In one example, a computing device may include a circuit board having a contact pad disposed at an edge of the circuit board, and a chassis in which the circuit board is installed. The chassis may include a circuit board holder to engage the edge of the circuit board to retain the circuit board in a defined position relative to the chassis. The circuit board holder may be grounded. Further, the computing device may include a controller to receive a signal from the contact pad, the signal indicative of a presence of the circuit board holder contacting the contact pad. Furthermore, the controller may detect a form factor type of the chassis based on the received signal.

A screw-free device for a computer motherboard that relates to the technical field of computer-aided hardware is disclosed. The device also includes a first fixing plate, where the first fixing plate is fixedly connected with a second fixing plate through a damping spring, the side walls of a first supporting door frame and a second supporting door frame are embedded with dustproof filter screens, a clamping outer frame is bonded with a first soft cushion block, a sliding supporting block is rotatably connected with a fastening screw, a fixed supporting block and the sliding supporting block are both fixedly connected with a fastening pressure plate through a fastening spring, the fastening pressure plate is bonded with a second soft cushion block, and the supporting frame is embedded with a heat-dissipating fan and a heat-dissipating filter screen, respectively.

An adapter card with compression-attached memory modules that can be inserted into a conventional vertical connector enables use of CAMMs in systems with vertical memory module connectors. In one example, an adapter card or riser card includes a printed circuit board (PCB) having an edge to be received by a dual-inline memory module (DIMM) connector. First conductive contacts proximate to the edge of the PCB are to be received by the DIMM connector, enabling the first conductive contacts to couple with contacts of the DIMM connector. Second conductive contacts on a face of the PCB are to couple with a first compression attached memory module (CAMM) via a first compression mount technology (CMT) connector. The adapter card includes conductive traces on or in the PCB between the first conductive contacts and the second conductive contacts to couple the CAMM with the DIMM connector.

A connector includes mounting tabs that are extended relative to traditional mounting tabs. On a back side of the printed circuit board (PCB), the mounting tabs connect to a back plate. The mounting tabs extend through the PCB and connect with the back plate, which provides improved structural integrity. Depending on the connector, the use of the mounting tabs can use existing mounting holes for the connector and remove the need for additional mounting holes.

A mother substrate and a display panel including the mother substrate are disclosed. The mother substrate includes: an input pad located on an edge of the mother substrate; and a sub-substrate. A switch array and one or more signal lines connected to the switch array are arranged in a display area of the sub-substrate. One end of the signal line lead out a first test portion, and another end of the signal line is connected to the input pad and lead out a second test portion. The first test portion and the second test portion are located on different conductive layers and are insulated from each other. Partial orthographic overlapping of the first test portion is overlapped with partial orthographic overlapping of the second test portion in the non-display area.

Power conversion modules using compression mount technology (CMT) connectors and associated apparatus and methods. Assemblies include a CMT connector that includes an array of spring-loaded CMT pins or contacts that are configured to contact respective pads on a pair of printed circuit board (PCBs), such as for VR module card or power conversion module and a motherboard. The power conversion modules in combination with the CMT connectors provide several advantages, including, a common VR module/power conversion module/motherboard footprint across OEM platforms and test hardware, just in time VR module attachment for improved inventory management, removable power delivery solution makes the platform more conducive to debug, in field servicing, and platform upgradable for higher power CPU/GPU/XPU.

An air baffle structure is provided for installing a motherboard and inside a case. The case includes an opening. The air baffle structure includes a pair of brackets and an air baffle cover. The pair of brackets are fixed on the case and disposed on two sides of the opening, and the motherboard is pluggably disposed between the pair of brackets. The air baffle cover is connected to tops of the pair of brackets and straddles the pair of brackets. Therefore, the air baffle cover may effectively guide the air to pass through the motherboard to dissipate heat of the motherboard, and the quantity of fans in the case is reduced.

A display motherboard and a manufacturing method thereof are provided. The display motherboard includes a first substrate and a second substrate that are assembled, a plurality of mutually independent display devices located between the first substrate and the second substrate, a first seal, and a second seal. The first seal is provided in a peripheral area of the display motherboard, the second seal is provided in a cutting area of the display motherboard, the cutting area is located around each of the display devices, and the second seal surrounds at least one of the display devices.

An information handling system motherboard integrates components through integrated wirelines, including at least some components coupled to the motherboard on opposite sides of a narrow region, such as formed by an opening that accepts a cooling fan. A bridge circuit board couples to contacts of the motherboard on opposing sides of the narrow region so that wirelines integrated in the bridge circuit board interface motherboard wirelines, thus offering greater communication density across the narrow region.

A tray is detachably assembled to a chassis. The chassis includes a first chassis guide post. The tray includes a tray body, a handle and a first sliding piece. The tray body includes a side wall and a through slot disposed on the side wall. The handle is pivotally connected to the side wall and includes a handle guide post. The first sliding piece includes a first groove and a second groove. The handle guide post is disposed in the through slot and the first groove. The first chassis guide post is detachably disposed in the second groove.