structure formed from the planar waveguide layer on an interposer PIC structure to facilitate optical signal transfer between the cores of the multicore fiber and planar waveguides formed on the interposer and subsequently to devices mounted on the interposer and coupled to the patterned planar waveguides on the interposer.

There is set forth herein a method including building a first photonics structure using a first wafer having a first substrate, wherein the building the first photonics structure includes integrally fabricating within a first photonics dielectric stack one or more photonics device, the one or more photonics device formed on the first substrate; building a second photonics structure using a second wafer having a second substrate, wherein the building the second photonics structure includes integrally fabricating within a second photonics dielectric stack a laser stack structure active region and one or more photonics device, the second photonics dielectric stack formed on the second substrate; and bonding the first photonics structure and the second photonics structure to define an optoelectrical system having the first photonics structure bonded the second photonics structure.