One feature pertains to an acoustic attenuation device. The acoustic attenuation device comprises a fan assembly, the fan assembly including at least one fan module that directs airflow in at least one direction, wherein the at least one fan module includes a top surface and a bottom surface, a plurality of air deflectors mounted to the top surface and the bottom surface of the at least one fan module, wherein the plurality of air deflectors include a plurality of surfaces, and wherein at least one of the plurality of surfaces is an angled surface that redirects the airflow 90-degrees, and acoustic attenuating foam, wherein the acoustic attenuating foam has a two-dimensional (2-D) surface and is applied to interior surfaces of the plurality of surfaces.

A computer program product for acclimating at least one electronic data storage library component for insertion or removal from an electronic data storage library, the computer program product comprising: one or more computer readable storage media, and program instructions collectively stored on the one or more computer readable storage media. The program instructions include program instructions to insert at least one data storage library component into an acclimation device; to monitor at least one environmental condition within the acclimation device; to determine if the at least one environmental condition within the acclimation device meets a predetermined threshold; to adjust the at least one environmental condition within the acclimation device; and to remove the at least one electronic data storage library component from the acclimation device in response to determining that the at least one environmental condition within the acclimation device meets the predetermined threshold.

A server system comprises a deck, a front panel arranged on the deck and defining a collecting space; two doors arranged on opposite sides of the deck, and being perpendicular to the front panel; two receiving frame structures arranged between the doors in a back to back arrangement, and configured to receive multiple rows and columns of a plurality of storage drives horizontally, wherein two periphery corridors are each defined between one of the doors and one of the receiving frame structure facing the one door; two circuit boards arranged between the two receiving frame structures, wherein the two circuit boards comprise a plurality of slits, wherein a central corridor is defined between the two circuit boards; a storage cover disposed above the deck over the two periphery corridors, the central corridor, the two receiving frame structures, and the two circuit boards.

A system for storing data includes a discrete cooling module that can enable discrete cooling of mass storage devices installed in the chassis interior of a data storage module coupled to a rack. The discrete cooling module includes an air moving device and an air cover. The air moving device can induce and airflow through the chassis interior of the data storage module to remove heat from heat producing components of mass storage devices installed in the chassis interior. The air cover directs the airflow through the chassis interior. The discrete cooling module can isolate rotational vibrations generated by the air moving device from the mass storage devices installed in the chassis. Partial isolation can include indirectly coupling the discrete cooling module to the chassis via directly coupling with the rack.

A fan management system includes a chassis housing a storage fan system, a storage system cooled by the storage fan system, computing fan subsystems, and computing devices cooled by respective ones of the computing fan subsystems. Each of the computing devices detects a multi-computing-device configuration that includes the computing devices and, in response, determines a computing device chassis location for that computing device. Each computing device then receives fan inventory information that describes the storage fan system and the computing fan subsystems, distinguishes between the storage fan system and the computing fan subsystems based on the fan inventory information, identifies the computing fan subsystem that is configured to cool that computing device based on the computing device chassis location for that computing device, manages the computing fan subsystem that is configured to cool that computing device, and ignores the others of the computing fan subsystems.

This disclosure provides storage chassis including base storage sub-assemblies and partitions. Base includes bottom plate, top plate, first side plate and second side plate. Front side of bottom plate is opposite to back side of bottom plate. Bottom plate is located opposite to top plate. First side plate is located opposite to second side plate. First side plate and second side plate are connected to and located between bottom plate and top plate. Storage sub-assemblies are movably disposed between first side plate and second side plate. Partitions are disposed between first side plate and second side plate. Opposite ends of each partition are respectively connected to top plate and bottom plate. Partitions separate storage sub-assemblies from one another so that storage sub-assemblies are respectively located in airflow channels that are independent to one another.

This disclosure relates to a server including a storage chassis, a tray, a hard disk, a bracket, and a fan. The storage chassis includes a bottom plate and two sidewalls. The sidewalls respectively stand at two opposite sides of the bottom plate The bottom plate has a front edge and a rear edge that are opposite to each other and located between the sidewalls. The tray is slidably disposed on the storage chassis. The hard disk is disposed on the tray. The bracket is connected to the rear edge of the storage chassis. At least part of the bracket is located at a side of the rear edge of the storage chassis away from the front edge. The fan is disposed in the bracket, and the fan is electrically connected to the hard disk.

An enclosure for receiving a plurality of storage components is provided. The enclosure includes a deck, a top cover, a front panel, a stress distributing member, and a pair of component housings. The front panel is disposed between the deck and the top cover disposed over the deck. The stress distributing member traverses an entire width of the deck and is fastened to the deck and the top cover. A front section is defined between the front panel and the stress distributing member. The component housings are arranged in the front section. Each of the component housings has a front end facing outward the enclosure and a back end facing inward the enclosure. Each of the component housings is configured to receive at least a set of one or more of the storage components, and ends of the stress distributing member extend beyond the front ends of the component housings.

A computer-implemented method is provided for cooling hard disk drives (HDDs). The method may include determining a threshold fan speed for one or more fans that provide cooling for HDDs based upon a target HDD vibration performance. The method may also include controlling the one or more fans, by a controller, to alternately run at a first fan speed for a first period and at the threshold fan speed for a second period, when the one or more fans reach the threshold fan speed. The first fan speed is higher than the threshold fan speed.

A controller and a rectangular parallelepiped power supply apparatus are coupled to a rear surface of a midplane, to which a plurality of storage media drives are coupled in a front surface of the midplane. A plurality of interface connectors arranged in a left-right direction are provided at a front end of a controller substrate. The rear surface of the midplane includes a plurality of connectors for controller, which are a plurality of connectors arranged in the left-right direction to which interface connectors of the controller are respectively coupled, and a connector for power supply, which are connectors to which a power supply apparatus set horizontally is coupled. A part of a row of the connectors for controller is present below the power supply apparatus coupled sideways to the connector for power supply.