A neuromorphic device includes a plurality of first control lines, a plurality of second control lines and a matrix of resistive processing unit cells. Each resistive processing unit cell is electrically connected with one of the first control lines and one of the second control lines. A given resistive processing unit cell includes a first resistive device and a second resistive device. The first resistive device is a positively weighted resistive device and the second resistive device is a negatively weighted resistive device.

A memory circuit includes a bias voltage generator including a bias voltage node, an activation voltage generator including a resistive device, and a first amplifier, a drive circuit including a second amplifier including an input terminal coupled to the bias voltage node, and a resistive random-access memory (RRAM) array. The activation voltage generator and the first amplifier are configured to generate a portion of a bias voltage level on the bias voltage node based on a resistance of the resistive device, and the drive circuit is configured to output a drive voltage having the bias voltage level to the RRAM array.

An embodiment non-volatile memory device includes an array of memory cells in rows and columns; a plurality of local bitlines, the memory cells of each column being coupled to a corresponding local bitline; a plurality of main bitlines, each main bitline being coupleable to a corresponding subset of local bitlines; a plurality of program driver circuits, each having a corresponding output node and injecting a programming current in the corresponding output node, each output node coupleable to a corresponding subset of main bitlines. Each program driver circuit further includes a corresponding limiter circuit that is electrically coupled, for each main bitline of the corresponding subset, to a corresponding sense node whose voltage depends, during writing, on the voltage on the corresponding main bitline. Each limiter circuit turns off the corresponding programming current, in case the voltage on any of the corresponding sense nodes overcomes a reference voltage.

A method for rewriting a semiconductor storage device includes: a first rewriting step of applying a pre-charge voltage to both of a plurality of bit lines and a plurality of source lines; a second rewriting step of applying a rewrite voltage to one of a selected bit line or a selected source line; a third rewriting step of applying a rewrite voltage to both of the selected bit line and the selected source line; a fourth rewriting step of applying a pre-charge voltage to one of the selected bit line or the selected source line; and a fifth rewriting step of applying a pre-charge voltage to both of the selected bit line and the selected source line.

Apparatus and methods are disclosed, including a method that performs a first operation on a first resistance variable element using a common source voltage, a first data line voltage and a first control gate voltage, and then performs a second operation on a second resistance variable element using the common source voltage, a second data line voltage and a second control gate voltage. Additional apparatus and methods are described.

A set procedure of a one transistor, one memristor memory elements may comprise determining a gate voltage for the transistor based on the desired target value. Increasing set pulses may be applied to memristor while the gate is held at the determined gate voltage.

A resistive floating electrode device (RFED) provides a logic cell or non-volatile storage or dynamic or static random access memory on an extremely compact matrix with individual cells scalable to the minimum available lithographic feature size regime by providing atomic switches connected in anti-parallel relationship, preferably with a common inert electrode. Programming is facilitated by limiting current to a compliance current level in order to maintain an OB state from which the cell can be written to either the 0 or 1 state. A perfecting feature of the invention provides for selective operation of a cell as a diode or in a volatile or non-volatile storage mode within the same memory array. A series connection of three or more RFEDs in accordance with the invention having different ON state currents, OFF state currents and reset currents can be used as adaptive, neural or chaotic logic cells.

Improved STT MRAM CSL array bias schemes are provided. In one aspect, a method for operating a CSL STT MRAM array includes: providing the STT MRAM array having a plurality of word lines perpendicular to both a plurality of bit lines and at least one source line; a plurality of memory cells including magnetic tunnel junctions in series with field effect transistors, wherein the field effect transistors are gated by the word lines, wherein the bit lines are connected to the magnetic tunnel junctions, and wherein the source line is connected to the field effect transistors; and applying a first word line voltage (Vdd) to a selected one of the word lines during a read, and a different second word line voltage (Vpp) to the selected word line during a write.

An apparatus is described that includes a resistive random access memory cell having a word line that is to receive a narrowed word line signal that limits an amount of time that an access transistor is on so as to limit the cell's high resistive state and/or the cell's low resistive state. Another apparatus is described that includes a resistive random access memory cell having SL and BL lines that are to receive respective signals having different voltage amplitudes to reduce source degeneration effects of the resistive random access memory cell's access transistor. Another apparatus is described that includes a resistive random access memory cell having a storage cell comprising a bottom-side OEL layer. Another apparatus is described that includes a resistive random access memory cell having a storage cell within a metal layer that resides between a pair of other metal layers where parallel SL and BL lines of the resistive random access memory cell respectively reside.

A memory cell includes a single bi-directional resistive memory element (BRME) having a first terminal directly connected to a first power rail and a second terminal coupled to an internal node; and a first transistor having a control electrode coupled to the internal node, and a first current electrode coupled to a first bitline, and a second current electrode coupled to one of a group consisting of: a read wordline and the first power rail.