Methods, systems, and devices for selective access for grouped memory dies are described. A memory device may be configured with a select die access protocol for a group of memory dies that share a same channel. The protocol may be enabled by one or more commands from the host device, which may be communicated to each of the memory dies of the group via the channel. The command(s) may indicate a first set of one or more memory dies of the group for which a set of commands may be enabled and may also indicate a second set of one or more memory dies of the group for which at least a subset of the set of commands is disabled. When the select die access mode is enabled, the disabled memory dies may be restricted from performing the subset of commands received via the channel.

A semiconductor memory device includes a plurality of planes defined in a plurality of chip regions; and a rescue circuit configured to disable a failed plane and enable a normal plane from among the plurality of planes, wherein the semiconductor memory device operates with only normal planes that are enabled.

Methods, systems, and devices for masked training and analysis with a memory array are described. A memory device may operate in a first mode in which a maximum transition avoidance (MTA) decoder for a memory array of the memory device is disabled. During the first mode, the memory device may couple an input node of the MTA decoder with a first output node of a first decoder, such as a first pulse amplitude modulation (PAM) decoder. The memory device may operate in a second mode in which the MTA decoder for the memory array is enabled. During the second mode, the memory device may couple the input node of the MTA decoder with a second output node of a second decoder, such as a second PAM decoder.

A request is received to perform a multi-plane operation for data residing on a first plane and a second plane of a memory device. A first set of trim values is obtained from a first set of registers of the memory device. The first set of trim values corresponds to a first voltage shift for the data at the first plane. A second set of trim values is obtained from a second set of registers of the memory device. The second set of trim values corresponds to a second voltage shift for the data at the second set of trim values for the data at the second plane. The multi-plane operation is performed using at least the first set of trim values for the data at the first plane and at least the second set of trim values for the data at the second plane.

Methods, systems, and apparatuses related to memory operation with common clock signals are provided. A memory device or system that includes one or more memory devices may be operable with a common clock signal without a delay from switching on-die termination on or off. For example, a memory device may comprise first impedance adjustment circuitry configured to provide a first impedance to a received clock signal having a clock impedance and second impedance adjustment circuitry configured to provide a second impedance to the received clock signal. The first impedance and the second impedance may be configured to provide a combined impedance about equal to the clock impedance when the first impedance adjustment circuitry and the second impedance adjustment circuitry are connected to the received clock signal in parallel.

During system initialization, each data buffer device and/or memory device on a memory module is configured with a unique (at least to the module) device identification number. In order to access a single device (rather than multiple buffers and/or memory devices), a target identification number is written to all of the devices using a command bus connected to all of the data buffer devices or memory devices, respectively. The devices whose respective device identification numbers do not match the target identification number are configured to ignore future command bus transactions (at least until the debug mode is turned off.) The selected device that is configured with a device identification number matching the target identification number is configured to respond to command bus transactions.

During system initialization, each data buffer device and/or memory device on a memory module is configured with a unique (at least to the module) device identification number. In order to access a single device (rather than multiple buffers and/or memory devices), a target identification number is written to all of the devices using a command bus connected to all of the data buffer devices or memory devices, respectively. The devices whose respective device identification numbers do not match the target identification number are configured to ignore future command bus transactions (at least until the debug mode is turned off.) The selected device that is configured with a device identification number matching the target identification number is configured to respond to command bus transactions.

Methods, systems, and devices for masked training and analysis with a memory array are described. A memory device may operate in a first mode in which a maximum transition avoidance (MTA) decoder for a memory array of the memory device is disabled. During the first mode, the memory device may couple an input node of the MTA decoder with a first output node of a first decoder, such as a first pulse amplitude modulation (PAM) decoder. The memory device may operate in a second mode in which the MTA decoder for the memory array is enabled. During the second mode, the memory device may couple the input node of the MTA decoder with a second output node of a second decoder, such as a second PAM decoder.

A processor coupled to a NAND memory device comprising an n by m array of dies having n channels performs error recovery message scheduling and read error recovery on the dies by receiving indications of read errors responsive to attempted execution of a read command on a destination die and creates an error recovery message or instruction in response to the indication. The processor determines the destination die of the error recovery message and sends the error recovery message to a die queue based on the determined destination die. The n×m die queues can each be further divided into p priority queues, and error recovery messages are sent to the appropriate die priority queue based on a priority associated with the error recovery message. The processor fetches error recovery messages from a head of each die priority queue and performs read error recovery at the destination die.

A processor coupled to a NAND memory device comprising an n by m array of dies having n channels performs error recovery message scheduling and read error recovery on the dies by receiving indications of read errors responsive to attempted execution of a read command on a destination die and creates an error recovery message or instruction in response to the indication. The processor determines the destination die of the error recovery message and sends the error recovery message to a die queue based on the determined destination die. The n×m die queues can each be further divided into p priority queues, and error recovery messages are sent to the appropriate die priority queue based on a priority associated with the error recovery message. The processor fetches error recovery messages from a head of each die priority queue and performs read error recovery at the destination die.