Disclosed are structures and methods for active optic cable (AOC) assembly having improved thermal characteristics. In one embodiment, an AOC assembly includes a fiber optic cable having a first end attached to a connector with a thermal insert attached to the housing for dissipating heat from the connector. The AOC assembly can dissipate a suitable heat transfer rate from the active components of the connector such as dissipating a heat transfer rate of 0.75 Watts or greater from the connector. In one embodiment, the thermal insert is at least partially disposed under the boot of the connector. In another embodiment, at least one component of the connector has a plurality of fins. Other AOC assemblies may include a connector having a pull tab for dissipating heat from the assembly.

A vacuum fluctuation quantum random number generator chip includes a heat sink substrate, a laser fixed to a first end of the heat sink substrate, at least two photoelectric detectors fixed to a second end of the heat sink substrate, and a beam splitter fixed to the heat sink substrate and located between the laser and the at least two photoelectric detectors. Light of the laser propagates through the beam splitter. The at least two photoelectric detectors are respectively positioned at optical path outlets of the beam splitter.

An electrical connector includes: an insulating housing having a front housing having a front top wall and a pair of front side walls and a rear housing cooperating with the front housing; and plural terminal modules accommodated in the insulating housing, each of the terminal modules including an insulating body and plural conductive terminals held in the insulating body, wherein the rear housing includes a rear top wall and a pair of rear side walls extending downward from the rear top wall, and the rear top wall and the pair of rear side walls surround the terminal module in three directions.

An optical receptacle connector includes a receptacle housing having housing walls defining a contact cavity and an optical cavity. The receptacle housing includes an upper wall and a lower wall at a front of the receptacle housing defining a card slot receiving a mating edge of an optical module circuit board of a pluggable optical generator module. The upper wall includes an upper wall opening above the card slot. A contact assembly having receptacle contacts is received in the contact cavity to supply power to the pluggable optical generator module to operate a light source of the pluggable optical generator module. A receive optical connector is coupled to the receptacle housing above the upper wall opening and mated with a supply optical connector of the pluggable optical generator module to receive optical signals from the supply optical connector.

To reduce bad connections of a BGA optical module as an optical fiber interface during mounting by reflowing. An optical module includes: a substrate to which an optical fiber is connected and fixed and on which an electronic circuit, an optical circuit or the like is formed; a ball grid array provided on one face of the substrate as an electrical interface used when the optical module is mounted on a mounting substrate; a lid having a thermal conductivity provided on another face of the substrate; and a fiber routing mechanism provided in contact with the lid, the fiber routing mechanism having a thermal conductivity and shaped to enable the optical fiber to be wound around the fiber routing mechanism.

An opto-electric hybrid board includes an optical waveguide extending in the longitudinal direction and an electric circuit board disposed on a one-side surface in the thickness direction of the optical waveguide and extending in the longitudinal direction. The electric circuit board includes a first terminal disposed in a one end portion in the longitudinal direction of a one-side surface in the thickness direction of the electric circuit board and being for mounting the optical element, and a second terminal disposed in the one end portion in the longitudinal direction of the one-side surface in the thickness direction of the electric circuit board and being for mounting a driver element electrically connected with the optical element. The electric circuit board has one edge in the longitudinal direction at one side in the longitudinal direction as compared to one edge in the longitudinal direction of the optical waveguide.

A system includes a housing having a front panel, a substrate that is positioned at a distance from the front panel, and a data processor mounted on the substrate. The system includes a pluggable module having an optical module, at least one first optical connector, a first fiber optic cable optically coupled between the optical module and the first optical connector, and a fiber guide positioned between the optical module and the first optical connector and provides mechanical support for the optical module and the first optical connector. The optical module receives optical signals from the first optical connector and generates electrical signals based on the received optical signals, and the electrical signals are transmitted to the data processor. The pluggable module has a shape that enables the pluggable module to pass through an opening in the front panel to enable the optical module to be coupled to the substrate.

A lamp for a vehicle includes a light source configured to emit light; a light guide provided in front of the light source and into which the light is incident; and a heat dissipation unit provided in close contact with one side of the light guide. The light guide includes a first recessed region formed on a bottom surface of the light guide and having an upward recessed shape, and the heat dissipation unit is provided in close contact with the first recessed region.

Embodiments described herein may be related to apparatuses, processes, and techniques related to thermally and/or electrically coupling a thermal die to the surface of a photonic integrated circuit (PIC) within an open cavity in a substrate, where the thermal die is proximate to a laser on the PIC. Other embodiments may be described and/or claimed.

A connector (7) includes: a first connector part (10) having a first module side connection part connected to one end of an OSFP module in the front (F), having a first substrate side connection part connected to a substrate, and installed on the substrate; a second connector part (20) provided at a position such that the first module side connection part is interposed between the substrate and the second connector part (20), having a second module side connection part connected to one end of an OSFP module at the front (F), having a second substrate side connection part connected to the substrate, and stacked on the first connector part (10); and an intermediate part (30) provided between the first connector part (10) and the second connector part (20), and a cooling flow path in which air flows from the front (F) side toward the rear (R) side of the connector (7) is formed in the intermediate part (30).