In one embodiment, an RFID device is disclosed that contains a first conductive structure and a second conductive structure formed from multiple conductive materials configured to move between a first operating condition and a second operating condition when exposed to an event or other stimuli. The second conductive structure is initially operatively coupled to the first conductive structure in the first operating condition. However, after exposure to the event, the first conductive structure is altered to change the behavior of the RFID device. The RFID device is attachable to a substrate, such as a garment or a fabric, and the event may be a single or multiple occurrence event, such as washing, stretching, heating, or exposure of the RFID device to electrical signals.

In some embodiments, a method of manufacturing a radio frequency identification (RFID) tag on a target surface of a non-planar object may be provided. The method may include positioning an antenna on the target surface of the non-planar object, positioning a reactive RFID strap on the target surface, and coupling the reactive RFID strap to the antenna to induce an antenna response.

Various embodiments of RFID switch devices are disclosed herein. Such RFID switch devices advantageously enable manual activation/deactivation of the RF module. The RFID switch device may include a RF module with an integrated circuit adapted to ohmically connect to a substantially coplanar conductive trace pattern, as well as booster antenna for extending the operational range of the RFID device. The operational range of the RFID switch device may be extended when a region of the booster antenna overlaps a region of the conductive trace pattern on the RF module via inductive or capacitive coupling. In some embodiments, all or a portion of the booster antenna may at least partially shield the RF module when the RFID switch device is in an inactive state.

The present invention relates to a method of manufacturing a metal foil laminate which may be used for example to produce an antenna for a radio frequency (RFID) tag, electronic circuit, photovoltaic module or the like. A web of material is provided to at least one cutting station in which a first pattern is generated in the web of material. A further cutting may occur to create additional modifications in order to provide additional features for the intended end use of the product. The cutting may be performed by a laser either alone or in combinations with other cutting technologies.

In a wireless communication card and a manufacturing method thereof according to an embodiment of the present invention, the method comprises the steps of: processing an antenna inlay layer including an antenna coil; stacking a first overlay layer that covers a top surface of the antenna inlay layer; processing a PVC insert inserted in a chip-on-board (COB) accommodation space, which is formed by milling a specific area of the first overlay layer, and provided with an accommodation groove in which a lower portion of a pad of the COB is supported; passing both ends of the antenna coil drawn out from the antenna inlay layer through the PVC insert, and connecting the antenna coil to contact areas of the COB; and mounting the COB in the PVC insert inserted in the COB accommodation space.

Aspects of the present disclosure includes a method of manufacturing a radio frequency identification (RFID) tag, including connecting a first wire and a second wire across a chip, maintaining the spaced apart distance between the first wire and the second wire adjacent to each side of the chip to define a spaced apart segment of the first wire and the second wire that forms part of an inductive loop, connecting the first wire and the second wire at each side of the chip distal from and adjacent to the spaced apart segment of the first wire and the second wire to close the inductive loop, define connected wire segments, and to form an RFID assembly, and moving the RFID assembly through a casing material at or above a glass transition temperature of the casing material to encase the RFID assembly.

It is described an RF communication device comprising: i) an RF antenna functionality; ii) at least one antenna pad connected to the RF antenna functionality; iii) a further functionality which is not an RF antenna functionality; and iv) at least one non-antenna pad electrically connected to the further functionality.

The antenna pad and the non-antenna pad are arranged to be short-circuited with each other, and the non-antenna pad is electrically connected via a connection line to the further functionality within the RF communication device.

Further, a method of manufacturing an RF communication device is described.

A radio frequency identification (RFID) tag. In one embodiment, an RFID tag includes an integrated circuit die. The integrated circuit die includes circuitry configured to store information and transmit the stored information responsive to reception of a radio frequency (RF) signal. The integrated circuit die also includes an antenna coupled to the circuitry. The antenna is formed as a loop antenna array configured to transmit and receive RFID signals. Further, the RFID tag includes a first test pad and second test pad formed on the integrated circuit die with the first test pad coupled to a first end of the antenna by a first interconnect and a second test pad coupled to the second end of the antenna by a second interconnect.

A metal smartcard (SC) having a transponder chip module (TCM) with a module antenna (MA), and a card body (CB) comprising two discontinuous metal layers (ML), each layer having a slit (S) overlapping the module antenna, the slits being oriented differently than one another. One metal layer can be a front card body (FCB, CF1), and the other layer may be a rear card body (RCB, CF2) having a magnetic stripe (MS) and a signature panel (SP). The slits in the metal layers may have non-linear shapes.

A method for manufacturing a smart card capable of achieving excellent connection reliability and bending resistance, a smart card, and a conductive particle-containing hot-melt adhesive sheet. A conductive particle-containing hot-melt adhesive sheet containing solder particles of a non-eutectic alloy in a binder containing a crystalline polyamide having a carboxyl group is interposed between a card member and an IC chip and subjected to thermocompression bonding. The crystalline polyamide having a carboxyl group improves the solder wettability of the non-eutectic alloy, thereby achieving excellent connection reliability. This effect is considered to be a flux effect due to the carboxyl group present in the crystalline polyamide, and as a result, it is possible to prevent the decrease in the elastic modulus of the adhesive layer which would be caused by the addition of a flux compound and to achieve excellent bending resistance.