An inductor array of the invention includes a magnetic base body, a first internal conductor within the base body, and a second internal conductor adjacent to the first internal conductor. The first and second internal conductors are arranged along a reference axis. The base body includes an inter-conductor region between the first and second internal conductors. The inter-conductor region has a first section cut along a reference plane including the reference axis, and a first reference axis direction dimension of the first section in the reference axis direction may be less than double a shortest distance between the first internal conductor and a surface of the base body in the reference plane. A first aspect ratio of the first section, which is a ratio of a first orthogonal direction dimension in a direction orthogonal to the reference axis to the first reference axis direction dimension, may be less than 1.

A method of fabricating an inductor device includes preparing a conductive coil, connecting two terminals to one of two ends of the conductive coil, molding a pillar from a plurality of first composite material powders by a pressing process where each first composite material powder is composed of a first magnetic material powder coated with a first thermosetting resin, placing the pillar in a surrounding space formed by the conductive coil, molding a cladding body from a plurality of second composite powders where the second composite material powders is composed of a second magnetic material powder coated with a second thermosetting resin, heating the cladding body, the conductive coil and the pillar cladded by the cladding body such that the plurality of first magnetic material powders are bonded by the cured first thermosetting resin and the plurality of second magnetic material powders are bonded by the cured second thermosetting resin.

An inductor component includes an element body including magnetic powder and having first and second principal surfaces; an inductor wiring in the element body; a first vertical wiring that is in the element body, is connected to a first end portion of the inductor wiring, and extends to the first principal surface; a second vertical wiring that is in the element body, is connected to a second end portion of the inductor wiring, and extends to the first principal surface; and first and second external terminals exposed on the first principal surface and connected to the first and second vertical wirings, respectively. The magnetic powder contains an Fe element as a main component, and the first principal surface has an oxidized region, in which an oxide film of oxidized particles of the magnetic powder, is exposed and a non-oxidized region in which particles of the magnetic powder are exposed.

A magnetic powder contains a magnetic metal particle comprising iron (Fe) and an insulating coating layer disposed on a surface of the magnetic metal particle and comprising tin (Sn), phosphorous (P) and oxygen (O), and a coil component contains such a magnetic powder.

A coil-incorporated multilayer substrate includes base materials and a coil portion including conductor patterns that are wound a plurality of times on at least one of the base materials, and, in a predetermined direction along the surface of the base material of the coil portion, the width of outermost conductor patterns is larger than the widths of the conductor patterns between an innermost conductor pattern and an outermost conductor pattern, the width of the innermost conductor pattern is larger than the widths of the conductor patterns between the outermost conductor pattern and the innermost conductor pattern, and the width of the innermost conductor pattern is larger than the distance between the innermost conductor pattern and the conductor pattern adjacent to the innermost conductor pattern.

An inductor component includes a multilayer body including a magnetic layer; an inductor wiring disposed inside the multilayer body; and an external terminal exposed from the multilayer body. The multilayer body or the external terminal has an overlapping region disposed on the inductor wiring and a non-overlapping region not in contact with the inductor wiring, and reflection spectra of the overlapping region is different from reflection spectra of the non-overlapping region when irradiated with light having a prescribed wavelength from an outer surface side.

A coil component includes a body having a molded portion and a cover portion disposed on one surface of the molded portion, and including magnetic metal powder; a winding coil disposed between one surface of the molded portion and the cover portion and embedded in the body, and including a coating layer surrounding a surface of each of a plurality of turns; and a first protective film disposed between the one surface of the molded portion and the cover portion and between at least a portion of the surface of the winding coil and the cover portion.

Disclosed herein is a coil component that includes an element body having first and second magnetic layers and a coil part positioned therebetween, and first and second external terminals formed on the element body. The first external terminal is formed on the mounting surface and the first side surface. The second external terminal is formed on the mounting surface and the second side surface. The first and second external terminals formed on the first and second side surfaces, respectively, have a meander shape.

A multilayer coil component includes a multilayer body, and first and second outer electrodes. The multilayer body is formed by stacking plural insulating layers in a length direction, and includes a coil incorporated therein. The first and second outer electrodes are electrically connected to the coil. The coil is formed by electrically connecting plural coil conductors stacked in the length direction together with the insulating layers. The multilayer body has first and second end surfaces, first and second major surfaces, and first and second lateral surfaces. The first outer electrode has first, second, and third electrode portions. As viewed in plan in the width direction, the third electrode portion is substantially concave toward a vertex where first and second edges meet, the first edge being an edge where the first and third electrode portions meet, the second edge being an edge where the second and third electrode portions meet.

Methods of coupling inductors in an IC device using interconnecting elements with solder caps and the resulting device are disclosed. Embodiments include forming a top inductor structure, in a top inductor area on a lower surface of a top substrate, the top inductor structure having first and second top terminals at its opposite ends; forming a bottom inductor structure, in a bottom inductor area on an upper surface of a bottom substrate, the bottom inductor structure having first and second bottom terminals at its opposite ends; forming top interconnecting elements on the lower surface of the top substrate around the top inductor area; forming bottom interconnecting elements on the upper surface of the bottom substrate around the bottom inductor area; forming solder bumps on lower and upper surfaces, respectively, of the top and bottom interconnecting elements; and connecting the top and bottom interconnecting elements to each other.