Patent classifications
G03F7/165
Surface treatment of titanium containing hardmasks
A surface treatment composition and methods for improving adhesion of an organic layer on a titanium-containing hardmask includes forming a self-assembled monolayer on a surface of the titanium-containing hardmask prior to depositing the organic layer. The self-assembled monolayer is formed from a blend of alkyl phosphonic acids of formula (I): X(CH.sub.2).sub.nPOOH.sub.2 (I), wherein n is 6 to 16 and X is either CH.sub.3 or COOH, wherein a ratio of the methyl terminated (CH.sub.3) alkyl phosphonic acid to the carboxyl terminated (COOH) alkyl phosphonic acid ranges from 25:75 to 75:25.
FLOW CELLS
An example of a flow cell includes a substrate; a first primer set attached to a first region on the substrate, the first primer set including an un-cleavable first primer and a cleavable second primer; and a second primer set attached to a second region on the substrate, the second primer set including a cleavable first primer and an un-cleavable second primer.
Method for globally adjusting spacer critical dimension using photo-active self-assembled monolayer
A method of processing a substrate includes: providing structures on a surface of a substrate; depositing a self-assembled monolayer (SAM) over the structures and the substrate, the SAM being reactive to a predetermined wavelength of radiation; determining a first pattern of radiation exposure, the first pattern of radiation exposure having a spatially variable radiation intensity across the surface of the substrate and the structures; exposing the SAM to radiation according to the first pattern of radiation exposure, the SAM being configured to react with the radiation; developing the SAM with a predetermined removal fluid to remove portions of the SAM that are not protected from the predetermined fluid; and depositing a spacer material on the substrate and the structures, the spacer material being deposited at varying thicknesses based on an amount of the SAM remaining on the surface of the substrate and the structures.
LITHOGRAPHY APPARATUS WITH IMPROVED STABILITY
The present invention relates to methods for improving the resistance of lithography substrate holders to corrosion. The present invention also relates to systems comprising lithography substrate holders with improved corrosion resistance, and to methods of fabricating devices, e.g. integrated circuits, using such systems. The present invention also relates to substrates with backsides configured to preferentially corrode when used in lithography. The present invention has particular use in connection with lithographic apparatus for fabricating devices, for example integrated circuits.
METHOD OF FORMING PATTERNED STRUCTURES
Methods of forming patterned features on a surface of a substrate are disclosed. Exemplary methods include gas-phase formation of a layer comprising an oxalate compound on a surface of the substrate. Portions of the layer comprising the oxalate compound can be exposed to radiation or active species that form exposed and unexposed portions. Material can be selectively deposed onto the exposed or the unexposed portions.
MICRO AND NANO STRUCTURING OF A DIAMOND SUBSTRATE
A process of structuring a diamond substrate, comprising the steps of (a) depositing an adhesion layer on a face of the diamond substrate; (b) coating a resist layer on the adhesion layer; (c) removing parts of the resist layer so as to expose parts of the adhesion layer and form a corresponding structuring mask; (d) etching the adhesion layer and the diamond substrate (2) through the structuring mask so as to structure the diamond substrate; wherein the adhesion layer is a non-metallic compound comprising oxides.
Increasing Efficiency Of Photochemical Reactions On Substrates
Disclosed herein is a substrate which includes a functional group protected with a photolabile group covalently attached to the substrate and a film of solvent thereof covering the substrate, where the thickness of the film is less than about 100 μm. Also disclosed herein are methods of preparing such substrates. Further disclosed are methods of synthesizing polymers, methods of synthesizing arrays of polymers and methods of removing photolabile protecting groups. These methods all employ covering the substrate with a thin film of solvent where the thickness of the film is less than 100 μm.
DEPOSITION OF SEMICONDUCTOR INTEGRATION FILMS
Embodiments disclosed herein include methods of depositing a metal oxo photoresist using dry deposition processes. In an embodiment, the method comprises forming a first metal oxo film on the substrate with a first vapor phase process including a first metal precursor vapor and a first oxidant vapor, and forming a second metal oxo film over the first metal oxo film with a second vapor phase process including a second metal precursor vapor and a second oxidant vapor.
Flow cells
An example of a flow cell includes a substrate; a first primer set attached to a first region on the substrate, the first primer set including an un-cleavable first primer and a cleavable second primer; and a second primer set attached to a second region on the substrate, the second primer set including a cleavable first primer and an un-cleavable second primer.
Method for producing a fiber having a pattern on a surface thereof
A method for producing a fiber having a pattern on a surface thereof, the method including forming a resin composition layer having a linear first pattern using a resin composition; and forming a second pattern on the resin composition layer. The second pattern may be formed by forming a thin film of a block copolymer comprising at least two block chains different from each other in surface free energy on the resin composition layer and subjecting the block copolymer to microphase separation. Alternatively, the second pattern is formed by adhering particles onto the resin composition layer.