A memory device can sense stored data during memory read operations using a reference trim, and a memory built-in self-test system can perform a multiple step process to set the reference trim for the memory device. The memory built-in self-test system can set a reference trim range that corresponds to a range of available reference trim values and then select one of the reference trim values in the reference trim range as the reference trim for the memory device. The memory built-in self-test system can set the reference trim range by prompting performance of the memory read operations using different positions of the reference trim range relative to read characteristics of the memory device and set a position for the reference trim range relative to the read characteristics of the memory device based on failures of the memory device to correctly sense the stored data during the memory read operations.

A memory device includes a system block for storing test information and includes a data block including memory cells connected to a plurality of low bank column lines and a plurality of high bank column lines. The memory device also includes a column repair controller configured to detect, based on the test information, a concurrent repair column line in which a low bank column line among the plurality of low bank column lines and a high bank column line the plurality of high bank column lines corresponding to the same column address are concurrent repaired.

A memory device includes: a memory cell array; a first latch; a second latch; a first circuit; and a second circuit. The memory cell array includes first, second, and third columns associated with first, second, and third addresses, respectively. The first latch stores the first address and is associated with a fourth address. The second latch stores the second address and is associated with a fifth address. The fourth address and the fifth address are in an ascending order. The first circuit selects the third column in place of the first column based on the first address. The second circuit determines whether or not the first address and the second address are in an ascending order.

An improved sensing circuit is disclosed that utilizes a bit line in an unused memory array to provide reference values to compare against selected cells in another memory array. A circuit that can perform a self-test for identifying bit lines with leakage currents about an acceptable threshold also is disclosed.

Systems and methods of screening memory cells by modulating bitline and/or wordline voltage. In a read operation, the wordline may be overdriven or underdriven as compared to a nominal operating voltage on the wordline. In a write operation, the one or both of the bitline and wordline may be overdriven or underdriven as compared to a nominal operating voltage of each. A built-in self test (BIST) system for screening a memory array has bitline and wordline margin controls to modulate bitline and wordline voltage, respectively, in the memory array.

A memory device and a method of correcting error in a memory device is provided. The memory device controller includes a memory array, a tie-breaker array, a write controller, a verify circuit, and a controller. The memory array includes a plurality of memory cells. The tie-breaker array includes a plurality of tie-breaker rows. The write controller is configured to apply a programming voltage to the memory array. The verify circuit is configured to apply a verify voltage to verify whether the memory cells in the memory array are in an unambiguous state or not. The controller is configured to enable one or more tie-breaker rows in additions to the memory array to adjust an output of the memory array when the memory cells in the memory array are in an ambiguous state.

A memory device includes a memory array and control logic, operatively coupled with the memory array, to perform operations including causing a first current to be obtained with respect to cells of a wordline maintained at a first voltage, determining that the cells are at a second voltage lower than the first voltage, in response to determining that the cells are the second voltage, causing a voltage ramp down process to be initiated, causing a second current to be sampled with respect to the cells during the voltage ramp down process, and detecting an existence of charge loss by determining whether the second current satisfies a threshold condition in view of the first current.

Various implementations described herein are directed to a device having memory architecture with an array of memory cells arranged in multiple columns with redundancy including first columns of memory cells disposed in a first region along with second columns of memory cells and redundancy columns of memory cells disposed in a second region that is laterally opposite the first region. The device may have column shifting logic that is configured to receive data from the multiple columns, shift the data from the first columns in the first region to a first set of the redundancy columns in the second region, and shift data from the second columns in the second region to a second set of the redundancy columns in the second region.

A method for repairing a memory device with faulty memory cells. The method includes defining a RA environment comprising a location of each of the faulty memory cells and a plurality of SR and a plurality of SC. The method further includes repairing the faulty memory cells based on an RA training process using the defined RA environment and mapping of the location of each faulty memory cell with the plurality of SC or SR. The method further includes training, based on a determination that indicates the at least one faulty memory cell among the faulty memory cells is left unrepaired and the at least one SC or SR is remaining, a first NN to perform an action for repairing of the faulty memory cells such that a maximum number of faulty memory cells are reparable and a minimum number of SC and SR are utilized during the repairing.

A method for operating a memory includes: receiving a first write command and a first write address; receiving first write data a portion of which is masked; reading first read data and a first read error correction code from a region selected based on the first write address in a cell array; detecting and correcting an error in the first read data based on the first read error correction code to produce error-corrected first read data; generating first new write data by replacing the masked portion of the first write data with a portion of the error-corrected first read data; generating a first write error correction code based on the first new write data; and writing the first new write data and the first write error correction code into the region selected based on the first write address in response to the detecting of the error.