In some embodiments, an RFID device may include a multilayer reactive strap having a first substrate, a first conductor portion, a second conductor portion, and a first connection. The first conductor portion may enclose a first area and may be disposed on a first side of first substrate. A second conductor portion may enclose a second area and may be disposed on a second side of the first substrate. A first connection may couple the first conductor portion and the second conductor portion together, and may thereby form a multiturn coil that includes both the first conductor portion and the second conductor portion.

In some embodiments, a method of manufacturing a radio frequency identification (RFID) tag on a target surface of a non-planar object may be provided. The method may include positioning an antenna on the target surface of the non-planar object, positioning a reactive RFID strap on the target surface, and coupling the reactive RFID strap to the antenna to induce an antenna response.

An inlay for a chip card. The inlay includes a module coupling antenna for inductively coupling to a chip module antenna of a chip module and a card reader coupling antenna for inductively coupling to a reader antenna of an external card reader. The card reader coupling antenna is electrically connected to the module coupling antenna. The inlay also includes a chip capacitor module that is electrically connected to the card reader coupling antenna for enabling the card reader coupling antenna to resonate at a predetermined frequency. The chip capacitor module includes at least one passive component for storing electrical energy. The at least one passive component has a capacitance within a range from 40 picofarads to 140 picofarads and a major area that is smaller than 2.6 square millimetres.

Dual-mode RFID devices are provided with an integrated dual-mode RFID strap including either a UHF/HF dual-mode RFID chip or the combination of a UHF RFID chip and an HF RFID chip. An HF antenna and a UHF antenna are both coupled to the integrated dual-mode RFID strap, with the UHF antenna being formed by an approach other than etching, such as a cutting or printing operation, thereby reducing the cost to manufacture the device. If a pair of chips is employed, one of the chips may have a greater thickness than the other chip, which allows for the thicker chip to be incorporated into the device after the thinner chip without requiring a minimum separation between the two chips due to the size of a thermode used to secure the chips. Additionally, the first chip may be tested before securing the second chip, thereby limiting the cost of a rejected device.

A circuit module is provide that includes a substrate including a first surface and a second surface that are opposite to each other, an IC mounted on the first surface of the substrate, a circuit disposed on the first surface and the second surface of the substrate with a conductor pattern obtained by heat curing of conductive paste, and connected between the IC and an external circuit, and a dummy conductor pattern obtained by heat curing of the conductive paste, disposed on at least one of the first surface and the second surface of the substrate, and configured to maintain a balance of the conductive paste on the first surface and the second surface of the substrate.

In some embodiments, a radio frequency identification (RFID) device may include a reactive strap may include a conductor enclosing an area and an RFID chip connected to the conductor, the conductor enclosing an area and defining a first opening, and a flexible substrate attached to the conductor and defining a second opening. The first and second openings together may define a passage through both the conductor and the flexible backing material.

An RFID device includes an antenna that is formed so as to control the optical properties of the RFID device, which may include minimizing the amount of light that will be transmitted through the RFID device or allowing for the passage of a predetermined amount of light therethrough. The RFID device includes a conductive material associated with a substrate. The conductive material includes an antenna and a periphery. An RFID chip is electrically coupled to the antenna, but not to the periphery. The antenna may be defined by a cutting or etching or printing process. A gap between the antenna and the periphery may be on the order of approximately 25 μm-200 μm (if the transmission of light through the RFID device is to be minimized) or greater in at least one section (if the passage of a predetermined amount of light through the RFID device would be desirable).

An RFID device includes a substrate and a lead frame secured to the substrate. The lead frame includes a pair of connection pads formed of a conductive material. An RFID chip and an antenna are electrically coupled to the lead frame. The width of the lead frame is substantially equal to the height of the lead frame. The connection pads of the lead frame may be oriented, among other options, along a direction parallel to a height of the substrate or along a direction parallel to a width of the substrate.

RFID inlays or straps may be assembled using impulse heating of metal precursors. Metal precursors are applied to and/or included in contacts on an RFID IC and/or terminals on a substrate. During assembly of the tag, the IC is disposed onto the substrate such that the IC contacts physically contact either the substrate terminals or metal precursors that in turn physically contact the substrate terminals. Impulse heating is then used to rapidly apply heat to the metal precursors, processing them into metallic structures that electrically couple the IC contacts to the substrate terminals.

A radio frequency identification (RFID) switch tag is disclosed. This RFID switch tag includes a base component having an ultra-high frequency (UHF) booster, and a detachable component having at least one UHF RFID module and a high frequency (HF) RFID module. In some embodiments, the detachable component is positioned in close proximity to the base component in a first configuration of the RFID switch tag such that the at least one UHF RFID module is sufficiently coupled to the UHF booster in the base component to form an UHF RFID system having a desired performance. The detachable component can also be separated from the base component to obtain a second configuration of the RFID switch tag, and the HF RFID module remains functional within the detached detachable component so that the detachable component can be used as a standalone HF RFID tag.