Patent classifications
G11C2013/0042
SEMICONDUCTOR STORAGE DEVICE
According to one embodiment, a semiconductor storage device includes a memory cell, a bit line connected to the memory cell, and a sense circuit connected to the bit line, wherein the sense circuit includes a first transistor with a first end connected to the bit line, a second transistor with a first end connected to a second end of the first transistor, a third transistor with a first end connected to the bit line, a fourth transistor with a first end connected to a second end of the third transistor, and an amplifier connected to a second end of the second transistor and to a second end of the fourth transistor.
SENSE AMPLIFIER
Broadly speaking, embodiments of the present techniques provide an amplification circuit comprising a sense amplifier and at least one Correlated Electron Switch (CES) configured to provide a signal to the sense amplifier. The sense amplifier outputs an amplified version of the input signal depending on the signal provided by the CES element. The signal provided by the CES element depends on the state of the CES material. The CES element provides a stable impedance to the sense amplifier, which may improve the reliability of reading data from the bit line, and reduce the number of errors introduced during the reading.
Storage circuit provided with variable resistance type elements, and its test device
A storage circuit includes: the array of a memory cell MC including a variable-resistance element; a conversion circuit that converts the resistance value of each memory cell into the signal level of an electric signal; a reference signal generation circuit that generates a reference signal common to a plurality of columns; a correction circuit that corrects one of the signal level of the reference signal and the signal level of the electric signal for each column of the array of the memory cell; and an RW circuit that determines data stored in the memory cell belonging to a corresponding column by comparing one of the reference level and the signal level of the electric signal, corrected by the correction circuit, and the other of the reference level and the signal level of the electric signal.
METHOD FOR STORING INFORMATION IN A CODED MANNER IN NON-VOLATILE MEMORY CELLS, DECODING METHOD AND NON-VOLATILE MEMORY
The present disclosure is directed to a method for storing information in a coded manner in non-volatile memory cells. The method includes providing a group of non-volatile memory cells of non volatile memory. The memory cell is of the type in which a stored logic state, which can be logic high or logic low, can be changed through application of a current to the cell and the state in the memory cell is read by reading a current provided by the cell. The group of non-volatile memory cells include a determined number of non-volatile memory cells which is greater than two. The group of non-volatile memory cells store a codeword formed by the values of said stored states of the cells of the group taken according to a given order. Given a set of codewords obtainable by the stored values in the determined number of non-volatile memory cells in a group, the method includes storing the information in at least two subsets of said set of codewords comprising each at least a codeword. Each codeword in a same subset has a same Hamming weight. Each codeword belonging to one subset has a Hamming distance equal or greater than two with respect to each codeword belonging to another subset.
MEMORY DEVICE ARCHITECTURE USING MULTIPLE PHYSICAL CELLS PER BIT TO IMPROVE READ MARGIN AND TO ALLEVIATE THE NEED FOR MANAGING DEMARCATION READ VOLTAGES
The application relates to an architecture that allows for less precision of demarcation read voltages by combining two physical memory cells into a single logical bit. Reciprocal binary values may be written into the two memory cells that make up a memory pair. When activated using bias circuitry and address decoders the memory cell pair creates current paths having currents that may be compared to detect a differential signal. The application is also directed to writing and reading memory cell pairs.
READ/WRITE SWITCHING CIRCUIT AND MEMORY
A read/write switching circuit and a memory are provided. The read/write switching circuit includes: a first data line (Ldat) connected to a bit line (BL) through a column select module, a first complementary data line (Ldat #) connected to a complementary bit line through the column select module, a second data line (Gdat) and a second complementary data line (Gdat #), and further includes: a read/write switching module (101) configured to transmit data between the first data line and the second data line and transmit data between the first complementary data line (Ldat #) and the second complementary data line (Gdat #) during read and write operations in response to read and write control signals; and an amplification module (102) connected between the first data line (Ldat) and the first complementary data line (Ldat #) and configured to amplify data of the first data line (Ldat) and data of the first complementary data line (Ldat #).
MEMORY READ CIRCUITRY WITH A FLIPPED VOLTAGE FOLLOWER
A memory includes read circuitry for reading values stored in memory cells. The read circuitry includes flipped voltage followers for providing bias voltages to nodes of current paths coupled to sense amplifiers during memory read operations.
Resistive random-access memory for embedded computation
A resistive random-access memory (RRAM) system includes an RRAM cell. The RRAM cell includes a first select line and a second select line, a word line, a bit line, a first resistive memory device, a first switching device, a second resistive memory device, a second switching device, and a comparator. The first resistive memory device is coupled between a first access node and the bit line. The first switching device is coupled between the first select line and the first access node. The second resistive memory device is coupled between a second access node and the bit line. The second switching device is coupled between the second select line and the second access node. The comparator includes a first input coupled to the bit line, a second input, and an output.
Resistive element array circuit, resistive element array circuit unit, and infrared sensor
A resistive element array circuit includes word lines, bit lines, resistive elements, a selector, a differential amplifier, and a ground terminal. The word lines are coupled to a power supply. The resistive elements are each disposed at an intersection of corresponding one of the word lines and corresponding one of the bit lines. The selector is configured to select one word line and one bit line. The differential amplifier includes a positive input terminal configured to be coupled to the selected one of the bit lines which is selected by the selector, a negative input terminal configured to be coupled to non-selected one of the bit lines which is not selected by the selector and to non-selected one of the word lines which is not selected by the selector, an output terminal being coupled to the negative input terminal. The ground terminal is coupled to the positive input terminal.
Regulator of a sense amplifier
A system and method for operating a memory cell is provided. A non-volatile memory storage device includes an array of memory cells of differential or single-ended type. In an embodiment, a regulator is coupled to a sense amplifier. The regulator is configured to generate a voltage to gate terminals of one or two transistors of the sense amplifier. In the differential type, the voltage is generated such that the first bias current and the second bias current have a current value equal to the sum of a maximum current flowing in a memory cell being in a RESET state and a fixed current. In the single-ended type, the regulated voltage is generated such that the first bias current and the second bias current have a current value equal to the sum of a fixed current and the reference current generated by the reference current source across temperature.