An inductor component includes an element body including magnetic powder and having first and second principal surfaces; an inductor wiring in the element body; a first vertical wiring that is in the element body, is connected to a first end portion of the inductor wiring, and extends to the first principal surface; a second vertical wiring that is in the element body, is connected to a second end portion of the inductor wiring, and extends to the first principal surface; and first and second external terminals exposed on the first principal surface and connected to the first and second vertical wirings, respectively. The magnetic powder contains an Fe element as a main component, and the first principal surface has an oxidized region, in which an oxide film of oxidized particles of the magnetic powder, is exposed and a non-oxidized region in which particles of the magnetic powder are exposed.

A magnetic powder contains a magnetic metal particle comprising iron (Fe) and an insulating coating layer disposed on a surface of the magnetic metal particle and comprising tin (Sn), phosphorous (P) and oxygen (O), and a coil component contains such a magnetic powder.

A coil-incorporated multilayer substrate includes base materials and a coil portion including conductor patterns that are wound a plurality of times on at least one of the base materials, and, in a predetermined direction along the surface of the base material of the coil portion, the width of outermost conductor patterns is larger than the widths of the conductor patterns between an innermost conductor pattern and an outermost conductor pattern, the width of the innermost conductor pattern is larger than the widths of the conductor patterns between the outermost conductor pattern and the innermost conductor pattern, and the width of the innermost conductor pattern is larger than the distance between the innermost conductor pattern and the conductor pattern adjacent to the innermost conductor pattern.

An inductor unit includes a conductive structure, a first magnetic element and an insulating layer. The conductive structure has a bottom conductive layer, a top conductive layer, and a first side conductive layer extending from the bottom conductive layer to the top conductive layer. The first magnetic element is disposed on the bottom conductive layer of the conductive structure. The insulating layer is disposed on the bottom conductive layer of the conductive structure, wherein the insulating layer covers and surrounds the first magnetic element. The circuit structure including the inductor unit and the methods for manufacturing the same are also provided.

A signal transmission circuit for transmitting an insulation signal includes: a multilayer substrate including a plurality of layers; and a pattern transformer disposed on the multilayer substrate. The pattern transformer includes a primary winding having a wound printed pattern wiring provided in each of a first plane region and a second plane region of the multilayer substrate, and a secondary winding disposed at a different position from the primary winding in a layer direction and having a wound printed pattern wiring provided in each of the first plane region and the second plane region of the multilayer substrate. The primary winding and the secondary winding are electromagnetically coupled and configured such that a current flows clockwise through one of the wound printed pattern wiring provided in the first plane region or the wound printed pattern wiring provided in the second plane region while a current flows counterclockwise through the other.

A glass core wiring substrate incorporating a high-frequency filter having good high-frequency characteristics as a core material and allowing a more efficient arrangement of a conductor in the glass substrate, a module including the same, and a method of manufacturing the glass core wiring substrate incorporating a high-frequency filter. A conductive layer in a glass through a hole in a glass core substrate has a structure in which a hollow cylindrical conductor layer on a side wall of the glass through hole is connected to a cover conductor layer covering one of two openings of the glass through hole. To achieve such a structure, a carrier is attached to one surface of the glass core substrate to cover one of the openings of the glass through hole, and the carrier is peeled off and removed after lamination of the conductor.

A filter device includes an input terminal, an output terminal, a main body, a common electrode provided to the main body, a ground terminal, and LC parallel resonators connected to the common electrode and the ground terminal. Each LC parallel resonator includes a capacitor, a first via, and a second via. One end of the first via is connected to the common electrode, and another end thereof is connected to the ground terminal through the capacitor. One end of the second via is connected to the common electrode, and another end thereof is connected to the ground terminal without through the capacitor. The second via is connected between portions of the common electrode to which the first vias of two adjacent resonators are connected.

Disclosed herein is a coil component that includes an element body having first and second magnetic layers and a coil part positioned therebetween, and first and second external terminals formed on the element body. The first external terminal is formed on the mounting surface and the first side surface. The second external terminal is formed on the mounting surface and the second side surface. The first and second external terminals formed on the first and second side surfaces, respectively, have a meander shape.

A multilayer coil component includes a multilayer body, and first and second outer electrodes. The multilayer body is formed by stacking plural insulating layers in a length direction, and includes a coil incorporated therein. The first and second outer electrodes are electrically connected to the coil. The coil is formed by electrically connecting plural coil conductors stacked in the length direction together with the insulating layers. The multilayer body has first and second end surfaces, first and second major surfaces, and first and second lateral surfaces. The first outer electrode has first, second, and third electrode portions. As viewed in plan in the width direction, the third electrode portion is substantially concave toward a vertex where first and second edges meet, the first edge being an edge where the first and third electrode portions meet, the second edge being an edge where the second and third electrode portions meet.

Methods of coupling inductors in an IC device using interconnecting elements with solder caps and the resulting device are disclosed. Embodiments include forming a top inductor structure, in a top inductor area on a lower surface of a top substrate, the top inductor structure having first and second top terminals at its opposite ends; forming a bottom inductor structure, in a bottom inductor area on an upper surface of a bottom substrate, the bottom inductor structure having first and second bottom terminals at its opposite ends; forming top interconnecting elements on the lower surface of the top substrate around the top inductor area; forming bottom interconnecting elements on the upper surface of the bottom substrate around the bottom inductor area; forming solder bumps on lower and upper surfaces, respectively, of the top and bottom interconnecting elements; and connecting the top and bottom interconnecting elements to each other.