Provided are a resin composition including a coloring material, a resin, and a solvent, in which the resin includes a graft polymer which has a main chain including a molecular chain having a structure derived from a compound having an ethylenically unsaturated bond-containing group and a graft chain, and the graft chain includes a repeating unit p1 having an oxetane group; a film formed of the resin composition; an optical filter; a solid-state imaging element; and an image display device.

Provided are a resin composition including a coloring material, a resin, and a solvent, in which the resin includes a graft polymer which has a main chain including a molecular chain having a structure derived from a compound having an ethylenically unsaturated bond-containing group and a graft chain, and the graft chain includes a repeating unit p1 having an oxetane group; a film formed of the resin composition; an optical filter; a solid-state imaging element; and an image display device.

Provided is a photosensitive resin composition containing: a photopolymerizable compound (A) having an ethylenically unsaturated group; a photopolymerization initiator (B); and an inorganic filler (F), in which the photopolymerizable compound (A) having an ethylenically unsaturated group includes a photopolymerizable compound (A1) having an acidic substituent and an alicyclic structure together with an ethylenically unsaturated group, and the inorganic filler (F) includes an inorganic filler surface-treated with a coupling agent without at least one functional group selected from the group consisting of an amino group and a (meth)acryloyl group. The present disclosure also provides a photosensitive resin composition for photo via formation, and a photosensitive resin composition for interlayer insulating layer. The present disclosure further provides: a photosensitive resin film and a photosensitive resin film for interlayer insulating layer, each of which contains the photosensitive resin composition; a multilayered printed wiring board and a semiconductor package; and a method for producing a multilayered printed wiring board.

Provided is a photosensitive resin composition containing: a photopolymerizable compound (A) having an ethylenically unsaturated group; a photopolymerization initiator (B); and an inorganic filler (F), in which the photopolymerizable compound (A) having an ethylenically unsaturated group includes a photopolymerizable compound (A1) having an acidic substituent and an alicyclic structure together with an ethylenically unsaturated group, and the inorganic filler (F) includes an inorganic filler surface-treated with a coupling agent without at least one functional group selected from the group consisting of an amino group and a (meth)acryloyl group. The present disclosure also provides a photosensitive resin composition for photo via formation, and a photosensitive resin composition for interlayer insulating layer. The present disclosure further provides: a photosensitive resin film and a photosensitive resin film for interlayer insulating layer, each of which contains the photosensitive resin composition; a multilayered printed wiring board and a semiconductor package; and a method for producing a multilayered printed wiring board.

Provided are a coloring composition including a colorant, a first resin including a repeating unit represented by Formula (b-10), and a second resin different from the first resin, in which the second resin is at least one selected from a polyimide precursor, a polyimide resin, a polybenzoxazole precursor, a polybenzoxazole resin, or a polysiloxane resin; a film formed of the coloring composition; an optical filter; a solid-state imaging element; and an image display device. In Formula (b-10), Ar.sup.10 represents a group including an aromatic carboxyl group, L.sup.11 represents —COO— or —CONH—, L.sup.12 represents a trivalent linking group, and P.sup.10 represents a polymer chain.

##STR00001##

Provided are a coloring composition including a colorant, a first resin including a repeating unit represented by Formula (b-10), and a second resin different from the first resin, in which the second resin is at least one selected from a polyimide precursor, a polyimide resin, a polybenzoxazole precursor, a polybenzoxazole resin, or a polysiloxane resin; a film formed of the coloring composition; an optical filter; a solid-state imaging element; and an image display device. In Formula (b-10), Ar.sup.10 represents a group including an aromatic carboxyl group, L.sup.11 represents —COO— or —CONH—, L.sup.12 represents a trivalent linking group, and P.sup.10 represents a polymer chain.

##STR00001##

Provided is a black partition wall pattern film that comprises: a transparent substrate; an electrode layer provided on the transparent substrate; a black partition wall pattern provided on the electrode layer; and a black UV-curable resin layer provided in a region of the electrode layer where no black partition wall pattern is provided.

Provided is a black partition wall pattern film that comprises: a transparent substrate; an electrode layer provided on the transparent substrate; a black partition wall pattern provided on the electrode layer; and a black UV-curable resin layer provided in a region of the electrode layer where no black partition wall pattern is provided.

The present application relates to a compound of Chemical Formula 1, a binder resin, a negative-type photosensitive resin composition, and a display apparatus including a black bank formed using the same.

Provided are: a photosensitive resin composition including a dye containing a mixture of (A-1) a compound represented by a particular chemical formula and a shell surrounding same, (A-2) a compound represented by another particular chemical formula and a shell surrounding same, and (A-3) a compound represented by still another particular chemical formula and a shell surrounding same; a photosensitive resin film prepared using the composition; a color filter including the photosensitive resin film; and a display device including the color filter.