A voltage stacked system that includes a stack of near threshold computing (NTC) chips for achieving inter-chip communication with simple wires as interconnections is disclosed. The chips include at least two secondary supply voltages and at least a secondary ground voltage electrically coupled to the stack of the chips arranged in series. The secondary supply and ground voltages are tapped in a predefined sequence at one or more predefined access points in the stack to generate two versions of an internal voltage within each of the chips. Each of the two versions of the internal voltage is a voltage difference between respective supply voltages and ground voltages, and the two have a set voltage shift such that the chips in the stack have supply voltages overlapping with those in the neighboring chips. Optionally, the two voltages are boosted to further higher voltages as needed using charge pumps.

A dual-input power supply has two power paths that connect a server to electrical Each power path has a first stage that comprises a power-factor correction circuit. The power paths share a common second stage that comprises a dc/dc converter. The first stages of the power paths collectively defining a pair of first stages that is disposed either within a package that is off the motherboard or without a package and on the motherboard. Similarly, the second stage is disposed either within a package that is off the motherboard or without a package and on the motherboard.

A power distribution system includes a plurality of power distribution modules connected to at least one power supply and configured to receive power therefrom. A power distribution bus connects the power distribution modules of the plurality of power distribution modules in parallel. The plurality of power distribution modules executes a distributed system policy management protocol over the power distribution bus to control a supply of available power from the at least one power supply to loads connected to USB charging ports of the power distribution modules.

The present disclosure relates to the field of display technology, and provides an array substrate and a display panel. The array substrate is provided with a via hole and further includes an annular wiring area. The annular wiring area is located around the via hole and is provided with an incision extending toward an outer edge of the annular wiring area along an inner edge of the annular wiring area, and at least a portion of the annular wiring area is bent toward a side away from a display side along the inner edge.

Disclosed is a technology that supplies a signal to a panel driving integrated circuit (IC). A plurality of signals having different characteristics are stably provided to a panel driving IC according to a display operation or a touch operation, by controlling capacitance connected to a transmission conduction wire.

An electronic device is provided. The electronic device includes a housing, and a flexible connecting member disposed inside the housing, the flexible connecting member including a dielectric substrate, at least one signal wire disposed on one surface of the dielectric substrate, and at least one ground disposed on the other surface of the dielectric substrate adjacent to the signal wire. The at least one signal wire and the at least one ground may be disposed to be spaced apart from each other when viewed from above the dielectric substrate. A flexible connecting member may include a dielectric substrate, a signal wire disposed on one surface of the dielectric substrate, and a ground disposed on the other surface of the dielectric substrate adjacent to the signal wire. The signal wire and the ground may be disposed to be spaced apart from each other when viewed from above the dielectric substrate.

A modular back panel assembly for a display structure comprises at least one back panel defining front face apertures. The back panel rear face is comprises at least one elongated channel aligned with the front face apertures. An elongated electrical conductor is mountable within the elongated channel and defines conductor apertures for being coaligned with the front face apertures. A display member is mountable to the back panel front face of the back panel and comprises an electrical conductor with a mounting element that is insertable within the coaligned front face and conductor apertures. An electrical assembly provides electrical power to the elongated electrical conductor. Insertion of the mounting element within the coaligned front face and conductor apertures provides for mounting the display member to the front face and for electrical communication with the electrical conductor thus allowing the elongate electrical conductor when electrically powered by the electrical assembly to provide electrical power to the display member electrical conductor.

A connector for use in a free-standing connector port for mating with an external pluggable module is disclosed. The connector has terminals that extend lengthwise of the connector so that cables may be terminated to the terminals and the terminals and cable generally are horizontally aligned together. The connector includes a housing and a pair of connecting elements that flank a card-receiving slot of the connector. The cables exit from the rear of the connector elements and from the connector port. The connector elements engage the connector port to fix the connector in place within the connector port.

Modular smartband can include a plurality of coupled modules. The plurality of modules can include at least one core module having at least one processor and at least one peripheral module. Each of the plurality of modules has a coupler end and a receiving end disposed on opposing ends of the module, the coupler end configured to be received in the receiving end of an adjacent module. At least one of the plurality of modules can include a display and at least one the plurality of modules includes a battery.

A modular power supply is disclosed. The modular power supply includes a power supply unit and an expansion unit. The expansion unit is detachably disposed on the power supply unit and located on one side of the power supply unit in a thickness direction of the modular power supply.