G06F13/4004

Scalable network-on-chip for high-bandwidth memory

Described herein are memory controllers for integrated circuits that implement network-on-chip (NoC) to provide access to memory to couple processing cores of the integrated circuit to a memory device. The NoC may be dedicated to service the memory controller and may include one or more routers to facilitate management of the access to the memory controller.

CHIP-TO-CHIP INTERFACE OF A MULTI-CHIP MODULE (MCM)

A chip-to-chip interface of a multi-chip module (MCM), including: bidirectional data links for transmitting data signals and a direction indicator bit, wherein the direction indicator bit switches a direction of the bidirectional data links in real-time; a clock link for transmitting a clock signal common to the bidirectional data links, wherein the data and clock links are comprised of conductive traces between the chips and laid out to be of substantially equal length; and a clock driver means having a digitally programmable clock signal delay.

METHOD AND APPARATUS FOR MULTI-BUS DEVICE FUSED ACCESS
20230020988 · 2023-01-19 ·

Provided are a method and apparatus for multi-bus device fused access. The method includes: receiving, by a bus, an instruction for accessing a fused node of a device, which instruction containing a matching word, an initial address, and an offset; performing matching according to the matching word and activating a fused drive; acquiring, by the fused drive, the initial address and the offset from the instruction on the bus respectively; computing an address of a first bus of the device according to the initial address, and computing an address of a second bus of the device according to the initial address and the offset; and accessing the device according to the address of the first bus so as to acquire first information, and accessing the device according to the address of the second bus so as to acquire second information.

TRANSPORT COMPONENT AUTHENTICATION

An example operation includes one or more of sending data from a component on a transport to at least one other component on the transport in at least one location on a bus, comparing the data at the at least one other component to a threshold, and sending a notification, by the at least one other component, to a processor when the data is outside the threshold.

Systems and methods for generic assurance framework

Systems and methods enable data collection and analytics consumption with a generalized assurance framework using a message bus that supports a publish-subscribe model. A producer network element subscribes to a request topic on the message bus and posts, to the message bus, an announcement indicating a data topic is available from the producer network element. The producer network element receives via the message bus, the request topic including a request for the data topic and posts, to the message bus, records for the data topic in response to the request.

CHIP HAVING DUAL-MODE DEVICE THAT SWITCHES BETWEEN ROOT COMPLEX MODE AND ENDPOINT MODE IN DIFFERENT SYSTEM STAGES AND ASSOCIATED COMPUTER SYSTEM
20230010918 · 2023-01-12 · ·

A chip includes a peripheral component interconnect express (PCIe) switch, a dual-mode device, and a signal transmission control circuit. The PCIe switch includes a first downstream port. The dual-mode device switches between a root complex (RC) mode and an endpoint (EP) mode. The signal transmission control circuit is coupled between the PCIe switch and the dual-mode device. The first downstream port communicates with the dual-mode device operating under the EP mode. The signal transmission control circuit allows an external PCIe device to communicate with the dual-mode device operating under the RC mode.

Multi-uplink device enumeration and management

A device includes a plurality of ports and a plurality of capability registers that correspond to a respective one of the plurality of ports. The device is to connect to one or more processors of a host device through the plurality of ports, and each of the plurality of ports comprises a respective protocol stack to support a respective link between the corresponding port and the host device according to a particular interconnect protocol. Each of the plurality of capability registers comprises a respective set of fields for use in configuration of the link between its corresponding port and one of the one or more processors of the host device. The fields include a field to indicate an association between the port and a particular processor, a field to indicate a port identifier for the port, and a field to indicate a total number of ports of the device.

Multi-dimensional data path architecture

Various implementations described herein are directed to a device having a multi-layered logic structure with a first logic layer and a second logic layer arranged vertically in a stacked configuration. The device may have a memory array that provides data, and also, the device may have an inter-layer data bus that vertically couples the memory array to the multi-layered logic structure. The inter-layer data bus may provide multiple data paths to the first logic layer and the second logic layer for reuse of the data provided by the memory array.

DATA RECEIVER, DISPLAY DEVICE INCLUDING THE SAME, AND METHOD OF RECEIVING DATA

A data receiver, which communicates with a data transmitter through a plurality of lanes, includes: a first reception unit which receives first data through a first lane; a second reception unit which receives second data through a second lane; and a detector which compares the first data and the second data to detect a skew between the first lane and the second lane. The first reception unit includes a first clock data recovery unit which recovers a first clock and first payload data from the first data. The first reception unit controls a loop speed of the first clock data recovery unit based on a skew level of the skew.

Multi-Dimensional Data Path Architecture

Various implementations described herein are directed to a device having a multi-layered logic structure with a first logic layer and a second logic layer arranged vertically in a stacked configuration. The device may have a memory array that provides data, and also, the device may have an inter-layer data bus that vertically couples the memory array to the multi-layered logic structure. The inter-layer data bus may provide multiple data paths to the first logic layer and the second logic layer for reuse of the data provided by the memory array.