In a wireless communication device, radiation conductors including a first and second end portions are reformed on an upper surface of a radiation conductor base material. First and second terminal electrodes are provided at a same or substantially the same interval as the first and second end portions, on a lower surface of a RFIC element. A seal includes an adhesive surface larger than a principal surface of the RFIC element. The RFIC element is arranged on the upper surface of the radiation conductor substrate so that each of the first and second terminal electrodes comes into contact with the first and second end portions. The seal is pasted to the radiation conductor substrate so as to cover the RFIC element.

In a method of producing a transponder (T1, T2, T3), a substrate (1, 91) is provided. The substrate (9, 91) comprises a first area (2), a second area (3) adjacent to the first area (2), and a first electric contact (8, 98) adjacent to the second area (3). An electric device (50, 80) is placed in or on the first area (2), preferably without touching the first electric contact (8, 98). Subsequently, a conductive glue (12) is applied on the second area (3) and on the first electric contact (8, 98) so that the conductive glue (12) electrically couples the first electric contact (8, 98) with the electric device (50, 80).

An RFID device includes an antenna defining a gap, with an RFID strap electrically coupled to the antenna across the gap. The RFID strap is secured to the antenna by a self-adhesive substance, such as a pressure-sensitive adhesive, an isotropic conductive adhesive, or an anisotropic conductive adhesive. The use of a self-adhesive substance allows for such an RFID device to be assembled at facilities other than dedicated RFID device manufacturing facilities, which may include a packaging supplier factory. Additionally, such an RFID device allows for the creation of a flexible “build on demand” system capable of producing a smaller number of RFID devices than are typically produced using conventional approaches. Such a system may further test, program, apply print to, and/or cut an RFID device that it has assembled.

RFID tags are provided for incorporation into the packaging of a microwavable food item, with the RFID tag being configured to be safely microwaved. The RFID tag includes an antenna defining a gap and configured to operate at a first frequency. An RFID chip is electrically coupled to the antenna across the gap. A shielding structure is electrically coupled to the antenna across the gap and overlays the RFID chip. The shielding structure includes a shield conductor and a shield dielectric at least partially positioned between the shield conductor and the RFID chip. The shielding structure is configured to limit the voltage across the gap when the antenna is exposed to a second frequency that is greater than first frequency. In additional embodiments, RFID tags are provided for incorporation into the packaging of a microwavable food item, with the RFID tag being configured to be safely microwaved. The RFID tag includes an RFID chip and an antenna electrically coupled to the RFID chip. The antenna may have a sheet resistance in the range of approximately 100 ohms to approximately 230 ohms, optionally with an optical density in the range of approximately 0.18 to approximately 0.29. Alternatively, or additionally, the antenna may be configured to fracture into multiple pieces upon being subjected to heating in a microwave oven. Alternatively, or additionally, the RFID tag may be incorporated in an RFID label that is secured to the package by a joinder material with a greater resistance than that of the antenna, such as a sheet resistance in the range of approximately 100 ohms to approximately 230 ohms.

A wireless communication device is provided that includes an RFIC module in which an RFIC chip and first and second terminal electrodes are incorporated, and an antenna member including an antenna base material and antenna patterns including first and second coupling portions. The RFIC module and the antenna member are bonded to each other via an insulating first adhesive layer. Between the first terminal electrode and the first coupling portion and between the second terminal electrode and the second coupling portion, a distance t1 from a surface of the RFIC module in contact with the first adhesive layer to the first and second terminal electrodes is larger than a thickness t2 of the first adhesive layer.

RFID inlays or straps may be assembled using impulse heating of metal precursors. Metal precursors are applied to and/or included in contacts on an RFID IC and/or terminals on a substrate. During assembly of the tag, the IC is disposed onto the substrate such that the IC contacts physically contact either the substrate terminals or metal precursors that in turn physically contact the substrate terminals. Impulse heating is then used to rapidly apply heat to the metal precursors, processing them into metallic structures that electrically couple the IC contacts to the substrate terminals.

RFID tags are provided for incorporation into the packaging of a microwavable food item, with the RFID tag being configured to be safely microwaved. The RFID tag includes an antenna defining a gap and configured to operate at a first frequency. An RFID chip is electrically coupled to the antenna across the gap. A shielding structure is electrically coupled to the antenna across the gap and overlays the RFID chip. The shielding structure includes a shield conductor and a shield dielectric at least partially positioned between the shield conductor and the RFID chip. The shielding structure is configured to limit the voltage across the gap when the antenna is exposed to a second frequency that is greater than first frequency. In additional embodiments, RFID tags are provided for incorporation into the packaging of a microwavable food item, with the RFID tag being configured to be safely microwaved. The RFID tag includes an RFID chip and an antenna electrically coupled to the RFID chip. The antenna may have a sheet resistance in the range of approximately 100 ohms to approximately 230 ohms, optionally with an optical density in the range of approximately 0.18 to approximately 0.29. Alternatively, or additionally, the antenna may be configured to fracture into multiple pieces upon being subjected to heating in a microwave oven. Alternatively, or additionally, the RFID tag may be incorporated in an RFID label that is secured to the package by a joinder material with a greater resistance than that of the antenna, such as a sheet resistance in the range of approximately 100 ohms to approximately 230 ohms.

A radio frequency identification (RFID) switch tag is disclosed. This RFID switch tag includes a base component having an ultra-high frequency (UHF) booster, and a detachable component having at least one UHF RFID module and a high frequency (HF) RFID module. In some embodiments, the detachable component is positioned in close proximity to the base component in a first configuration of the RFID switch tag such that the at least one UHF RFID module is sufficiently coupled to the UHF booster in the base component to form an UHF RFID system having a desired performance. The detachable component can also be separated from the base component to obtain a second configuration of the RFID switch tag, and the HF RFID module remains functional within the detached detachable component so that the detachable component can be used as a standalone HF RFID tag.

RFID tags are provided for incorporation into the packaging of a microwavable food item, with the RFID tag being configured to be safely microwaved. The RFID tag includes an antenna defining a gap and configured to operate at a first frequency. An RFID chip is electrically coupled to the antenna across the gap. A shielding structure is electrically coupled to the antenna across the gap and overlays the RFID chip. The shielding structure includes a shield conductor and a shield dielectric at least partially positioned between the shield conductor and the RFID chip. The shielding structure is configured to limit the voltage across the gap when the antenna is exposed to a second frequency that is greater than first frequency. In additional embodiments, RFID tags are provided for incorporation into the packaging of a microwavable food item, with the RFID tag being configured to be safely microwaved. The RFID tag includes an RFID chip and an antenna electrically coupled to the RFID chip. The antenna may have a sheet resistance in the range of approximately 100 ohms to approximately 230 ohms, optionally with an optical density in the range of approximately 0.18 to approximately 0.29. Alternatively, or additionally, the antenna may be configured to fracture into multiple pieces upon being subjected to heating in a microwave oven. Alternatively, or additionally, the RFID tag may be incorporated in an RFID label that is secured to the package by a joinder material with a greater resistance than that of the antenna, such as a sheet resistance in the range of approximately 100 ohms to approximately 230 ohms.

RFID inlays or straps may be assembled using impulse heating of metal precursors. Metal precursors are applied to and/or included in contacts on an RFID IC and/or terminals on a substrate. During assembly of the tag, the IC is disposed onto the substrate such that the IC contacts physically contact either the substrate terminals or metal precursors that in turn physically contact the substrate terminals. Impulse heating is then used to rapidly apply heat to the metal precursors, processing them into metallic structures that electrically couple the IC contacts to the substrate terminals.