Provided is a photosensitive resin composition containing: a photopolymerizable compound (A) having an ethylenically unsaturated group; a photopolymerization initiator (B); and an inorganic filler (F), in which the photopolymerizable compound (A) having an ethylenically unsaturated group includes a photopolymerizable compound (A1) having an acidic substituent and an alicyclic structure together with an ethylenically unsaturated group, and the inorganic filler (F) includes an inorganic filler surface-treated with a coupling agent without at least one functional group selected from the group consisting of an amino group and a (meth)acryloyl group. The present disclosure also provides a photosensitive resin composition for photo via formation, and a photosensitive resin composition for interlayer insulating layer. The present disclosure further provides: a photosensitive resin film and a photosensitive resin film for interlayer insulating layer, each of which contains the photosensitive resin composition; a multilayered printed wiring board and a semiconductor package; and a method for producing a multilayered printed wiring board.

Disclosed are a color filter including a wavelength conversion layer which converts the wavelength of light, a light transmission layer formed on the wavelength conversion layer, and a wavelength filter layer formed on the light transmission layer, and an image display device. The light transmission layer transmits a light moving between the wavelength conversion layer and the wavelength filter layer and blocks the flow of outgas. The color filter includes the light transmission layer which transmits a light moving between the wavelength conversion layer and the wavelength filter layer and blocks the flow of outgas, thereby capable of achieving high color reproductivity while having excellent light-emitting efficiency and light retention rate.

The present invention provides a composite which can be produced by photostructuring a photostructurable matrix material in a composite formulation to form a structured matrix with nanoparticles, where the refractive index of the composite with nanoparticles differs from the refractive index of the composite without nanoparticles at one wavelength, selected from the range from 150 nm to 2000 nm by less than 0.5, said composite being hierarchically structured and comprising at least one structural unit (I) of a selected thickness (i) and structural units (II) branching from said structural unit (I) of a selected thickness (ii), wherein the thickness (ii) at the branch-off points is at most half the thickness (i). In addition, the present invention provides an improved process for the preparation of a composite comprising photostructured matrix material and nanoparticles contained therein and the use of the composite.

A zirconium nitride powder which has a specific surface area of 20 to 90 m.sup.2/g as measured by a BET method, has a peak corresponding to zirconium nitride but does not have a peak corresponding to zirconium dioxide, a peak for lower zirconium oxide or a peak corresponding to lower zirconium oxynitride in an X-ray diffraction profile, and the light transmittance X at 370 nm is at least 18%, the light transmittance Y at 550 nm is 12% or less and the ratio (X/Y) of the light transmittance X at 370 nm to the light transmittance Y at 550 nm is 2.5 or more in the transmission spectra of a dispersion that contains the powder at a concentration of 50 ppm.

A negative-working photosensitive resin composition including an epoxy group-containing resin, a metal oxide, and a cationic polymerization initiator, in which a photosensitive resin film having a film thickness of 20 μm obtained by applying the negative-working photosensitive resin composition onto a silicon wafer and performing a bake treatment at 90° C. for 5 minutes has a Martens hardness of less than 235 [N/mm.sup.2], and when a viscoelasticity of a cured film, which is obtained by exposing the photosensitive resin film to i-rays at an irradiation amount of 200 mJ/cm.sup.2, performing a bake treatment after the exposure at 90° C. for 5 minutes, and then performing a bake treatment at 200° C. for 1 hour to cure the photosensitive resin film, is measured at a frequency of 1.0 Hz, a tensile elastic modulus (E*) of the cured film at a temperature of 175° C. is 2.1 [GPa] or more.

A resist composition is disclosed which comprises a perovskite material with a structure having a chemical formula selected from ABX.sub.3, A.sub.2BX.sub.4, or ABX.sub.4, wherein A is a compound containing an NH.sub.3 group, B is a metal and X is a halide constituent. The perovskite material may comprise one or more of the following components: halogen-mixed perovskite material; metal-mixed perovskite material, and organic ligand mixed perovsikte material.

There are free radical scavengers of formula (P.sub.m-L).sub.n-T.sub.q. Also provided are negative-working lithographic printing plate precursors comprising a hydrophilic substrate and a NIR photopolymerizable or UV-violet photopolymerizable imageable layer coated on the hydrophilic layer, the imageable layer also being photopolymerizable by visible light, the imageable layer having an outer surface and a thickness, the outer surface of the imageable layer being uniformly, and partially or completely crosslinked down to a depth corresponding to at most about 70% of the thickness of the imageable layer.

Provided are a pattern formation method including a step of preparing a base material which has an etching layer transparent to an exposure wavelength on each of two surfaces thereof and is transparent to the exposure wavelength, a step of forming a photosensitive resin layer, in which an optical density to the exposure wavelength is in a range of 0.50 to 2.50, on the etching layer on each of the two surfaces of the base material, a step of pattern-exposing the photosensitive resin layer, a step of developing the photosensitive resin layer to form a resist pattern on two surfaces, a step of removing the etching layer on a portion that is not coated with the resist pattern, and a step of peeling the resist pattern off, in this order, a laminate, and a method of producing a touch panel.

The present disclosure provides a quantum dot color filter, a fabrication method thereof, a display panel and a display device, and belongs to the field of display technology. The quantum dot color filter of the present disclosure includes a quantum dot functional layer configured to emit light of a certain color under excitation of excitation light. The quantum dot functional layer has a hollowed-out portion, which exposes a side surface of the quantum dot functional layer, so that the excitation light is able to arrive at the side surface.

A liquid photosensitive ink composition capable of forming a cured product with a high refractive index and applicable to an inkjet method even though the photosensitive ink composition does not include the solvent, or include small amount of the solvent, a cured product of the photosensitive ink composition, a display panel having a film consisting of the cured product, and a method for producing the cured product using the above photosensitive ink composition. In a photosensitive ink composition including a photopolymerizable compound, metal compound particles, and a photopolymerization initiator, a sulfide compound having specific structure and a (meth)acrylate compound having specific structure as the photopolymerizable compound, and at least one selected from the group consisting of titanium oxide particles, barium titanate particles, cerium oxide particles, and zinc sulfide particles, as the metal compound particles are used.