A memory circuit includes an array of memory cells arranged with first word lines connected to a first sub-array storing less significant bits of data and second word lines connected to a second sub-array storing more significant bits of data. A row decoder circuit coupled to the first and second word lines generates word line signals. A word line gating circuit is configured to selectively gate passage of the word line signals to the second word lines for the second sub-array in response to assertion of a maximum value signal. A data modification circuit performs a mathematical operation on data read from the array of memory cells, and asserts the maximum value signal if the mathematical operation performed on the less significant bits of data from the first sub-array produces a maximum data value.

The present disclosure includes an integrated circuit comprising a first pair of complementary transistors configured in series, a second pair of complementary transistors configured in series, and at least one charge extraction transistor having a gate coupled to a first potential, a source coupled to a second potential, and a drain coupled to a data storage node of one of the first or second pairs of complementary transistors. The first potential and second potential bias the at least one charge extraction transistor in a nonconductive state. The drain of the at least one charge extraction transistor is formed in a doped material shared with a drain of a transistor of the first or second pairs of complementary transistors.

An in-memory computation circuit includes a memory array with SRAM cells connected in rows by word lines and in columns by bit lines. Body bias nodes of the transistors in each SRAM cell are biased by a modulated body bias voltage. A row controller circuit simultaneously actuates word lines in parallel for an in-memory compute operation. A column processing circuit processes analog voltages developed on the bit lines in response to the simultaneous actuation to generate a decision output for the in-memory compute operation. A voltage generator circuit switches the modulated body bias voltage from a non-negative voltage level to a negative voltage level during the simultaneous actuation. The negative voltage level is adjusted dependent on integrated circuit process and/or temperature conditions in order to optimize protection against unwanted memory cell data flip.

A load control device may include a semiconductor switch, a control circuit, and first and second terminals adapted to be coupled to a remote device. The load control device may include a first switching circuit coupled to the second terminal, and a second switching circuit coupled between the first terminal and the second terminal. The control circuit may be configured to render the first switching circuit conductive to conduct a charging current from an AC power source to a power supply of the remote device during a first time period of a half-cycle of the AC power source, and further configured to render the first and second switching circuits conductive and non-conductive to communicate with the remote device via the second terminal during a second time period of the half-cycle of the AC power source.

The embodiments provide a method for reading and writing and a memory device. The method includes: applying a read command to the memory device, the read command pointing to address information; reading data to be read out from a memory cell corresponding to the address information pointed to by the read command; storing the address information pointed to by the read command into a memory bit of a preset memory space if an error occurs in the data to be read out, wherein the preset memory space is provided with a plurality of the memory bits, each of the plurality of memory bits being associated with a spare memory cell; and backing up the address information stored in the preset memory space into a non-volatile memory cell according to a preset rule.

An electronic circuit comprising an SRAM memory, a control unit, an error detection and correction module and a scrubbing module. The electronic circuit further comprises an integrated SEU monitor of the SRAM memory. The SEU monitor does not use standalone or specialized SRAM memories or particle detectors. Rather, the same SRAM memory that is used for the main operation as a storage element of the electronic circuit serves simultaneously as detector for the SEU monitor. The proposed SEU monitor enables real-time monitoring of the SEU rate in order to detect early the high radiation levels and apply appropriate hardening measures. Furthermore, a method for monitoring an SEU rate and determining permanent faults in an electronic circuit is suggested.

A memory array for storing odd and even data bits of data words in alternate sub-banks to reduce multi-bit error rate is disclosed. The memory array alternates odd data bits of a first plurality of data words in consecutive columns a first sub-bank of first and second memory banks and even data bits of the first plurality of data words in consecutive columns of a second sub-bank of the first and second memory banks. For example, the lowest bits of each of N data words are stored in a first N consecutive columns of a first sub-bank. The second bits of the N data words are stored in the next N consecutive columns of a second sub-bank. The N data bits in each of the bit positions of the N data words are interleaved in corresponding column mux sets. Alternating odd and even bits between sub-banks reduces multi-bit soft errors.

A memory architecture for optimizing leakage currents in standby mode and a method thereof is disclosed. The memory architecture includes a plurality of memory segments configured to operate in one or more modes of operations. The plurality of memory segments includes a plurality of decoder slices. Each of the plurality of decoder slice includes a plurality of wordlines running in the row direction; at least one array power header configured for controlling leakage currents within each of the plurality of decoder slice in the row direction; and a retention header. Each of the plurality of power supply rails running in the column direction are segmented within one or more decoder slice to form one or more segmented power supply node.

Some embodiments include an integrated assembly having digit lines supported by a base and extending along a first direction. A shield-connection-line is supported by the base and extends along the first direction. Transistor active regions are over the digit lines. Each of the active regions includes a channel region between an upper source/drain region and a lower source/drain region. The lower source/drain regions are coupled with the digit lines. Capacitors are coupled with the upper source/drain regions. Wordlines extend along a second direction which crosses the first direction. The wordlines include gate regions adjacent the channel regions. Shield lines extend along the second direction. The shield lines are above the digit lines and are coupled with the shield-connection-line.

The present disclosure includes storage circuits, such latches. In one embodiment, a circuit includes a plurality of latches, each latch including a first N-type transistor formed in a first P-type material, a first P-type transistor formed in a first N-type material, a second N-type transistor formed in a second P-type material, and a second P-type transistor formed in a second N-type material. The first and second N-type transistors are formed in different P-wells and the first and second P-type transistors are formed in different N-wells. In other storage circuits, charge extraction transistors are coupled to data storage nodes and are biased in a nonconductive state. These techniques make the data storage circuits more resilient, for example, to an ionizing particle striking the circuit and generating charge carriers that would otherwise change the state of the storage node.