A method for manufacturing a semiconductor device includes: providing a semiconductor wafer, and acquiring surface flatness information of the semiconductor wafer; determining an exposure parameter of the semiconductor wafer according to the surface flatness information of the semiconductor wafer; and exposing the semiconductor wafer according to the exposure parameter.

Techniques for improved extreme ultraviolet (EUV) patterning using assist features, related transistor structures, integrated circuits, and systems, are disclosed. A number of semiconductor fins and assist features are patterned into a semiconductor substrate using EUV. The assist features increase coverage of absorber material in the EUV mask, thereby reducing bright field defects in the EUV patterning. The semiconductor fins and assist features are buried in fill material and a mask is patterned that exposes the assist features and covers the semiconductor fins. The exposed assist features are partially removed and the protected active fins are ultimately used in transistor devices.

Embodiments reduce or eliminate microbridge defects in extreme ultraviolet (EUV) patterning for microelectronic workpieces. A patterned layer is formed over a multilayer structure using an EUV patterning process. Protective material is then deposited over the patterned layer using one or more oblique deposition processes. One or more material bridges extending between line patterns within the patterned layer are then removed while using the protective material to protect the line patterns. As such, microbridge defects caused in prior solutions are reduced or eliminated. For one embodiment, the oblique deposition processes include physical vapor deposition (PVD) processes that apply the same or different protective materials in multiple directions with respect to line patterns within the patterned layer. For one embodiment, the removing includes one or more plasma trim processes. Variations can be implemented.

A method includes: depositing a mask layer over a substrate; directing first radiation reflected from a central collector section of a sectional collector of a lithography system toward the mask layer according to a pattern; directing second radiation reflected from a peripheral collector section of the sectional collector toward the mask layer according to the pattern, wherein the peripheral collector section is vertically separated from the central collector section by a gap; forming openings in the mask layer by removing first regions of the mask layer exposed to the first radiation and second regions of the mask layer exposed to the second radiation; and removing material of a layer underlying the mask layer exposed by the openings.

Methods include inputting an array of pixels, where each pixel in the array of pixels has a pixel dose. The array of pixels represents dosage on a surface to be exposed with a plurality of patterns, each pattern of the plurality of patterns having an edge. A target bias is input. An edge of a pattern in the plurality of patterns is identified. For each pixel which is in a neighborhood of the identified edge, a calculated pixel dose is calculated such that the identified edge is relocated by the target bias. The array of pixels with the calculated pixel doses is output. Systems for performing the methods are also disclosed.

A method for forming a mask pattern is provided, comprising forming a negative photoresist on a substrate; in an environment without oxygen, to performing a first exposure on the negative photoresist by use of a first ordinary mask plate, so that a fully-cured portion of the negative photoresist is exposed to light and a semi-cured portion and a removed portion of the negative photoresist are not exposed to light; in an environment with oxygen, performing a second exposure on the negative photoresist by use of a second ordinary mask plate, so that the semi-cured portion of the negative photoresist is exposed to light and the removed portion of the negative photoresist not exposed to light; removing the uncured negative photoresist and forming the mask pattern.

A patterning method, comprising: disposing a nanoparticle composition on a support material, the disposing being performed such that the nanoparticle composition defines a patterned region having an average inter-nanoparticle distance of less than about 5 nm; and selectively etching the support material so as to give rise to in the support material a plurality of arrayed structures substantially in register with the patterned region of the nanoparticle composition.

An article, comprising an article made according to the present disclosure.

A workpiece, comprising: an etchable support material; and a nanoparticle composition, the nanoparticle composition being disposed on the support material as a monolayer, the nanoparticle composition defining a patterned region having an average inter-nanoparticle distance of less than about 5 nm, and nanoparticles of the nanoparticle composition having ligands disposed thereon.

An article, comprising: a substrate, the substrate having formed therein a plurality of structures arranged arrayed periodically, the structures defining an average inter-structure spacing of less than about 5 nm.

A method of correcting an optical image formed by an optical system, the method including obtaining a map indicative of a polarization dependent property of the optical system across a pupil plane of the optical system for each spatial position in an image plane of the optical system, combining the map indicative of the polarization dependent property of the optical system with a radiation map of the intensity and polarization of an input radiation beam to form an image map, and using the image map to correct an optical image formed by directing the input radiation beam through the optical system.

In a method, a resin layer of a stack (e.g., resin layer over sacrificial layer over transparent substrate) is imprinted to form a convex region including first region with first height and second region with second height <first height. Stack portions are etched around the convex region to expose a substrate portion. The stack is utilized to develop a curable layer to define a cured layer over the exposed substrate portion. The convex region and cured layer are etched. The resin layer and a sacrificial layer portion underlying the second region are removed. A second substrate portion is exposed and a third substrate portion remains covered by a remaining sacrificial layer portion. The cured layer is substantially co-planar with the remaining sacrificial layer portion. A depression is formed extending to the second substrate portion. The remaining sacrificial layer portion is utilized to define functionalized layers over different depression regions.

The present invention relates to a method for etching lithium niobate, the method including a process of etching lithium niobate using a mask pattern as a physical dry etching method using Ar plasma produced in a chamber through Ar gas, wherein in the process of etching lithium niobate, a process pressure of the chamber is maintained at 1 mTorr to 20 mTorr, and a method for forming a lithium niobate pattern using the same.