A vacuum exhaust method is for decreasing a pressure in a processing chamber in which a mounting table configured to mount thereon a substrate is provided by using a gas exhaust unit. The vacuum exhaust method includes mounting a non-evaporated getter (NEG) on the mounting table, and adsorbing an active gas in the processing chamber on the NEG mounted on the mounting table. In the adsorbing the active gas, the NEG is maintained at a predetermined temperature.

A vacuum exhaust method is for decreasing a pressure in a processing chamber in which a mounting table configured to mount thereon a substrate is provided by using a gas exhaust unit. The vacuum exhaust method includes mounting a non-evaporated getter (NEG) on the mounting table, and adsorbing an active gas in the processing chamber on the NEG mounted on the mounting table. In the adsorbing the active gas, the NEG is maintained at a predetermined temperature.

Provided are a package structure, adaptor board, and packaging method of a display panel, and display device. A package structure of a display panel includes: the display panel, a chipset configured to control the display panel, and an adaptor board, wherein the chipset is located over the display panel, and the adaptor board is located between the chipset and the display panel. A protrusion at a side of the adaptor board facing the display panel has a gold surface. Package pins of respective chips in the chipset are electrically connected to the display panel via the adaptor board.

Provided are a package structure, adaptor board, and packaging method of a display panel, and display device. A package structure of a display panel includes: the display panel, a chipset configured to control the display panel, and an adaptor board, wherein the chipset is located over the display panel, and the adaptor board is located between the chipset and the display panel. A protrusion at a side of the adaptor board facing the display panel has a gold surface. Package pins of respective chips in the chipset are electrically connected to the display panel via the adaptor board.

Provided are a package structure, adaptor board, and packaging method of a display panel, and display device. A package structure of a display panel includes: the display panel, a chipset configured to control the display panel, and an adaptor board, wherein the chipset is located over the display panel, and the adaptor board is located between the chipset and the display panel. A protrusion at a side of the adaptor board facing the display panel has a gold surface. Package pins of respective chips in the chipset are electrically connected to the display panel via the adaptor board.

Provided are a package structure, adaptor board, and packaging method of a display panel, and display device. A package structure of a display panel includes: the display panel, a chipset configured to control the display panel, and an adaptor board, wherein the chipset is located over the display panel, and the adaptor board is located between the chipset and the display panel. A protrusion at a side of the adaptor board facing the display panel has a gold surface. Package pins of respective chips in the chipset are electrically connected to the display panel via the adaptor board.

Provided is a wiring structure for display device which does not generate hillocks even when exposed to high temperatures at levels around 450 to 600 C., has excellent high-temperature heat resistance, keeps electrical resistance (wiring resistance) of the entire wiring structure low, and further has excellent resistance to hydrofluoric acid. This wiring structure for a display device comprises a structure in which are laminated, in order from the substrate side, a first layer of an Al alloy that contains at least one chemical element selected from the group (group X) consisting of Ta, Nb, Re, Zr, W, Mo, V, Hf, Ti, Cr, and Pt and contains at least one rare earth element, and a second layer of an Al alloy nitride, or a nitride of at least one chemical element selected from the group Y consisted of Ti, Mo, Al, Ta, Nb, Re, Zr, W, V, Hf, and Cr.

Provided is a wiring structure for display device which does not generate hillocks even when exposed to high temperatures at levels around 450 to 600 C., has excellent high-temperature heat resistance, keeps electrical resistance (wiring resistance) of the entire wiring structure low, and further has excellent resistance to hydrofluoric acid. This wiring structure for a display device comprises a structure in which are laminated, in order from the substrate side, a first layer of an Al alloy that contains at least one chemical element selected from the group (group X) consisting of Ta, Nb, Re, Zr, W, Mo, V, Hf, Ti, Cr, and Pt and contains at least one rare earth element, and a second layer of an Al alloy nitride, or a nitride of at least one chemical element selected from the group Y consisted of Ti, Mo, Al, Ta, Nb, Re, Zr, W, V, Hf, and Cr.

A vacuum exhaust method is for decreasing a pressure in a processing chamber in which a mounting table configured to mount thereon a substrate is provided by using a gas exhaust unit. The vacuum exhaust method includes mounting a non-evaporated getter (NEG) on the mounting table, and adsorbing an active gas in the processing chamber on the NEG mounted on the mounting table. In the adsorbing the active gas, the NEG is maintained at a predetermined temperature.

A vacuum exhaust method is for decreasing a pressure in a processing chamber in which a mounting table configured to mount thereon a substrate is provided by using a gas exhaust unit. The vacuum exhaust method includes mounting a non-evaporated getter (NEG) on the mounting table, and adsorbing an active gas in the processing chamber on the NEG mounted on the mounting table. In the adsorbing the active gas, the NEG is maintained at a predetermined temperature.