The present invention provides a silicone skeleton-containing polymer including a silicone skeleton shown by the following formula (1) and having a weight average molecular weight of 3,000 to 500,000.

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This can provide a silicone skeleton-containing polymer that can easily form a fine pattern with a large film thickness, and can form a cured material layer (cured film) that is excellent in various film properties such as crack resistance and adhesion properties to a substrate, electronic parts, and a semiconductor device, particularly a base material used for a circuit board, and has high reliability as a film to protect electric and electronic parts and a film for bonding substrates; and a photo-curable resin composition that contains the polymer, a photo-curable dry film thereof, a laminate using these materials, and a patterning process.

Monomers and polymers are provided that comprise a carbon alicyclic group or heteroalicyclic group that comprises 1) one or more acid-labile ring substituents and 2) one or more ether or thioether ring substituents. Photoresists that comprise such polymers also are provided.

The present invention provides a photosensitive composition which can suppress the generation of a development residue on the surface of an electrode and the corrosion of the electrode to form a black pixel division layer, and also can suppress the generation of off-pixel in an organic EL display device comprising the pixel division layer. Disclosed is a photosensitive composition comprising (a) a pigment, (b) a resin having two or more tertiary amino groups in the molecule, and (c) a photosensitive agent, wherein the component (b) contains a resin having a structure represented by the general formula (1).

Photoresist compositions may include a photosensitive polymer including a first repeating unit of Chemical Formula 1; a photoacid generator (PAG); and a solvent.

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A photoresist composition includes an alkali soluble resin, a hardening agent, a photo acid generator, and an organic solvent. The photo acid generator may be represented by Formula 1, ##STR00001##
in which L.sub.11 is selected from a single bond, a C.sub.1-C.sub.10 alkylene group, a C.sub.2-C.sub.10 alkenylene group, and a C.sub.2-C.sub.10 alkynylene group; and R.sub.11 is selected from a C.sub.6-C.sub.15 aryl group, or a C.sub.6-C.sub.15 aryl group with at least one substitutent group selected from a group comprising deuterium, a hydroxyl group, a C.sub.1-C.sub.10 alkyl group, a C.sub.1-C.sub.10 alkoxy group, and a C.sub.6-C.sub.15 aryl group.

A photosensitive resin composition for flexographic printing includes components (A) to (E) below: (A) a first styrene-butadiene-styrene block copolymer (SBS); (B) a second styrene-butadiene-styrene block copolymer (SBS); (C) a polybutadiene or a derivative thereof; (D) a photopolymerizable monomer; and (E) a photopolymerization initiator, and comprises with respect to (A), 5 to 100 wt % of (B), 10 to 40 wt % of (C), 40 to 200 wt % of (D), and 4 to 20 wt % of (E).

A radiation-sensitive resin composition includes: a first polymer having a first structural unit which includes a phenolic hydroxyl group, and a second structural unit which includes an acid-labile group and a carboxy group which is protected by the acid-labile group; a second polymer having a third structural unit represented by the following formula (S-1), and a fourth structural unit which is a structural unit other than the third structural unit and is represented by the following formula (S-2); and a radiation-sensitive acid generator, wherein the acid-labile group includes a monocyclic or polycyclic ring structure having no fewer than 3 and no more than 20 ring atoms.

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Polyarylene resins and compositions containing them are useful as underlayers in semiconductor manufacturing processes.

A radiation-sensitive resin composition includes: a first polymer having a first structural unit which includes a phenolic hydroxyl group, and a second structural unit which includes an acid-labile group and a carboxy group which is protected by the acid-labile group; a second polymer having a third structural unit represented by the following formula (S-1), and a fourth structural unit which is a structural unit other than the third structural unit and is represented by the following formula (S-2); and a radiation-sensitive acid generator, wherein the acid-labile group includes a monocyclic or polycyclic ring structure having no fewer than 3 and no more than 20 ring atoms.

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According to one embodiment, a pattern formation material includes a first monomer. The first monomer includes a first molecular chain, a first group, and a second group. The first molecular chain includes a first end and a second end. The first group has an ester bond to the first end. The second group has an ester bond to the second end. The first group is one of acrylic acid or methacrylic acid. The second group is one of acrylic acid or methacrylic acid. The first molecular chain includes a plurality of first elements bonded in a straight chain configuration. The first elements are one of carbon or oxygen. The number of the first elements is 6 or more. A film including the first monomer is caused to absorb a metal compound including a metallic element.