A silicon optical modulator is fabricated to have a multi-slab structure between the contacts and the waveguide, imparting desirable performance attributes. A first slab comprises dopant of a first level. A second slab adjacent to (e.g., on top of) the first slab, comprises a doped region proximate to a contact, and an intrinsic region proximate to the waveguide. The parallel resistance properties and low overlap between the highly doped silicon and optical mode pigtail afforded by the multi-slab configuration, allow the modulator to operate with reduced optical losses and at a high speed. Embodiments may be implemented in a Mach-Zehnder interferometer or in micro-ring resonator modulator configuration.

An optical modulator includes a first Radio Frequency (RF) line and a second RF line; an optical waveguide along a length of the modulator with an input and an output; and a plurality of segments along the length including a first set of segments, a single RF line crossing, and a second set of segments, wherein the first set of segments and the second set of segments have an inversion of their respective orientation at the RF line crossing, and wherein the RF line crossing is located off center relative to the plurality of segments, wherein each of the first RF line and the second RF line extend along the length and cross one another at the RF line crossing.

Ring modulators based on interdigitated junctions may be driven in full or partial standing wave mode and, active regions (providing the modulation) and light-absorptive regions (e.g. providing electrical conduction) are placed in a pattern inside a resonant cavity in order to match the maxima and minima of the optical field, respectively. The pattern may be periodic to match the periodicity of a typical electromagnetic field which is periodic with the wavelength. It may also be aperiodic in the case that the cross-section or materials are engineered along the direction of propagation such that the propagation constant (and thus wavelength, i.e. optical wave “local periodicity”) change along the propagation direction.

An injection modulator for modulation of optical radiation, having an optical waveguide and a diode structure, having at least two p-doped semiconductor portions, at least two n-doped semiconductor portions and at least one lightly or undoped intermediate portion between the p-doped and n-doped portions. The p-doped portions when viewed in the longitudinal direction of the waveguide are offset with respect to the n-doped portions and the diode structure is arranged in a resonance-free portion of the waveguide. The p-doped portions lie on one side of the waveguide, the n-doped portions lie on the other side of the waveguide and the intermediate portion lies in the center, each portion extends transversely with respect to the waveguide longitudinal direction in the direction of the waveguide center of the waveguide and no p-doped portion when viewed in the longitudinal direction of the waveguide overlaps any n-doped portion.

A method of fabricating an optical structure comprises providing a layer of single crystal crystalline silicon supported on an insulating surface of a silicon substrate; using etching to remove part of the silicon layer and define a side wall which is non-parallel to the insulating surface of the substrate; forming a layer of insulating material over the side wall; forming a further layer of silicon over at least the insulating material; and removing the silicon of the further layer to a level of the layer of silicon such that the layer of insulating material occupies a slot between a portion of silicon in the layer and a portion of silicon in the further layer, a thickness of the layer of insulating material defining a width of the slot.

An optical modulation device includes: an optical waveguide formed above a substrate; a phase modulator disposed on part of the optical waveguide; a capacitor connected to the phase modulator and including a lower electrode and an upper electrode; a resistor connected in parallel to the capacitor; and an appended part integrated with the upper electrode and electrically connected to the resistor, wherein the appended part is smaller in area than the capacitor (upper electrode).

A method for forming a silicon optical modulator with improved modulation efficiency. the method includes providing a silicon layer in a SOI substrate and forming a waveguide in the silicon layer with a rib structure respectively joining with a first slab region on one side and a second slab region on opposite side with corresponding slab thicknesses smaller than the rib structure. The method additionally includes forming multiple etched sections in each of the first slab region and the second slab regions with decreasing etching depths for sections further away from the rib structure. Furthermore, the method includes forming a PN junction in the rib structure with a moderate P/N doping level. Moreover, the method includes doping the multiple etched sections in the first/second slab region respectively with P-type/N-type impurity at increasing doping levels sequentially for sections further away from the rib structure.

The present invention describes a semiconductor interferometric reflecting device capable of modulating the reflected light by modulating the carrier concentration inside a semiconductor device. The variation of the carrier concentration within the device causes the variation of the physical optical properties inside the semiconductor material leading to a shift of the reflected and absorbed light spectrums. The modulating layer is fabricated on an optically smooth substrate, i.e., sufficiently smooth to allow for the occurrence of interference effects. Furthermore, if desired, the same device can be designed to emit or reflect the desired light. The present invention may be utilized for a reflective flat panel display comprising an array of semiconductor interferometric reflecting devices.

A method for forming a silicon optical modulator with improved modulation efficiency. the method includes providing a silicon layer in a SOI substrate and forming a waveguide in the silicon layer with a rib structure respectively joining with a first slab region on one side and a second slab region on opposite side with corresponding slab thicknesses smaller than the rib structure. The method additionally includes forming multiple etched sections in each of the first slab region and the second slab regions with decreasing etching depths for sections further away from the rib structure. Furthermore, the method includes forming a PN junction in the rib structure with a moderate P/N doping level. Moreover, the method includes doping the multiple etched sections in the first/second slab region respectively with P-type/N-type impurity at increasing doping levels sequentially for sections further away from the rib structure.

An electro-optical modulator assembly including a transistor including a gate, a drain, and a source disposed on a substrate, a photonic modulator including a first waveguide structure positioned between a first electrode and a second electrode, the photonic modulator being integrated with the transistor on the substrate, and a metal connection coupled between the drain of the transistor and one of the first and second electrodes of the photonic modulator.