G11C2029/1804

WORDLINE CAPACITANCE BALANCING
20230031126 · 2023-02-02 ·

Methods, systems, and devices for word line capacitance balancing are described. A memory device may include a set of memory tiles, where one or more memory tiles may be located at a boundary of the set. Each boundary memory tile may have a word line coupled with a driver and a subarray of memory cells, and may also include a load balancing component (e.g., a capacitive component) coupled with the driver. In some examples, the load balancing component may be coupled with an output line of the driver (such as a word line) or an input of the driver (such as a line providing a source signal). The load balancing component may adapt a load output from the driver to the subarray of memory cells such that the load of the memory tile at the boundary may be similar to the load of other memory tiles not at the boundary.

ECC in integrated memory assembly
11482296 · 2022-10-25 · ·

Technology for error correcting data stored in memory dies is disclosed. Codewords, which may contain data bits and parity bits, are stored on a memory die. The memory die is bonded to a control die through bond pads that allow communication between the memory die and the control die. The codewords are decoded at the control die based on the parity bits. If the control die successfully decodes a codeword, the control die may send the data bits but not the parity bits to a memory controller. By not sending the parity bits to the memory controller, substantial bandwidth is saved. Also, substantial power may be saved. For example, the interface between the control die and the memory controller could be a high speed interface.

Memory integrity
09847872 · 2017-12-19 · ·

Systems and methods may provide for identifying unencrypted data including a plurality of bits, wherein the unencrypted data may be encrypted and stored in memory. In addition, a determination may be made as to whether the unencrypted data includes a random distribution of the plurality of bits. An integrity action may be implemented, for example, when the unencrypted data includes a random distribution of the plurality of bits.

Variable page size architecture
11244713 · 2022-02-08 · ·

Methods, systems, and devices for operating a memory array with variable page sizes are described. The page size may be dynamically changed, and multiple rows of the memory array may be accessed in parallel to create the desired page size. A memory bank of the array may contain multiple memory sections, and each memory section may have its own set of sense components (e.g., sense amplifiers) to read or program the memory cells. Multiple memory sections may thus be accessed in parallel to create a memory page from multiple rows of memory cells. The addressing scheme may be modified based on the page size. The logic row address may identify the memory sections to be accessed in parallel. The memory sections may also be linked and accessing a row in one section may automatically access a row in a second memory section.

VARIABLE PAGE SIZE ARCHITECTURE
20220230668 · 2022-07-21 ·

Methods, systems, and devices for operating a memory array with variable page sizes are described. The page size may be dynamically changed, and multiple rows of the memory array may be accessed in parallel to create the desired page size. A memory bank of the array may contain multiple memory sections, and each memory section may have its own set of sense components (e.g., sense amplifiers) to read or program the memory cells. Multiple memory sections may thus be accessed in parallel to create a memory page from multiple rows of memory cells. The addressing scheme may be modified based on the page size. The logic row address may identify the memory sections to be accessed in parallel. The memory sections may also be linked and accessing a row in one section may automatically access a row in a second memory section.

ECC IN INTEGRATED MEMORY ASSEMBLY
20210383886 · 2021-12-09 · ·

Technology for error correcting data stored in memory dies is disclosed. Codewords, which may contain data bits and parity bits, are stored on a memory die. The memory die is bonded to a control die through bond pads that allow communication between the memory die and the control die. The codewords are decoded at the control die based on the parity bits. If the control die successfully decodes a codeword, the control die may send the data bits but not the parity bits to a memory controller. By not sending the parity bits to the memory controller, substantial bandwidth is saved. Also, substantial power may be saved. For example, the interface between the control die and the memory controller could be a high speed interface.

MEMORY WITH FUSE PINS SHARED BY MULTIPLE-TYPE REPAIRS
20220171543 · 2022-06-02 ·

A self-repair memory circuit includes a cell array, a controller, a row repair decoder, and a column repair decoder. The cell array includes rows and columns of memory cells. The controller receives an input indicating row repair or column repair, and a repair address shared by the row repair and the column repair of the cell array. The row repair decoder maps the repair address of a defective row to a redundant row of the cell array when the input indicates the row repair. The column repair decoder maps the repair address of a defective column to another column of the cell array when the input indicates the column repair.

EMBEDDED MEMORY TRANSPARENT IN-SYSTEM BUILT-IN SELF-TEST

A memory transparent in-system built-in self-test may include performing in-system testing on subsets of memory cells over one or more test intervals of one or more test sessions. A test interval may include copying contents of a subset of memory cells to a register(s), writing test data (e.g., a segment of a pattern) to the subset of memory cells, reading back contents of the subset of memory cells, and restoring the content from the register(s) to the subset of memory cells. In-system testing may be performed on overlapping sets of memory cells. In-system testing may be performed on successive subsets of memory cells within a row (i.e., fast column addressing) and/or within a column (fast column addressing). In-system testing may be performed on sets of m blocks of memory cells during respective test intervals. The number of m blocks tested per interval may be configurable/selectable.

Wordline capacitance balancing
11462289 · 2022-10-04 · ·

Methods, systems, and devices for word line capacitance balancing are described. A memory device may include a set of memory tiles, where one or more memory tiles may be located at a boundary of the set. Each boundary memory tile may have a word line coupled with a driver and a subarray of memory cells, and may also include a load balancing component (e.g., a capacitive component) coupled with the driver. In some examples, the load balancing component may be coupled with an output line of the driver (such as a word line) or an input of the driver (such as a line providing a source signal). The load balancing component may adapt a load output from the driver to the subarray of memory cells such that the load of the memory tile at the boundary may be similar to the load of other memory tiles not at the boundary.

MEMORY SYSTEM WITH REDUNDANT OPERATION

A memory system includes a memory that provides digital data and a built-in self-test (BIST) circuit for testing the memory for determining defective storage units of the memory. The memory system has a data output for providing data from the memory to an external system. The data output of the memory system has a first bit width. The memory has a data output that has a second bit width that is greater than the first bit width. The BIST circuit has a data input that is of the second bit width.