Patent classifications
G03F7/701
Scatterometry System and Method for Generating Non-Overlapping and Non-Truncated Diffraction Images
A scatterometry measurement system includes an objective lens with a central obscuration and an illumination source configured to illuminate a scatterometry target through the objective lens with a first illumination beam at a first illumination angle and a second illumination beam at a second illumination angle in which the scatterometry target includes periodic structures located in at least two layers. The objective lens collects at least one diffracted order from the first illumination beam and at least one diffracted order from the second illumination beam such that the at least one diffracted order from the first illumination beam and the at least one diffracted order from the second illumination beam have a non-overlapping distribution in a portion of an imaging pupil plane not blocked by the central obscuration.
POLARIZATION-MODULATING ELEMENT, ILLUMINATION OPTICAL APPARATUS, EXPOSURE APPARATUS, AND EXPOSURE METHOD
A polarization-modulating element for modulating a polarization state of incident light into a predetermined polarization state, the polarization-modulating element being made of an optical material with optical activity and having a circumferentially varying thickness profile.
Scatterometry system and method for generating non-overlapping and non-truncated diffraction images
Scatterometry measurement systems, illumination configurations and respective methods are provided, which comprise illumination beams that have vertical projections on a target plane comprising both a parallel component and a perpendicular component, with respect to a target measurement direction. The illumination beams propagate at an angle to the plane defined by the measurement direction and a normal to the targets surface and generate diffraction images which are off-center at the imaging pupil plane. The eccentric diffraction images are spatially arranged to avoid overlaps and to correspond to measurement requirements such as spot sizes, number of required diffraction orders and so forth. The illumination beams may be implemented using illumination pupil masks, which provide a simple way to increase scatterometry measurements throughput.
Pupil facet mirror, illumination optics and optical system for a projection lithography system
In an optical system for a projection exposure apparatus, the angle space of the illumination radiation of the projection optical unit at the reticle is twice as large in a first direction as the angle space of the illuminating radiation of the illuminating optical unit.
Optical system for transferring original structure portions of a lithography mask, projection optical unit for imaging an object field in which at least one original structure portion of the lithography mask is arrangeable, and lithography mask
An optical system transfers original structure portions (13) of a lithography mask (10), which have an x/y-aspect ratio of greater than 4:1, and are aligned on the lithography mask, separated respectively by separating portions (14) that carry no structures to be imaged. The optical system transfers the original structure portions onto image portions (31) of a substrate (26). Each of the original structure portions is transferred to a separate image portion. The image portions onto which the original structure portions are transferred are arranged in a line next to one another. An associated projection optical unit may have an anamorphic embodiment with different imaging scales for two mutually perpendicular field coordinates specifically, one that is reducing for one of the field coordinates and the other is magnifying for the other field coordinates.
PUPIL FACET MIRROR, ILLUMINATION OPTICS AND OPTICAL SYSTEM FOR A PROJECTION LITHOGRAPHY SYSTEM
In an optical system for a projection exposure apparatus, the angle space of the illumination radiation of the projection optical unit at the reticle is twice as large in a first direction as the angle space of the illuminating radiation of the illuminating optical unit.
OPTICAL SYSTEM FOR TRANSFERRING ORIGINAL STRUCTURE PORTIONS OF A LITHOGRAPHY MASK, PROJECTION OPTICAL UNIT FOR IMAGING AN OBJECT FIELD IN WHICH AT LEAST ONE ORIGINAL STRUCTURE PORTION OF THE LITHOGRAPHY MASK IS ARRANGEABLE, AND LITHOGRAPHY MASK
An optical system transfers original structure portions (13) of a lithography mask (10), which have an x/y-aspect ratio of greater than 4:1, and are aligned on the lithography mask, separated respectively by separating portions (14) that carry no structures to be imaged. The optical system transfers the original structure portions onto image portions (31) of a substrate (26). Each of the original structure portions is transferred to a separate image portion. The image portions onto which the original structure portions are transferred are arranged in a line next to one another. An associated projection optical unit may have an anamorphic embodiment with different imaging scales for two mutually perpendicular field coordinates specifically, one that is reducing for one of the field coordinates and the other is magnifying for the other field coordinates.
Pupil facet mirror, illumination optics and optical system for a projection lithography system
In an optical system for a projection exposure apparatus, the angle space of the illumination radiation of the projection optical unit at the reticle is twice as large in a first direction as the angle space of the illuminating radiation of the illuminating optical unit.
PUPIL FACET MIRROR, ILLUMINATION OPTICS AND OPTICAL SYSTEM FOR A PROJECTION LITHOGRAPHY SYSTEM
In an optical system for a projection exposure apparatus, the angle space of the illumination radiation of the projection optical unit at the reticle is twice as large in a first direction as the angle space of the illuminating radiation of the illuminating optical unit.
METHOD FOR CHARACTERISING AT LEAST ONE OPTICAL COMPONENT OF A PROJECTION EXPOSURE APPARATUS
In a method for characterizing at least one optical component of a projection exposure apparatus (1), an intensity distribution of the illumination radiation (2) is detected in a field plane of the projection exposure apparatus (1) with a measuring device (31) and predicted values of an optical parameter are spatially determined therefrom over at least one predefined surface.