Patent classifications
H01F19/04
RADIO FREQUENCY APPARATUS AND INDUCTANCE DEVICE THEREOF
A radio frequency apparatus includes a power amplifier circuit, a signal coupling circuit, an extraction circuit, and a harmonic filter circuit. The power amplifier circuit is configured to amplify a differential signal to output a to-be-filtered signal. The signal coupling circuit includes a primary side inductor and a secondary side inductor. The signal coupling circuit is configured to convert the to-be-filtered signal received by the primary side inductor into a single-ended signal outputted from the secondary side inductor. The extraction circuit has a center tap. The extraction circuit is configured to inductively couple to the primary side inductor and output a common mode signal from the center tap. The harmonic filter circuit is configured to perform a harmonic filtering on the single-ended signal according to the common mode signal, such that the secondary side inductor of the signal coupling circuit outputs a filtered signal.
Inductor and circuit structure and method of manufacturing the same
An inductor unit includes a conductive structure, a first magnetic element and an insulating layer. The conductive structure has a bottom conductive layer, a top conductive layer, and a first side conductive layer extending from the bottom conductive layer to the top conductive layer. The first magnetic element is disposed on the bottom conductive layer of the conductive structure. The insulating layer is disposed on the bottom conductive layer of the conductive structure, wherein the insulating layer covers and surrounds the first magnetic element. The circuit structure including the inductor unit and the methods for manufacturing the same are also provided.
OVERLAPPED INDUCTOR STRUCTURE
An inductor structure includes a first inductor and a second inductor. A first portion of the first inductor is disposed on a first layer and a second portion of the first inductor is disposed on a second layer. A first portion of the second inductor is disposed on the first layer and a second portion of the second inductor is disposed on the second layer. The first portion of the first inductor and the second portion of the second inductor at least partially overlap. The second portion of the first inductor and the first portion of the second inductor at least partially overlap.
Transimpedance amplifier
A negative feedback inductor and a gate inductor are formed in different wiring layers of a substrate so as to be at least partially overlapped with each other in a plan view. When the lower wiring layer is thinner and the upper wiring layer is thicker, the negative feedback inductor Lc is formed in the lower wiring layer that is thinner.
SMALL-SIZE MILLIMETER WAVE ON-CHIP 90-DEGREE 3DB COUPLERS BASED ON SOLENOID STRUCTURES
A 90-degree, 3 dB coupler has an input port, an isolated port, a first output port, and a second output port. A plurality of solenoid structures are arranged in a parallel, spaced relationship. A first group of the interconnects bridge the solenoid structures of a first set that define a first contiguous connection from the input port to the first output port. A second group of interconnects bridge the solenoid structures of a second set that define a second contiguous connection from the isolated port to the second output port. A third group of interconnects bridge the solenoid structures of a third set that define a third contiguous connection from the isolated port to the second output port. The solenoid structures are each unique to a respective one of the first set, second set, and the third set.
PACKAGE COMPRISING SUBSTRATE WITH COUPLING ELEMENT FOR INTEGRATED DEVICES
A package comprising a substrate, a first integrated device coupled to a first surface of the substrate, and a second integrated device coupled to a second surface of the substrate. The substrate includes a dielectric layer and a plurality of interconnects. The plurality of interconnects includes a first plurality of interconnects configured as a first inductor and a second plurality of interconnects configured as a second inductor. The first integrated device is configured to be coupled to the first inductor. The second integrated device is configured to be coupled to the second inductor. The second integrated device is configured to tune the first inductor through the second inductor.
On-chip multi-layer transformer and inductor
A stacked transformer or inductor apparatus including a first layer with a first layer wire element extending around a center axis and a second layer with a second layer wire element. The second layer element includes side by side first and second wire components in parallel spaced relation extending around the center axis and the first wire component is connected to the first layer wire element to form a primary turn winding. A third layer includes a third layer wire element extending around the center axis and connected to the second wire component of the second layer wire element to form a secondary turn winding partially overlapping with the primary turn winding.
Base configured as an electronic component or a circuit board
A base includes a main body and a multilayer metal film disposed on the main body. The multilayer metal film includes a first metal film disposed on the main body, the first metal film having conductivity, second metal film on the first metal film and above the main body, the second metal film having resistance to solder leaching, and a third metal film on the second metal film, the third metal film having wettability. The third metal film includes an inwardly extended portion extending between the second metal film and the main body.
TRANSFORMER DESIGN WITH BALANCED INTERWINDING CAPACITANCE FOR IMPROVED EMI PERFORMANCE
An electronic device includes a multilevel lamination structure having a core layer, dielectric layers and conductive features formed in metal layers on or between respective ones or pairs of the dielectric layers. The core layer and the dielectric layers extend in respective planes of orthogonal first and second directions and are stacked along an orthogonal third direction. The conductive features include a first patterned conductive feature having multiple conductive turns in each of a first pair of the metal layers to form a first winding having a first turn and a final turn adjacent to one another in the same metal layer of the first pair, and a second patterned conductive feature having multiple conductive turns in a second pair of the metal layers to form a second winding having a first turn and a final turn.
Current transformer with self-adjusting cores
A current transformer includes a first housing including a first handle portion and a first distal portion, a second housing including a second handle portion and a second distal portion, a first core having a first proximal core end and a first distal core end the first core mounted in rotational contact within the first distal portion, and a second core having a second proximal core end and a second distal core end, the second core mounted in rotational contact within the second distal portion, wherein the first housing is rotationally coupled to the second housing about a fulcrum point.