A conductive composition including a conductive polymer (A), a water-soluble polymer (B) other than the conductive polymer (A), and a solvent (C), wherein a peak area ratio is 0.44 or less, which is determined based on results of analysis performed using a high performance liquid chromatograph mass spectrometer with respect to a test solution obtained by extracting the water-soluble polymer (B) from the conductive composition with n-butanol, and calculated by formula (I):

Area ratio=Y/(X+Y)

wherein X is a total peak area of an extracted ion chromatogram prepared with respect to ions derived from compounds having a molecular weight (M) of 600 or more from a total ion current chromatogram, Y is a total peak area of an extracted ion chromatogram prepared with respect to ions derived from compounds having a molecular weight (M) of less than 600 from the total ion current chromatogram.

Lithographic apparatuses suitable for, and methodologies involving, complementary e-beam lithography (CEBL) are described. Particular embodiments are directed to implementation of an underlying absorbing and/or conducting layer for ebeam direct write (EBDW) lithography.

A conductive polymer composition containing: (A) a polyaniline-based conductive polymer having a repeating unit represented by following general formula (1); and (B) polymer having structure represented by following general formula (2). In formulae, each of R.sup.1 to R.sup.4 represents hydrogen atom, acidic group, hydroxy group, alkoxy group, carboxy group, nitro group, halogen atom, or hydrocarbon group, R.sup.5 and R.sup.6 each independently represent a hydrogen atom, linear, branched, or cyclic alkyl group having 1-10 carbon atoms or a hydrocarbon group containing a hetero atom, X.sup.a- represents anion, and “a” represents valence. An object of the invention provides a conductive polymer composition which has good filterability and film-formability of flat film on electron beam resist and can be used suitably for antistatic film for electron beam resist writing showing excellent antistatic property in electron beam writing process, and, reducing effect of acid diffused from film to minimum, and also having excellent peelability.

##STR00001##

A method for manufacturing an electroconductive pattern 40, provided with: a lamination step for laminating an acid generation film 10 containing an acid proliferation agent and a photoacid generator on a polymer film 20 containing an electroconductive polymer formed on a substrate 21; a masking step for masking the top of the acid generation film 10; a light irradiation step for irradiating the laminate from the acid-generation-film 10 side; a doping step for doping the electroconductive polymer with an acid generated and proliferated in the acid generation film 10 by the light irradiation; and a releasing step for releasing the acid generation film 10 from the polymer film 20. This method makes it possible to provide an electroconductive film and a method for manufacturing an electroconductive pattern in which photoacid generation and acid proliferation effects are utilized.

The present invention provides a conductive polymer composition which contains (A) a polyaniline-based conductive polymer having a repeating unit represented by the general formula (1), (B) a polyanion, and (C) a betaine compound, ##STR00001##
wherein R.sup.A1 to R.sup.A4 independently represent a hydrogen atom, a halogen atom, or a linear, branched, or cyclic monovalent hydrocarbon group having 1 to 20 carbon atoms and optionally containing a heteroatom; and R.sup.A1 and R.sup.A2, or R.sup.A3 and R.sup.A4 may be bonded to each other to form a ring. There can be provided a conductive polymer composition that has excellent antistatic performance and applicability, does not adversely affect a resist, and can be suitably used in lithography using electron beam or the like.

A laminated structure for use as a thy film photoresist, which includes a supporting layer, a photosensitive resin layer and a protective layer. The protective layer is a polyester film that has a maximum surface roughness between 1,500 nm and 2,500 nm, and a sheet resistance between 1×10.sup.8Ω/□ and 1×10.sup.12Ω/□. The laminated structure is particularly applicable to the manufacture of a photosensitive device and a circuit of a printed circuit board or a lead frame.

The present invention provides a conductive polymer composition which contains (A) a polyaniline-based conductive polymer having a repeating unit represented by the general formula (1), (B) a polyanion, and (C) an amino acid, ##STR00001##
wherein R.sup.A1 to R.sup.A4 independently represent a hydrogen atom, a halogen atom, or a linear, branched, or cyclic monovalent hydrocarbon group having 1 to 20 carbon atoms and optionally containing a heteroatom; and R.sup.A1 and R.sup.A2, or R.sup.A3 and R.sup.A4 may be bonded to each other to form a ring. There can be provided a conductive polymer composition that has excellent antistatic performance and applicability, dose not adversely affect a resist, and can be suitably used in lithography using electron beam or the like.

This conductive composition includes: a conductive polymer (a) having a sulfonic acid group and/or a carboxy group; a basic compound (b) having at least one nitrogen-containing heterocyclic ring and an amino group; an aqueous polymer (c) having a hydroxyl group (excluding the conductive polymer (a)); a hydrophilic organic solvent (d); and water (e).

Provided are a photosensitive composition including a polymer having a polymerizable functional group in a side chain and an ammonium compound including an ammonium cation and a carboxylate anion; a transfer film; a cured film; a laminate; a touch panel; a method for producing a polymer; and a method for producing a photosensitive composition.

Disclosed are methods of forming a pattern and methods of fabricating a semiconductor device. A method of fabricating a semiconductor device may include providing a substrate comprising a resist layer on the substrate and coating a compound on the resist layer to form a charge dissipation layer. The charge dissipation layer may include a conductive polymer and a metal complex.