The present invention provides a composite which can be produced by photostructuring a photostructurable matrix material in a composite formulation to form a structured matrix with nanoparticles, where the refractive index of the composite with nanoparticles differs from the refractive index of the composite without nanoparticles at one wavelength, selected from the range from 150 nm to 2000 nm by less than 0.5, said composite being hierarchically structured and comprising at least one structural unit (I) of a selected thickness (i) and structural units (II) branching from said structural unit (I) of a selected thickness (ii), wherein the thickness (ii) at the branch-off points is at most half the thickness (i). In addition, the present invention provides an improved process for the preparation of a composite comprising photostructured matrix material and nanoparticles contained therein and the use of the composite.

[Problem] To provide a negative type photosensitive composition which is capable of forming a cured film having high resolution and high light shielding properties. [Means for Solution] A negative type photosensitive composition comprising (I) an alkali-soluble resin, (II) a black colorant, (III) a polymerization initiator, and (IV) a solvent, wherein the black colorant (II) has a transmittance ratio represented by [transmittance at the wavelength of 365 nm]/[transmittance at the wavelength of 500 nm] of 1.2 more.

A photosensitive composition capable of forming a cured product with high transparency, a cured product of the photosensitive composition, and a method for producing the cured product using the photosensitive composition. In a photosensitive composition including a base component having photopolymerizability and a photopolymerization initiator, a phosphine oxide compound and an oxime ester compound as a photopolymerization initiator are used in combination such that the ratio of the mass W2 of the oxime ester compound is 35% by mass or more relative to sum of a mass W1 of the phosphine oxide compound and the mass W2 of the oxime ester compound.

A new photosensitive resin composition based on a polysiloxane, that is, a negative photosensitive resin composition is provided. A negative photosensitive resin composition includes (A) a polysiloxane compound containing a first structural unit represented by the following general formula (1), (B) a photoinduced curing accelerator, and (C) a solvent.

[(R.sup.x).sub.bR.sup.1.sub.mSiO.sub.n/2]  (1)

Provided are a coloring composition including a colorant, a first resin including a repeating unit represented by Formula (b-10), and a second resin different from the first resin, in which the second resin is at least one selected from a polyimide precursor, a polyimide resin, a polybenzoxazole precursor, a polybenzoxazole resin, or a polysiloxane resin; a film formed of the coloring composition; an optical filter; a solid-state imaging element; and an image display device. In Formula (b-10), Ar.sup.10 represents a group including an aromatic carboxyl group, L.sup.11 represents —COO— or —CONH—, L.sup.12 represents a trivalent linking group, and P.sup.10 represents a polymer chain.

##STR00001##

A siloxane polymer comprising polysiloxane, silphenylene, isocyanuric acid, and polyether skeletons in a backbone and having an epoxy group in a side chain is provided. A photosensitive resin composition comprising the siloxane polymer and a photoacid generator is coated to form a film which can be patterned using radiation of widely varying wavelength. The patterned film has high transparency and light resistance.

The present invention provides a silicone skeleton-containing polymer including a silicone skeleton shown by the following formula (1) and having a weight average molecular weight of 3,000 to 500,000.

##STR00001##

This can provide a silicone skeleton-containing polymer that can easily form a fine pattern with a large film thickness, and can form a cured material layer (cured film) that is excellent in various film properties such as crack resistance and adhesion properties to a substrate, electronic parts, and a semiconductor device, particularly a base material used for a circuit board, and has high reliability as a film to protect electric and electronic parts and a film for bonding substrates; and a photo-curable resin composition that contains the polymer, a photo-curable dry film thereof, a laminate using these materials, and a patterning process.

The invention aims to provide a photosensitive colored resin composition and a heat resistant colored resin film produced therefrom that has the function of absorbing light in the shorter visible wavelength range with high sensitivity to serve effectively as planarizing film, insulation layer, and barrier rib used in organic luminescence apparatuses and display elements and the function of reducing external light reflection. The photosensitive colored resin composition includes an alkali-soluble resin (a), a photosensitive compound (b), and a compound (c) having an absorption maximum in the wavelength range of 400 nm or more and less than 490 nm, the photosensitive compound (b) containing a photosensitive compound (b1), the photosensitive compound (b1) being such that its maximum absorption wavelength in the range of 350 nm or more and 450 nm or less is located within the wavelength range of 350 nm or more and 390 nm or less.

There is a described a patch-clamp chip for making electrical measurements on a biological sample. The patch-clamp chip comprising a plurality of layers comprising poly-dimethylsiloxane (PDMS) forming a stack. It comprises at least a chip surface layer comprising an aperture formed therethrough and which upwardly opens on the surface, where the biological sample is provided. A microfluidic channel layer comprising PDMS extends below the plane of the chip surface layer and comprises a microfluidic channel formed therein. The aperture of the chip surface layer downwardly opens on the microfluidic channel. Electrophysiological measurements are made between an internal solution in the microfluidic channel and the external solution on the chip surface. The measurements can be performed via a bottom electrode. A plurality of apertures and corresponding microfluidic channels can be provided to perform simultaneous measurements on a plurality of samples, independently.

A method of forming a three-dimensional object, wherein said three-dimensional object is an insert for use between a helmet and a human body, is described. The method may use a polymerizable liquid, or resin, useful for the production by additive manufacturing of a three-dimensional object, comprising a mixture of (i) a light polymerizable liquid first component, and (ii) a second solidifiable component that is different from said first component.