Patent classifications
H01J2237/3382
Method for depositing a gap-fill layer by plasma-assisted deposition
A film having filling capability of a patterned recess on a surface of a substrate is deposited by forming a viscous material in a gas phase by striking a plasma in a chamber filled with a volatile precursor that can be polymerized within certain parameter ranges which include a partial pressure of the precursor during a plasma strike and substrate temperature.
METHOD FOR DEPOSITING A GAP-FILL LAYER BY PLASMA-ASSISTED DEPOSITION
A film having filling capability of a patterned recess on a surface of a substrate is deposited by forming a viscous material in a gas phase by striking a plasma in a chamber filled with a volatile precursor that can be polymerized within certain parameter ranges which include a partial pressure of the precursor during a plasma strike and substrate temperature.
METHOD FOR DEPOSITING A GAP-FILL LAYER BY PLASMA-ASSISTED DEPOSITION
A film having filling capability of a patterned recess on a surface of a substrate is deposited by forming a viscous material in a gas phase by striking a plasma in a chamber filled with a volatile precursor that can be polymerized within certain parameter ranges which include a partial pressure of the precursor during a plasma strike and substrate temperature.
COATINGS
The present invention provides an electronic or electrical device or component thereof comprising a cross-linked polymeric coating on a surface of the electronic or electrical device or component thereof; wherein the cross-linked polymeric coating is obtainable by exposing the electronic or electrical device or component thereof to a plasma comprising a monomer compound and a crosslinking reagent for a period of time sufficient to allow formation of the cross-linked polymeric coating on a surface thereof,
wherein the monomer compound has the following formula:
##STR00001##
where R.sub.1, R.sub.2 and R.sub.4 are each independently selected from hydrogen, optionally substituted branched or straight chain C.sub.1-C.sub.6 alkyl or halo alkyl or aryl optionally substituted by halo, and R.sub.3 is selected from:
##STR00002##
where each X is independently selected from hydrogen, a halogen, optionally substituted branched or straight chain C.sub.1-C.sub.6 alkyl, halo alkyl or aryl optionally substituted by halo; and n.sub.1 is an integer from 1 to 27; and wherein the crosslinking reagent comprises two or more unsaturated bonds attached by means of one or more linker moieties and has a boiling point at standard pressure of less than 500° C.
Methods of treating a surface of a polymer material by atmospheric pressure plasma
A method for treating a flexible plastic substrate is provided herein. The method includes establishing an atmospheric pressure plasma beam from an inert gas using a power of greater than about 90W, directing the plasma beam toward a surface of the flexible polymer substrate, and scanning the plasma beam across the surface of the polymer substrate to form a treated substrate surface.
Methods of treating a surface of a polymer material by atmospheric pressure plasma
A method for treating a flexible plastic substrate is provided herein. The method includes establishing an atmospheric pressure plasma beam from an inert gas using a power of greater than about 90W, directing the plasma beam toward a surface of the flexible polymer substrate, and scanning the plasma beam across the surface of the polymer substrate to form a treated substrate surface.
METHODS OF TREATING A SURFACE OF A POLYMER MATERIAL BY ATMOSPHERIC PRESSURE PLASMA
A method for treating a flexible plastic substrate is provided herein. The method includes establishing an atmospheric pressure plasma beam from an inert gas using a power of greater than about 90W, directing the plasma beam toward a surface of the flexible polymer substrate, and scanning the plasma beam across the surface of the polymer substrate to form a treated substrate surface.
Plasma polymerization apparatus and plasma polymerization method using the same
A plasma polymerization apparatus is provided for forming a polymerization coating on an inner surface of an object. The plasma polymerization apparatus comprises a chamber, a gas supply, a monomer source, a first electrode, a second electrode, a power source, and a metal foil. The gas supply is connected to the chamber for filling the chamber with a working gas. The monomer source is connected to the chamber for providing a vaporized monomer material into the chamber. The first electrode is located at a first side of the chamber. The second electrode is located at a second side of the chamber. The power source is electrically connected to the first electrode and the second electrode for generating plasma. The metal foil is wrapped around an outer surface of the object and placed between the first electrode and the second electrode. A plasma polymerization method is also provided.
PLASMA POLYMERIZATION APPARATUS AND PLASMA POLYMERIZATION METHOD USING THE SAME
A plasma polymerization apparatus is provided for forming a polymerization coating on an inner surface of an object. The plasma polymerization apparatus comprises a chamber, a gas supply, a monomer source, a first electrode, a second electrode, a power source, and a metal foil. The gas supply is connected to the chamber for filling the chamber with a working gas. The monomer source is connected to the chamber for providing a vaporized monomer material into the chamber. The first electrode is located at a first side of the chamber. The second electrode is located at a second side of the chamber. The power source is electrically connected to the first electrode and the second electrode for generating plasma. The metal foil is wrapped around an outer surface of the object and placed between the first electrode and the second electrode. A plasma polymerization method is also provided.
Coatings
The present invention provides an electronic or electrical device or component thereof comprising a cross-linked polymeric coating on a surface of the electronic or electrical device or component thereof; wherein the cross-linked polymeric coating is obtainable by exposing the electronic or electrical device or component thereof to a plasma comprising a monomer compound and a crosslinking reagent for a period of time sufficient to allow formation of the cross-linked polymeric coating on a surface thereof, wherein the monomer compound has the following formula: ##STR00001##
where R.sub.1, R.sub.2 and R.sub.4 are each independently selected from hydrogen, optionally substituted branched or straight chain C.sub.1-C.sub.6 alkyl or halo alkyl or aryl optionally substituted by halo, and R.sub.3 is selected from: ##STR00002##
where each X is independently selected from hydrogen, a halogen, optionally substituted branched or straight chain C.sub.1-C.sub.6 alkyl, halo alkyl or aryl optionally substituted by halo; and n.sub.1 is an integer from 1 to 27; and wherein the crosslinking reagent comprises two or more unsaturated bonds attached by means of one or more linker moieties and has a boiling point at standard pressure of less than 500° C.