A space active optical cable (SAOC) includes a cable including one or more optical fibers, and two or more electrical transceivers on opposing ends of the cable and interconnected by the cable. Each of the electrical transceivers includes an enclosure that encloses one or more light sources, one or more light detectors, and control electronics. Also included in the enclosure are a coupling medium to couple light into and out of the one or more optical fibers. The coupling medium can be reflecting surface or an on-axis mount. The enclosure provides a suitable heat propagation and electromagnetic interference (EMI) shielding, and the cable and the two or more electrical transceivers are radiation resistant. SAOC features optionally support a health check algorithm that allows trending optical performance in the absence of an optical connector and a potential surface treatment to increase nominally low emissivity of an EMI conductive surface.

An optical waveguide package includes a substrate including a first surface and a second surface opposite to the first surface, a cladding located on the second surface and including a third surface facing the second surface, a fourth surface opposite to the third surface, and an element-receiving portion with an opening in the fourth surface, a core located in the cladding and extending from the element-receiving portion, and a first metal member located in the element-receiving portion in a plan view as viewed in a direction toward the fourth surface and including an element mount. The first metal member is connected to a second metal member with a first via conductor extending through the substrate from the first surface to the second surface.

An optical assembly includes an optical ferrule configured to receive light from an optical waveguide and including at least four ferrule alignment features; and a cradle securing the optical ferrule therein and configured to align the optical ferrule to an optical component, the cradle including at least four cradle alignment features configured to make contact or near contact with the at least four ferrule alignment features in a one to one correspondence in at least four corresponding contact regions, such that as a temperature of at least one of the cradle and the optical ferrule changes sufficiently, the corresponding alignment features of the optical ferrule and the cradle slide relative to each other causing the corresponding alignment features of the optical ferrule and the cradle to move to define corresponding traversed regions, such that when extended, the traversed regions of the at least four ferrule alignment features and the at least four cradle alignment features pass within 20 microns of a same first point.

An optical module according to the present invention includes: an optical device including an optical waveguide chip; an optical fiber block bonded to and arranged on an end face of the optical waveguide chip; an optical fiber that has one end optically connected to the optical waveguide chip via the optical fiber block; an optical fiber holding mechanism for holding the other end of the optical fiber; and an optical fiber carrier. The optical fiber is arranged while being curved from the optical fiber carrier toward the optical fiber block in a U-shape, and a wall structure is formed on the surface of the carrier while being adjacent to the optical fiber at, for example, a position on the outer side of the U-shaped curve of the optical fiber position at which the wall structure reduces a normal force of the optical fiber.

A thermal compensator, for use in connection with arrayed waveguide grating (AWG) modules which are, in turn, utilized in conjunction with wavelength multiplexing and de-multiplexing within optical networks, is disclosed. The thermal compensator comprises a bow-shaped frame member, a central bar member, and a screw. The bow-shaped frame member is characterized by a higher or great coefficient of thermal expansion (CTE) than that of the central bar member such that the bow-shaped frame member can expand and elongate at a greater rate than can the central bar member under hot temperature conditions, however, under cold temperature conditions, the rate of contraction of the bow-shaped member is effectively retarded by the slower rate of contraction of the central bar member. The bow-shaped frame member is adapted to be attached to a movable section of an athermal arrayed waveguide grating (AAWG) module such that the expansion and contraction movements of the bow-shaped member influence the movement of a movable section of the athermal arrayed waveguide grating (AAWG) module in order to maintain the proper focus of the athermal arrayed waveguide grating (AAWG) module across disparate temperature conditions within which the athermal arrayed waveguide grating (AAWG) module is designed to operate.

This invention provides opportunity for diamond and bi-wafer microstructures to be implemented in advanced ICs and advanced IC packages to form a new breed of ICs and SiPs that go beyond the limitations of silicon at the forefront of IC advancement due primarily to diamond's extreme heat dissipating ability. Establishing the diamond and bi-wafer microstructure capabilities and implementing them in advanced ICs and advanced IC packages gives IC and package architects and designers “an extra degree of design freedom” in achieving extreme IC performance, particularly when thermal management presents a challenge. Diamond's extreme heat spreading ability can be used to dissipate hotspots in processors and other high-power chips such as GaN HEMT, resulting in performance and reliability enhancement for IC and package applications covering HPC, AI, photonics, 5G RF/mmWave, power and IoT, and at the system level propelling the migration from traditional computing to near-memory computing and in-memory computing.

In an embodiment a semiconductor laser component includes a plurality of semiconductor lasers, each of the semiconductor lasers configured to emit primary electromagnetic radiation of a primary spectral bandwidth in a visible wavelength range and a beam combiner configured to combine the primary electromagnetic radiations emitted from the semiconductor lasers, form secondary electromagnetic radiation from a superposition of the primary electromagnetic radiations of the semiconductor lasers and couple the secondary electromagnetic radiation out from the beam combiner, wherein the secondary electromagnetic radiation has a secondary spectral bandwidth that is at least twice as large as an average value of the primary spectral bandwidths.

An optical-path-displacement-compensation-based emission optical power stabilization assembly, comprising: a laser, a lens, and an optical fiber coupling port disposed on a first substrate and a second substrate according to a preset arrangement scheme, wherein an expansion coefficient of the second substrate is larger than that of the first substrate, and the preset arrangement scheme enables initial distances between the laser and the lens, between the lens and the optical fiber coupling port, and/or between the laser and the optical fiber coupling port to differ from respective optical coupling distances from an optical coupling point by a preset value, thereby ensuring that a coupling loss on an optical path changes along with the temperature, forming a complementary effect with respect to an optical power-temperature curve of the laser, which reduces a temperature-caused fluctuation of the emission optical power of an optical assembly.

A silicon photonic (SiPh) packaging assembly includes a SiPh interposer and a wafer. The SiPh interposer has one or more optical gratings disposed thereon to couple an optical signal traversing the wafer. The wafer is bonded to the interposer, with the wafer including one or more microlenses, each microlens aligned with a respective optical grating and designed to direct the optical signal traversing the wafer at a desired angle.

In one example embodiment, an optoelectronic assembly includes an electronic substrate, a transparent component coupled on a first side of the electronic substrate, and a first component coupled to a second side of the electronic substrate opposite the first side. The electronic substrate, the transparent component, and the first component may define a hermetically sealed enclosure. A laser array or a receiver array may be mechanically coupled to the transparent component inside of the enclosure and oriented to transmit or receive optical signals through the transparent component. The laser array or the receiver array may be electrically coupled to the electronic substrate. A second component may be positioned between the first component and the transparent component in the hermetically sealed enclosure with a thermal interface material forming a first interface between the second component and the transparent component.