An inductor device includes a first trace, a second trace, a first connection member, and a second connection member. The first trace includes a first sub-trace and a second sub-trace. The second sub-trace is disposed adjacent to the first sub-trace directly. The second trace includes a third sub-trace. The third sub-trace is disposed adjacent to the second sub-trace directly. The first connection member is configured to couple to the first sub-trace. The second connection member is disposed adjacent to the first connection member, and configured to couple to the second sub-trace.

An inductor bridge includes a flexible substrate and a coil defined by a conductor pattern provided on or in the flexible substrate, and connects a plurality of circuit portions. The flexible substrate includes a rigid portion and a flexible portion, the rigid portion being wider than the flexible portion. The rigid portion includes the coil and a joining portion connected to another circuit. The coil includes two coil portions located at different positions in plan view, a flexible portion is located adjacent to one side of the rigid portion, and at least two coil portions of the plurality of coil portions are located on the one side when viewed from the joining portion.

An inductor or transformer with the inductor can include one or more windings split into strands along a radial path of the winding and provide for a more uniform current distribution across a width of the winding. The winding(s) can comprise twisting components as twistings or strand crossings located at various locations along the winding. The twisting components span the winding along a winding width with a connector or crossing strand and change a position of one strand to another at points that different strands of the winding are cut or spliced.

An inductor device includes a first and a second inductor. First inductor includes plural first wires and a first connection member. Second inductor includes plural second wires and a second connection member. Part of first wires are winded/located at a first area, and part of first wires are winded/located at a second area. First and second areas are located on two opposite sides of inductor device. First connection member connects first wire located at first area and located at second area. Part of second wires are winded/located at first area, and part of second wires are winded/located at second area. One terminal of second connection member connects a terminal of second wire at an inner side of inductor device, and another terminal of second connection member is disposed outside inductor device. First and second inductors are symmetrical with respect to a center line of inductor device.

An inductor includes a first metallization layer multi-turn trace. The inductor also includes a second metallization layer multi-turn trace coupled to the first metallization layer multi-turn trace through at least one first via. The inductor further includes a plurality of discrete third metallization layer trace segments coupled to the second metallization layer multi-turn trace through a plurality of second vias.

An inductor device includes a first winding, a second winding, a first connecting structure and a second connecting structure. The first winding includes a first coil and a second coil. The second winding includes a third coil and a fourth coil, the third coil is overlapped with the first coil, and the fourth coil is overlapped with the second coil. The first connecting structure includes a first crossing structure and a second crossing structure. The first crossing structure has a first crossing point and is configured to couple the first coil and the second coil. The second crossing structure has a second crossing point and is configured to couple the third coil and the fourth coil. The first crossing point is not overlapped with the second crossing point. The second connecting structure is configured to couple the second coil and the third coil.

An inductor device includes a plurality of coils including a first winding and a second winding. The first winding includes a plurality of first sub-coils, wherein a first one of the plurality of first sub-coils is configured in a first region, and a second one and a third one of the plurality of first sub-coils are configured in a second region different from the first region. The second winding includes a plurality of second sub-coils, wherein a first one of the plurality of second sub-coils is configured in the second region, and a second one and a third one of the plurality of second sub-coils are configured in the first region. Each of the plurality of coils is composed of one of the plurality of first sub-coils and one of the plurality of second sub-coils.

An inductor device includes a first trace, a second trace, and a capacitor. The first trace includes at least two sub-traces and a first crossing connection portion. One terminal of the at least two sub-traces is coupled to a first node. The first crossing connection portion is coupled between the at least two sub-traces of the first trace in an interlaced manner. The second trace includes at least two sub-traces. One terminal of the at least two sub-traces is coupled at a second node. The capacitor is coupled between the first node and the second node.

A low-resistance thick-wire integrated inductor may be formed in an integrated circuit (IC) device. The integrated inductor may include an elongated inductor wire defined by a metal layer stack including an upper metal layer, middle metal layer, and lower metal layer. The lower metal layer may be formed in a top copper interconnect layer, the upper metal layer may be formed in an aluminum bond pad layer, and the middle metal layer may comprise a copper tub region formed between the aluminum upper layer and copper lower layer. The wide copper region defining the middle layer of the metal layer stack may be formed concurrently with copper vias of interconnect structures in the IC device, e.g., by filling respective openings using copper electrochemical plating or other bottom-up fill process. The elongated inductor wire may be shaped in a spiral or other symmetrical or non-symmetrical shape.

A semiconductor element includes a first spiral coil, a second spiral coil, a connecting section, a first guide segment, and a second guide segment. The first spiral coil is formed with a first end and a second end, and includes a first inner turn and a first outer turn. The first inner turn is located in a range surrounded by the outer turn, and the first end and the second end are located at the first inner turn. The second spiral coil and the first spiral coil are located in substantially a same metal layer. The connecting section connects the first spiral coil and the second spiral coil. The first guide segment is connected to the first end. The second guide segment is connected to the second end. The first guide segment and the second guide segment are fabricated in a metal layer different from a metal layer of the first spiral coil.