An assembly includes a housing. A first set of coils is mounted to the housing. The first set of coils extends in an axial or rotational direction along the housing for a first length. A second set of coils is mounted to the housing. The second set of coils extends in the axial or rotational direction along the housing for a second length that is shorter than the first length. A core member includes a first core and a second core in series with one another in an axial direction along the core member. The core member is moveable within the housing along a stroke. For at least a first portion of the stroke, the first core is within the first set of coils. For at least a second portion of the stroke, the second core is within the second set of coils

An assembly includes a housing. A first set of coils is mounted to the housing. The first set of coils extends in an axial or rotational direction along the housing for a first length. A second set of coils is mounted to the housing. The second set of coils extends in the axial or rotational direction along the housing for a second length that is shorter than the first length. A core member includes a first core and a second core in series with one another in an axial direction along the core member. The core member is moveable within the housing along a stroke. For at least a first portion of the stroke, the first core is within the first set of coils. For at least a second portion of the stroke, the second core is within the second set of coils

A method for manufacturing a chip component includes forming an element, which includes a plurality of element parts, on a substrate. A plurality of fuses are formed, for disconnectably connecting each of the plurality of element parts to an external connection electrode. The external connection electrode, which is arranged to provide external connection for the element, is formed by electroless plating on the substrate.

A method for manufacturing a chip component includes forming an element, which includes a plurality of element parts, on a substrate. A plurality of fuses are formed, for disconnectably connecting each of the plurality of element parts to an external connection electrode. The external connection electrode, which is arranged to provide external connection for the element, is formed by electroless plating on the substrate.

Provided is a method for manufacturing a wireless power-transmitting device including a power-transmitter having a transmission coil, and a power-receiver having a reception coil. The method includes forming, in the electrically-conductive member, an eddy current interruption unit configured to change a state of an eddy current, formed in the electrically-conductive member by the transmission coil (reception coil), by interrupting and redirecting a portion of the eddy current to obtain processed electrically-conductive members, and preparing a plurality of types of the processed electrically-conductive members whose eddy current interruption units are different in form from each other; and selecting one type of the processed electrically-conductive member from the plurality of types of the processed electrically-conductive members and arranging the selected one type of the processed electrically-conductive member near the transmission coil (reception coil), thereby finely adjusting the inductance of the transmission coil (reception coil) to reach a preset inductance.

Provided is a method for manufacturing a wireless power-transmitting device including a power-transmitter having a transmission coil, and a power-receiver having a reception coil. The method includes forming, in the electrically-conductive member, an eddy current interruption unit configured to change a state of an eddy current, formed in the electrically-conductive member by the transmission coil (reception coil), by interrupting and redirecting a portion of the eddy current to obtain processed electrically-conductive members, and preparing a plurality of types of the processed electrically-conductive members whose eddy current interruption units are different in form from each other; and selecting one type of the processed electrically-conductive member from the plurality of types of the processed electrically-conductive members and arranging the selected one type of the processed electrically-conductive member near the transmission coil (reception coil), thereby finely adjusting the inductance of the transmission coil (reception coil) to reach a preset inductance.

An assembly includes a housing. A first set of coils is mounted to the housing. The first set of coils extends in an axial or rotational direction along the housing for a first length. A second set of coils is mounted to the housing. The second set of coils extends in the axial or rotational direction along the housing for a second length that is shorter than the first length. A core member includes a first core and a second core in series with one another in an axial direction along the core member. The core member is moveable within the housing along a stroke. For at least a first portion of the stroke, the first core is within the first set of coils. For at least a second portion of the stroke, the second core is within the second set of coils.

An assembly includes a housing. A first set of coils is mounted to the housing. The first set of coils extends in an axial or rotational direction along the housing for a first length. A second set of coils is mounted to the housing. The second set of coils extends in the axial or rotational direction along the housing for a second length that is shorter than the first length. A core member includes a first core and a second core in series with one another in an axial direction along the core member. The core member is moveable within the housing along a stroke. For at least a first portion of the stroke, the first core is within the first set of coils. For at least a second portion of the stroke, the second core is within the second set of coils.

A method for manufacturing a chip component includes forming an element, which includes a plurality of element parts, on a substrate. A plurality of fuses are formed, for disconnectably connecting each of the plurality of element parts to an external connection electrode. The external connection electrode, which is arranged to provide external connection for the element, is formed by electroless plating on the substrate.

A method for manufacturing a chip component includes forming an element, which includes a plurality of element parts, on a substrate. A plurality of fuses are formed, for disconnectably connecting each of the plurality of element parts to an external connection electrode. The external connection electrode, which is arranged to provide external connection for the element, is formed by electroless plating on the substrate.