An operating method of a memory device includes storing position information regarding a codeword including an erasure and erasure information including position information regarding the erasure in a memory region, loading the position information regarding the codeword to a row decoder and a column decoder, determining whether a read address corresponding to a read instruction is identical to the position information regarding the codeword including the erasure, in response to the read instruction from a host, transmitting the position information of the erasure to an error correction code (ECC) decoder, when the read address is identical to the position information regarding the codeword including the erasure, and correcting, by the ECC decoder, an error in a codeword received from a memory cell array using the position information regarding the erasure.

A memory device is disclosed. The memory device includes a plurality of memory cells, each of the memory cells including an access transistor and a resistor coupled to each other in series. The resistors of the memory cells are each formed as one of a plurality of interconnect structures disposed over a substrate. The access transistors of the memory cells are disposed opposite a first metallization layer containing the plurality of interconnect structures from the substrate.

A memory device includes a plurality of magnetoresistive random-access memory (MRAM) cells including a first one-time programmable (OTP) MRAM cell. A first OTP select transistor is connected to the first OTP MRAM cell. The first OTP select transistor configured to selectively apply a breakdown current to the first OTP MRAM cell to write the first OTP MRAM cell to a breakdown state.

A memory device includes a plurality of magnetoresistive random-access memory (MRAM) cells including a first one-time programmable (OTP) MRAM cell. A first OTP select transistor is connected to the first OTP MRAM cell. The first OTP select transistor configured to selectively apply a breakdown current to the first OTP MRAM cell to write the first OTP MRAM cell to a breakdown state.

Disclosed is a memory device which includes a memory core that includes a plurality of memory cells, and control logic that receives a first active command and a first row address from an external device and activates memory cells corresponding to the first row address from among the plurality of memory cells in response to the first active command. The control logic includes registers and counters. The control logic records the first row address in one of the registers, counts an activation count of the first row address by using a first counter of the counters, and counts a lifetime count of the first row address by using a second counter of the counters.

A semiconductor circuit and semiconductor device for determining status of a fuse element are provided. The semiconductor circuit includes a configurable reference resistor unit with a first terminal receiving a first power signal and a second terminal electrically coupled to the fuse element. The semiconductor circuit also includes a latch circuit for reading a first status signal of a first node between the configurable reference resistor unit and the fuse element. The configurable reference resistor unit includes a first resistor, a first transistor connected in parallel with the first resistor, and a first configurable unit connected to a gate of the first transistor. The first configurable unit is configured to generate a first configurable signal to be provided to the gate of the first transistor.

The present disclosure provides a method for determining status of a fuse element of a memory device. The method includes providing the memory device including a first terminal and a second terminal and applying a first power signal on the first terminal of the semiconductor device. The memory device includes a configurable reference resistor unit electrically coupled to the fuse element. The method also includes obtaining an evaluation signal at the second terminal of the memory device and identifying the evaluation signal to determine whether the memory device is redundant. The configurable reference resistor unit includes a first resistor, a first transistor connected in parallel with the first resistor, and a first configurable unit connected to a gate of the first transistor. The first configurable unit is configured to generate a first configurable signal to turn on the first transistor.

In some aspects of the present disclosure, a memory device is disclosed. In some aspects, the memory device includes a plurality of memory cells arranged in a plurality of rows and a plurality of columns; a plurality of word lines, each of the word lines coupled to a corresponding row of the memory cells; a plurality of bit lines, each of the bit lines coupled to a corresponding column of the memory cells; and a plurality of second word lines, each of the second word lines coupled to a corresponding column of the memory cells.

A semiconductor device includes first nanostructures vertically separated from one another, a first gate structure wrapping around each of the first nanostructures, and second nanostructures vertically separated from one another. The semiconductor device also includes a second gate structure wrapping around the second nanostructures, a first drain/source structure coupled to a first end of the first nanostructures, a second drain/source structure coupled to both of a second end of the first nanostructures and a first end of the second nanostructures, and a third drain/source structure coupled to a second end of the second nanostructures. The first drain/source structure has a first doping type, the second and third drain/source structures have a second doping type, and the first doping type is opposite to the second doping type.

Memory devices, systems including memory devices, and methods of operating memory devices and systems are provided, in which at least a subset of a non-volatile memory array is configured to behave as a volatile memory by erasing or degrading data in the event of a changed power condition such as a power-loss event, a power-off event, or a power-on event. In one embodiment of the present technology, a memory device is provided, comprising a non-volatile memory array, and circuitry configured to store one or more addresses of the non-volatile memory array, to detect a changed power condition of the memory device, and to erase or degrade data at the one or more addresses in response to detecting the changed power condition.