In one embodiment, a module for plugging into a QSFP-DD (Quad Small Form Factor Pluggable Double Density) cage is provided that has one or more projections for contacting a QSFP-DD optical module in an adjacent QSFP-DD recess of the QSFP-DD cage so as to evacuate heat from, and or provide power to, the QSFP-DD optical module.

A micro device transfer tool and methods of operation are described. In an embodiment, the micro device transfer tool includes an articulating transfer head assembly capable of six degrees of motion. A miniatured camera assembly may be secured near the point of contact for the articulating transfer head assembly to aid in system alignment. In an embodiment, an encoder system is described for alignment of a micro pick up array and target substrate using complementary concentric grating patterns. In an embodiment a miniaturized position sensor design is described for sensing position of various system components during alignment or pick and place processes.

A system may include a heat-generating component and a thermoelectric cooler thermally coupled to the heat-generating component and arranged such that when an electrical parameter is applied to the thermoelectric cooler, a temperature gradient is created across the thermoelectric cooler in which a first side of the thermoelectric cooler proximate to the heat-generating component is at a lower temperature than a second side of the thermoelectric cooler opposite the first side and less proximate to the heat-generating component than the first side.

An optical transceiver module and an optical cable module using the same are provided. The optical transceiver module: a substrate; at least one optical receiving device connected to the substrate; a plurality of optical transmitting devices connected to the substrate, wherein the optical transmitting devices comprise a plurality of first optical transmitting devices and a plurality of second optical transmitting devices, and the optical transmitting devices are misaligned to each other.

A plurality of lid structures include at least one lid structure configured to overlie one or more heat sources within a multi-chip-module and at least one lid structure configured to overlie one or more temperature sensitive components within the multi-chip-module. The plurality of lid structures are configured and positioned such that each lid structure is separated from each adjacent lid structure by a corresponding thermal break. A heat spreader assembly is positioned in thermally conductive interface with the plurality of lid structures. The heat spreader assembly is configured to cover an aggregation of the plurality of lid structures. The heat spreader assembly includes a plurality of separately defined heat transfer members respectively configured and positioned to overlie the plurality of lid structures. The heat spreader assembly is configured to limit heat transfer between different heat transfer members within the heat spreader assembly.

An optical sub-assembly includes a diode submount structure, a diode mounted to the diode submount, and a thermoelectric cooler (TEC). The TEC is in thermal contact with the diode, and the diode is positioned between the diode submount structure and the TEC.

In part, in one aspect, the disclosure relates to a system including a photonic integrated circuit (PIC) assembly, comprising a PIC comprising: a first bond pad disposed inward from an edge of the PIC a first distance; and a first wire having a first length, the first wire electrically connected to the first bond pad and extending therefrom, wherein the first distance is greater than 0.4 mm.

An optic module cage assembly configured to selectively receive and retain an optic module, including: an optic module cage body configured to selectively receive and retain the optic module; a stationary heatsink fixedly attached to a side of the optic module cage body; one or more spring members disposed opposite the stationary heatsink and configured to bias the optic module towards the stationary heatsink; and a floating connector disposed partially within the optic module cage body and configured to make an electrical connection with the optic module, wherein the floating connector is configured to move in a constrained manner with respect to the optic module cage body. Optionally, the optic module cage assembly also includes a floating heatsink coupled to the one or more spring members. Optionally, the optic module cage assembly further includes a heat pipe that is thermally coupled to the stationary heatsink.

An optical module includes a circuit board and a light receiving assembly. The light receiving assembly is electrically connected to the circuit board and configured to receive optical signals from outside of the optical module. The light receiving assembly includes a light receiving cavity, an optical amplification assembly and a light receiving chip. The optical amplification assembly is disposed in the light receiving cavity and configured to amplify the optical signals. The optical amplification assembly includes a fourth substrate and a semiconductor optical amplifier (SOA). The fourth substrate is electrically connected to the circuit board, and the SOA is disposed on the fourth substrate and is electrically connected to the fourth substrate, The light receiving chip is disposed in the light receiving cavity and configured to receive the amplified optical signals.

The present disclosure is generally directed to techniques for thermal management within optical subassembly modules that include thermally coupling heat-generating components, such as laser assemblies, to a temperature control device, such as a thermoelectric cooler, without the necessity of disposing the heat-generating components within a hermetically-sealed housing. Accordingly, this arrangement provides a thermal communication path that extends from the heat-generating components, through the temperature control device, and ultimately to a heatsink component, such as a sidewall of a transceiver housing, without the thermal communication path extending through a hermetically-sealed housing/cavity.