A non-volatile memory device, described herein, comprises: a plurality of memory strings and at least one control circuit in communication with the non-volatile memory cell array. The at least one control circuit is configured to perform, for the plurality of memory strings, one erase-verify iteration in an erase operation including determining whether at least one memory string of the plurality of memory strings passes an erase-verify test. The at least one control circuit is configured to, if the at least one memory string passes the erase-verify test, inhibit the at least one memory string for erase including ramping up, to an erase voltage, of a voltage applied to a gate of a SGD transistor of the at least one memory string and to perform a next erase-verify iteration in the erase operation for remaining memory strings of the plurality of memory strings other than the at least one memory string.

An antifuse-type one time programming memory cell includes a select device, a following device and an antifuse transistor. A first terminal of the select device is connected with a bit line. A second terminal of the select device is connected with a first node. A select terminal of the select device is connected with a word line. A first terminal of the following device is connected with the first node. A second terminal of the following device is connected with a second node. A control terminal of the following device is connected with a following control line. A first drain/source terminal of the antifuse transistor is connected with the second node. A gate terminal of the antifuse transistor is connected with an antifuse control line. A second drain/source terminal of the antifuse transistor is in a floating state.

The present technology relates to an electronic device. A memory device that controls a voltage applied to each line to prevent or mitigate a channel negative boosting phenomenon during a sensing operation includes a memory block connected to a plurality of lines, a peripheral circuit configured to perform a sensing operation on selected memory cells connected to a selected word line among the plurality of lines, and control logic configured to control voltages applied to drain select lines, source select lines, and word lines between the drain select lines and the source select lines among the plurality of lines, during the sensing operation and an equalizing operation performed after the sensing operation. The control logic controls a voltage applied to an unselected drain select line according to whether a cell string is shared with a selected drain select line among the drain select lines, during the sensing operation.

A semiconductor memory cell includes a floating body region configured to be charged to a level indicative of a state of the memory cell; a first region in electrical contact with said floating body region; a second region in electrical contact with said floating body region and spaced apart from said first region; and a gate positioned between said first and second regions. The cell may be a multi-level cell. Arrays of memory cells are disclosed for making a memory device. Methods of operating memory cells are also provided.

A memory device includes a common source line, a memory cell array, bit lines, and a conductive layer. The common source line is formed on a substrate. The memory cell array is formed on the common source line. The bit lines are connected to the memory cell array. The conductive layer is formed over the bit lines. In an erase operation, the memory device increases a voltage of the bit lines to an erase voltage through capacitive coupling by increasing a voltage applied to the conductive layer.

The present subject matter relates to an integrated circuit comprising an erasable programmable read only memory (EPROM) array having a plurality of EPROM cells disposed in rows and columns, wherein one or more EPROM cells located at predetermined positions in the EPROM array are selectively dischargeable. The one or more EPROM cells comprise a EPROM transistor having a first conductive layer to store electrons upon the EPROM transistor being programmed and a control metal oxide semiconductor field-effect transistor (MOSFET) electrically connected to the first conductive layer to provide an electron leakage path to dissipate the electrons stored in the first conductive layer in a predetermined leak time period.

A memory array comprising a word line and a bit line is disclosed. Each of a plurality of memory cells of the memory array has a first terminal connected to the bit line and a current path between the first terminal and a respective second terminal. A first memory cell of the plurality of memory cells has the second terminal coupled to receive a first supply voltage when selected by the word line. A second memory cell of the plurality of memory cells has the second terminal coupled to receive a voltage different from the first supply voltage when the first memory cell is selected by the word line.

A method includes identifying a target plane in respective planes of a memory die in a non-volatile memory array and identifying, from blocks of non-volatile memory cells coupled to a common bit line in the target plane, at least one target block in the target plane. The method further includes performing an operation to disable at least one gate associated with the at least one target block to prevent access to the blocks of non-volatile memory cells coupled to the common bit line in the target plane.

Provided herein may be a memory device and a method of operating the same. The memory device may include a plurality of memory cells, a program operation performer configured to perform a plurality of program loops on the plurality of memory cells, a step voltage calculator configured to calculate a step voltage, the step voltage being a difference of magnitude between program voltages that are applied in any two consecutive program loops, a reference bit determiner configured to determine a reference number of fail bits based on a magnitude of the step voltage, and a verification result generator configured to generate verification result information based on a result of a comparison between the reference number of fail bits and a number of on-cells, among the plurality of memory cells, identified in a verify operation that is included in a program loop, among the plurality of program loops.

A memory device includes unselected sub-block, which includes bit line; drain select (SGD) transistor coupled with bit line; a source voltage line; source select (SGS) transistor coupled with source voltage; and wordlines coupled with gates of string of cells, which have channel coupled between the SGS/SGD transistors. Control logic coupled with unselected sub-block is to: cause the SGD/SGS transistors to turn on while ramping the wordlines from a ground voltage to a pass voltage associated with unselected wordlines in preparation for read operation; cause, while ramping the wordlines, the channel to be pre-charged by ramping voltages on the bit line and the source voltage line to a target voltage that is greater than a source read voltage level; and in response to wordlines reaching the pass voltage, causing the SGD and SGS transistors to be turned off, to leave the channel pre-charged to the target voltage during the read operation.