Disclosed is a wireless monitoring system for a coal-gangue mixing ratio based on a non-Hermite technology, including a signal generation monitoring device, an excitation coil, a receiving coil and a parallel plate capacitor. The signal generation monitoring device is connected with the excitation coil; the receiving coil is connected with the parallel plate capacitor to form an LC resonance system; the receiving coil is placed in parallel with the excitation coil, and the axis of the receiving coil and the axis of the excitation coil are on a same horizontal line; the signal generation monitoring device is used to generate a pulse current and collect reflected signals; the excitation coil excites an initial magnetic field based on the generated pulse current, and the LC resonance circuit performs an electromagnetic field induction to generate an induced magnetic field, and feeds back the reflected signals to the signal generation monitoring device.

A laminated electronic component in which magnetic body layers and conductor patterns are laminated, and the conductor patterns between the magnetic body layers are connected to form a coil within a laminated body. The magnetic body layers are formed from a metal magnetic body. At least one lead-out conductor pattern of the coil is connected with an external terminal formed on an undersurface of the laminated body through a conductor formed at a corner of the laminated body.

An inductor component includes an element body, a coil on the body and spirally wound along an axis, first and second external electrodes electrically connected to the coil, and first and second through wirings which penetrate a substrate of the element body between main surfaces. The first coil wirings and through wirings, and the second coil wirings and through wirings, are connected as follows. With respect to two of the first through wirings adjacent to each other in a direction of the axis, on the first main surface, a relationship between a radius of an equivalent circle diameter of an end surface of each of the first through wirings and a minimum distance between end surfaces of the two first through wirings is satisfied, and with respect to two of the second through wirings adjacent to each other in the direction of the axis, a similar relationship is satisfied.

A semiconductor device structure is provided. The semiconductor device structure includes a first conductive line over a substrate. The semiconductor device structure includes a first protection cap over the first conductive line. The semiconductor device structure includes a first photosensitive dielectric layer over the substrate, the first conductive line, and the first protection cap. The semiconductor device structure includes a conductive via structure passing through the first photosensitive dielectric layer and connected to the first protection cap. The semiconductor device structure includes a second conductive line over the conductive via structure and the first photosensitive dielectric layer. The semiconductor device structure includes a second protection cap over the second conductive line. The semiconductor device structure includes a second photosensitive dielectric layer over the first photosensitive dielectric layer, the second conductive line, and the second protection cap.

A method includes: forming an interconnect structure over a semiconductor substrate. The interconnect structure includes: a magnetic core and a conductive coil winding around the magnetic core and electrically insulated from the magnetic core, wherein the conductive coil has horizontally-extending conductive lines and vertically-extending conductive vias electrically connecting the horizontally-extending conductive lines, wherein the magnetic core and the conductive coil are arranged in an inductor zone of the interconnect structure. The interconnect structure also includes a dielectric material electrically insulating the magnetic core from the conductive coil, and a connecting metal line adjacent to and on the outside of the inductor zone. The connecting metal line is electrical isolated from the inductor zone. The connecting metal line includes an upper surface lower than an upper surface of the second conductive vias and a bottom surface higher than a bottom surface of the first conductive vias.

A radio frequency (RF) weak magnetic field detection sensor includes a ferromagnetic core, a pickup coil disposed to surround the ferromagnetic core, a substrate that includes an opening, a core pad connected to the ferromagnetic core and a coil pad connected to the pickup coil, and an insulating tube interposed between the ferromagnetic core and the pickup coil. The insulating tube includes a bobbin around which the pickup coil is wound, and a core hole formed to pass through the bobbin and configured to accommodate the ferromagnetic core.

A module substrate antenna includes: a laminate in which a plurality of ferrite layers are stacked; antennal coils provided on surfaces of the respective ferrite layers; a connection pad connected to an external circuit; and a lead wire provided between the laminate and the connection pad. In the laminate, the antenna coils are two types of the antenna coils, and the two types of the antenna coils are alternately stacked.

Methods and apparatus for inductor and transformer semiconductor devices using hybrid bonding technology are disclosed. An example semiconductor device includes a first standoff substrate; a second standoff substrate adjacent the first standoff substrate; and a conductive layer adjacent at least one of the first standoff substrate or the second standoff substrate.

A method of manufacturing a power semiconductor system includes providing a power module having one or more power transistor dies and attaching an inductor module to the power module such that the inductor module is electrically connected to a node of the power module. The inductor module includes a substrate with a magnetic material and windings at one or more sides of the substrate. Further methods of manufacturing power semiconductor systems and methods of manufacturing inductor modules are also described.

An apparatus includes a substrate, one or more integrated circuit dies on the substrate, and a stiffener affixed to the substrate. One or more sections of the stiffener may includes a magnetic material. The apparatus further includes an inductive circuit element comprising one or more conductive structures wrapped around the magnetic material. In some examples where a first coil is wrapped around a first section of the stiffener, and a second coil is wrapped around a second section of the stiffener, current supplied to the first coil generates at the second coil a current that is further transmitted to the one or more semiconductor dies.