A memory device includes a memory die bonded to a logic die. A logic die that is bonded to a memory die via a wafer-on-wafer bonding process can receive signals indicative of input data from a global data bus of the memory die and through a bond of the logic die and memory die. The logic die can also receive signals indicative of kernel data from local input/output (LIO) lines of the memory die and through the bond. The logic die can perform a plurality of operations at a plurality of vector-vector (VV) units utilizing the signals indicative of input data and the signals indicative of kernel data.

A multi-function device is disclosed. A first port may be used to communicate with a host processor. A second port may be used to communicate with a storage device. A third port may be used to communicate with a computational storage unit. Circuit may be used to route a message from the host processor to at least one of the storage device or the computational storage unit.

A memory device includes an array of memory cells configured on a die or chip and coupled to sense lines and access lines of the die or chip and a respective sense amplifier configured on the die or chip coupled to each of the sense lines. Each of a plurality of subsets of the sense lines is coupled to a respective local input/output (I/O) line on the die or chip for communication of data on the die or chip and a respective transceiver associated with the respective local I/O line, the respective transceiver configured to enable communication of the data to one or more device off the die or chip.

A method of performing a garbage collection operation on a source block includes: performing a plurality of partial page clean operations during a series of host write operations. Each partial clean operation includes: performing a validity check process within a partitioned searching range of the source block to obtain valid page information; and performing a page clean process according to the valid page information and a target clean page number to read valid pages indicated by the valid page information.

Described herein are memory controllers for integrated circuits that implement network-on-chip (NoC) to provide access to memory to couple processing cores of the integrated circuit to a memory device. The NoC may be dedicated to service the memory controller and may include one or more routers to facilitate management of the access to the memory controller.

A method of transmitting data in a storage device includes encrypting original data based on a homomorphic encryption algorithm to generate encrypted data, generating a parameter for regeneration of a ciphertext higher than an operation level of the encrypted data by using the encrypted data and a key value, and transmitting the encrypted data and the parameter to an external host device.

PAM encoding techniques that leverage unused idle periods in channels between data transmissions to apply longer but more energy-efficient codes. To improve energy savings, multiple sparse encoding schemes may be utilized selectively to fit different sized gaps in the traffic. These approaches may provide energy reductions, for example with memory READ and WRITE traffic, when transferring 4-bit data using 3-symbol sequences.

Methods and apparatus for efficient data transmit and receive operations using polling of memory queues associated with interconnect fabric interface. In one embodiment, Non-Transparent Bridge (NTB) technology used to transact the data transmit/receive operations and a hardware accelerator card used implement a notification mechanism in order to optimize of receive queue polling are disclosed. The accelerator card comprises a notification address configured to signal the presence of data, and a notification acknowledgement region configured to store flags associated with memory receive queues. In one implementation, the interconnect fabric is based on PCIe technology, including up to very large fabrics and numbers of hosts/devices for use in ultra-high performance applications such as for example data centers and computing clusters.

According to one embodiment, a memory system includes a first compression unit, a second compression unit, a non-volatile memory, a first decoding unit, a conversion unit and an output unit. The first compression unit is configured to output second data obtained by compressing first data. The second compression unit is configured to output third data obtained by compressing the second data. Fourth data based on the third data is written to the non-volatile memory. The first decoding unit is configured to decode the third data based on the fourth data to the second data. The conversion unit is configured to acquire fifth data by converting a format of the second data. The output unit is configured to output the fifth data to a host.

An interface comprises routing circuitry configured to receive data items from a data source device and to route the received data items to a data sink device by either a first data path including a data buffer or a second data path, in response to an indication of a current state of a data sink device; the routing circuitry being configured to route the received data item by the first data path and to initiate a transition of the data sink device to a ready state in response to an indication that the data sink device is in a quiescent mode and currently not ready to receive the data item, the routing circuitry being configured to hold the data item at the buffer and to inhibit the data source device from sending further data items until the routing circuitry receives a subsequent indication that the data sink device is ready to receive the data item; and the routing circuitry being configured to route the received data item by the second data path in response to an indication that the data sink device is currently ready to receive the data item.