A negative-working photosensitive resin composition including an epoxy group-containing resin, a metal oxide, and a cationic polymerization initiator, in which a photosensitive resin film having a film thickness of 20 μm obtained by applying the negative-working photosensitive resin composition onto a silicon wafer and performing a bake treatment at 90° C. for 5 minutes has a Martens hardness of less than 235 [N/mm.sup.2], and when a viscoelasticity of a cured film, which is obtained by exposing the photosensitive resin film to i-rays at an irradiation amount of 200 mJ/cm.sup.2, performing a bake treatment after the exposure at 90° C. for 5 minutes, and then performing a bake treatment at 200° C. for 1 hour to cure the photosensitive resin film, is measured at a frequency of 1.0 Hz, a tensile elastic modulus (E*) of the cured film at a temperature of 175° C. is 2.1 [GPa] or more.

A negative photosensitive resin composition containing an epoxy group-containing resin and a cationic polymerization initiator which includes a sulfonium salt represented by General Formula (I0). In Formula (I0), R1 and R2 represent an aryl group, a heterocyclic hydrocarbon group, or an alkyl group. R3 to R5 are an alkyl group, a hydroxy group, an alkoxy group, an alkylcarbonyl group, an arylcarbonyl group, an acyloxy group, an arylthio group, an alkylthio group, an aryl group, a heterocyclic hydrocarbon group, an aryloxy group, a hydroxy(poly)alkyleneoxy group, or a halogen atom. k is an integer of 0 to 4, m is an integer of 0 to 3, and n is an integer of 1 to 4. A is a group represented by —S—, —O—, —SO—, —SO.sub.2—, or —CO—. X.sup.− represents a monovalent polyatomic anion

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This disclosure generally provides compositions with improved thermal aging resistance, crack resistance and flux compatibility, wherein the resin composition comprising: (a) an epoxy resin comprising a compound having two or more epoxy groups per molecule; (b) a binder comprising a compound having at least one carboxyl group per molecule; (c) a photopolymerization initiator; and (d) a filler composition comprising silica, talc and wollastonite.

A black light-shielding photosensitive resin composition, a black matrix, a black light-shielding film, a frame, and a filling material for a splicing area are provided. The black light-shielding photosensitive resin composition includes a resin (A), a pigment (B), a monomer (C), an initiator (D), and a solvent (E). The resin (A) includes an epoxy resin (A-1) and a resin (A-2) having an ethylenic unsaturated functional group. The pigment (B) includes black particles (B-1) and hollow particles (B-2).

Provided is a matte-like cured coating film that is provided on a substrate such as a wiring boar, in which scratches are unnoticeable. The cured coating film is a cured coating film of a curable resin composition provided on the substrate. The cured coating film satisfies Gs (20°)≤5 and Gs (85°)≥35 and has a ratio R represented by the formula R={Gs (85°)/Gs (60°)}/{Gs (60°)/Gs (20°)} ranging from 0.35 to 4.0, where Gs (20°), Gs (60°), and Gs (85°) are 20° gloss, 60° gloss, and 85° gloss on a surface of the cured coating film measured according to JIS Z 8741-1997, respectively.

A photosensitive resin composition comprising: (a) an epoxy resin, (b) a cationic polymerization initiator, (c) an anthracene derivative, and (d) an organic solvent having a carbonyl group, wherein the anthracene derivative (c) comprises at least one selected from the group consisting of compounds represented by a following formula (1) (In the formula (1), R.sup.1 and R.sup.2 each independently represents an alkyl group having 4 or more carbon atoms or an aryl group having 6 to 10 carbon atoms, R.sup.3 and R.sup.4 each independently represents an alkyl group, an alkoxy group having 4 or more carbon atoms, an amino group, an alkylamino group, an alkylsulfonyl group, or a halogen atom, and m and n each independently represents an integer of 0 to 4).

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A novolak resin including a partial structure represented by —C(CF.sub.3)H—. In addition, there are provided a photosensitive resin composition containing the above-described novolak resin and a photosensitizing agent. In addition, there is provided an epoxy resin having a partial structure represented by —C(CF.sub.3)H—. In addition, there is provided a curable resin composition containing the novolak resin or the epoxy resin. In addition, there is provided a cured substance obtained by curing the composition. In addition, there is provided a production method for a novolak resin, including reacting an aromatic compound with fluoral in a presence of an acid catalyst to produce a novolak resin having a partial structure represented by —C(CF.sub.3)H—. Further, there is provided a production method for an epoxy resin, including an epoxidation step of reacting a novolak resin having a partial structure represented by —C(CF.sub.3)H— with epihalohydrin in a presence of a base.

The present invention is directed to a permanent photoimageable compositions and the cured products thereof useful for making negative-tone, permanent photoresist relief patterns on low surface energy polymer substrates, comprising: (A) one or more alkali soluble, film forming resins or one or more film forming resins that become soluble in alkali solutions by action of an acid, (B) one or more cationic photoinitiators, (C) one or more film casting solvents, and (D) one or more fluorinated compounds. The present invention is also directed to methods of forming a permanent photoresist relief pattern on a low surface energy polymer substrate using the disclosed compositions.

There is provided a highly sensitive colorant-containing photosensitive resin composition for use in the formation of organic EL element barrier ribs. In one embodiment, the photosensitive resin composition for an organic EL element barrier rib comprises: (A) a binder resin; (B) at least one low molecular weight organic compound having a molar volume of 130 cm.sup.3/mol or less and being selected from the group consisting of aromatic carboxylic acids and compounds each having a plurality of phenolic hydroxyl groups; (C) a radiation sensitive compound; and (D) a colorant selected from the group consisting of black dyes and black pigments.

A method for manufacturing a microstructure comprising cured products of photosensitive resin compositions, the method comprising: a step of forming at least two layers of the photosensitive resin compositions each comprising a photopolymerization initiator; a step of subjecting each of the formed at least two layers of the photosensitive resin compositions to patterning exposure; and a step of collectively developing the exposed at least two layers of the photosensitive resin compositions to obtain a microstructure, wherein in the at least two layers of the photosensitive resin compositions, 90% by mass or more of the photopolymerization initiators contained in at least one of the two adjacent layers of the photosensitive resin compositions is a nonionic photopolymerization initiator.