An electronic component is disclosed. The electronic component includes: a capacitor body; first and second external electrodes on a mounting surface of the capacitor body; first and second connection terminals respectively connected to the first and second external electrodes; a first bonding portion between the first external electrode and the first connection terminal, and including a first-2-th region and a first-1-th region, the first-2-th region being adjacent to a center of the capacitor body and including a conductive resin, and the first-1-th region being adjacent to one end of the capacitor body and including a high melting point solder; and a second bonding portion between the second external electrode and the second connection terminal, and including a second-2-th region and a second-1-th region, the second-2-th region being adjacent to the center of the capacitor body and the second-1-th region being adjacent to the other end of the capacitor body.

An electronic component includes: an ESD discharge member including a substrate having first and second surfaces opposing each other, first and second through-holes penetrating through the substrate, and first and second conductors; and a multilayer capacitor disposed on the first surface of the substrate, in which the multilayer capacitor may include: a capacitor body; and first and second external electrodes disposed outside the capacitor body and connected to the first and second conductors, respectively, and the first and second conductors may include first and second via electrodes coated on inner walls of the first and second through-holes, respectively.

An electronic component and a board having the same mounted thereon are provided. The electronic component includes a capacitor body, a pair of external electrodes, respectively disposed on end portions of the capacitor body, a pair of metal frames, respectively disposed to be connected the pair of external electrodes, and a conductive bonding layer disposed between the external electrode and the metal frame and having a discontinuous region.

The insulating plate has a swelling protruding in a first direction that is a direction a first plate portion toward a second plate portion. The swelling is formed integral with the insulating plate. The first plate portion has a first fitting part protruding in the first direction and formed integral with this plate portion. The first fitting part is fitted, in the first direction, onto one surface side of the swelling of the insulating plate. The second plate portion has a second fitting part protruding in the first direction and formed integral with this plate portion. The second fitting part is fitted, in a second direction opposite to the first direction, onto the other surface side of the swelling.

An electronic device includes a plurality of chip components and an insulating case. The chip components are arranged in a first direction. The case includes a plate portion, a first protrusion portion, and a second protrusion portion. The plate portion faces first side surfaces of the chip components. The first protrusion portion is formed along a plate-portion first side of the plate portion and protrudes from the plate portion toward a downside perpendicular to the first direction. The second protrusion portion is formed to the first protrusion portion in a second direction and protrudes from the plate portion toward the downside. A protrusion length of the first protrusion portion and the second protrusion portion from the plate portion toward the downside is smaller than a protrusion length of the chip component included in the chip components from the plate portion toward the downside.

A multilayer ceramic capacitor may include: a ceramic body including a plurality of dielectric layers; first and second internal electrodes disposed in the ceramic body, the first internal electrode having first and second lead portions exposed to a first surface of the ceramic body in a width direction, and the second internal electrode having a third lead portion exposed to the first surface of the ceramic body in the width direction; first to third external electrodes disposed on the first surface of the ceramic body in the width direction to be connected to the first to third lead portions, respectively; and an insulation layer disposed on the first surface of the ceramic body in the width direction. Each of the first and second lead portions may be spaced apart from the third lead portion by a predetermined distance.

The insulating member is integrated with only one of the busbars by insert molding in which one of opposing plate members in either one of the busbars is used as an insert target. The insulating member includes an insulation active portion, a reinforcing portion and a connecting portion. The insulation active portion is disposed on a back-surface side of one of the opposing plate portions and is interposed between the back-surface side and the other one of the opposing plate portions. The reinforcing portion is disposed on the front-surface side of the one of the opposing plate portions.

The connecting portion serves to connect the insulation active portion and the reinforcing portion into an integral unit. In the insulating member, lower end regions of the insulation active portion, reinforcing portion and connecting portion, which are close to the capacitor element and extending from an upper-surface side to a lower-surface side of a side plate portion, are embedded in a mold resin that covers the side plate portion.

A capacitor and a method for manufacturing the capacitor are provided. The capacitor comprises (1) a capacitor main body including an outer package case, an opening sealing member attached to an inside of an open portion of the outer package case and a terminal lead penetrating through the opening sealing member; (2) a base attached to an outside of the open portion of the outer package case, the base including an insertion through hole through which the terminal lead passes to be disposed on an outer side of the base; and (3) a resin layer between the base and the opening sealing member.

A capacitor and a method for manufacturing the capacitor are provided. The capacitor comprises (1) a capacitor main body including an outer package case, an opening sealing member attached to an inside of an open portion of the outer package case and a terminal lead penetrating through the opening sealing member; (2) a base attached to an outside of the open portion of the outer package case, the base including an insertion through hole through which the terminal lead passes to be disposed on an outer side of the base; and (3) a resin layer between the base and the opening sealing member.

A multilayer ceramic electronic component includes first and second multilayer ceramic electronic component bodies facing each other in a length direction that connects first and second end surfaces. A first metal terminal is connected to a first outer electrode. A second metal terminal is connected to a fourth outer electrode. An outer casing covers the first and second multilayer ceramic electronic component bodies, and at least a portion of each of the first and second metal terminals. A third metal terminal is exposed from the outer casing.