An apparatus for sputtering target material onto a substrate based on a plasma confining racetrack having two parallel straight portions and two turnaround portions includes a tubular target, an elongated magnet array, and a drive mechanism. The tubular target has two ends in proximity to the two turnaround portions and a longitudinal axis about which the target is rotatable. The magnet array is supported within the target to generate a plasma-confining magnetic field. The array includes a central stationary portion of magnets and two axially movable shunts positioned at the ends of the stationary portion. Each shunt carries a magnet segment configured to slidably extend from each end of the stationary portion to define a gap. The gaps are positioned internal to the turnaround portions. The drive mechanism axially moves the shunts parallel to the longitudinal axis of the target to vary a width of the gaps.

A hydrogen-free carbon film polymer lubricating material and a preparation method and use thereof are disclosed. In the method, a graphite target is used as the target material, and a magnetron sputtering deposition is performed on a surface of the polymer substrate, thereby physically depositing and forming a hydrogen-free carbon film on the surface of the polymer substrate, thereby obtaining a hydrogen-free carbon film polymer lubricating material.

A cathode unit for performing a sputtering film formation includes: a target that emits sputtering particles; a target cooler that includes a cooling plate to which the target is bonded; and a power supply that supplies a power to the target. The target has a high-temperature region that has a higher temperature than other regions of the target during a film formation. The cooling plate includes a coolant flow space through which a coolant flows, and a first wall and a second wall that define the coolant flow space in a thickness direction. In the coolant flow space, a flow path of the coolant is formed by a first partition plate and a second partition plate. The first partition plate does not exist at a portion of the coolant flow space that corresponds to the high-temperature region.

Embodiments of deposition rings for use in a process chamber are provided herein. In some embodiments, a deposition ring includes: an annular body; an inner wall extending upward from an inner portion of the annular body; and an outer wall extending upward form an outer portion of the annular body to define a large deposition cavity between the inner wall and the outer wall, wherein a width of the large deposition cavity is about 0.35 inches to about 0.60 inches, wherein the outer wall includes an outer ledge and an inner ledge raised with respect to the outer ledge.

A multiple sputtering target for magnetron arrangements has a tubular magnetron, for coating substrates in a vacuum chamber. The tubular magnetron is mounted in an end block or some other drive unit. A magnet bar is located in the tubular magnetron. Substrates transported along a circular path through a vacuum chamber can be coated with a selectable multiplicity of materials by magnetron sputtering. At least one polygonal carrier tube having an angular cross section has a plurality of longitudinally extending outer surfaces for receiving targets. A free extends longitudinally through the polygonal carrier tube. A magnet bar for forming plasma clouds outside the polygonal carrier tube is located in a working position in front of a target which can be selected by rotating the polygonal carrier tube. The moving or stationary substrate is located at a predetermined distance in front of the plasma clouds.

A production method for a gold sputtering target includes: producing a gold sputtering target which is made of gold and inevitable impurities and in which an average value of Vickers hardness is 40 or more and 60 or less, an average value of crystal grain size is 15 μm or more and 200 μm or less, and the {110} plane of gold is preferentially oriented to a surface to be sputtered of the gold sputtering target.

Conventional electrochromic devices frequently suffer from poor reliability and poor performance. Improvements are made using entirely solid and inorganic materials. Electrochromic devices are fabricated by forming an ion conducting electronically-insulating interfacial region that serves as an IC layer. In some methods, the interfacial region is formed after formation of an electrochromic and a counter electrode layer. The interfacial region contains an ion conducting electronically-insulating material along with components of the electrochromic and/or the counter electrode layer. Materials and microstructure of the electrochromic devices provide improvements in performance and reliability over conventional devices. In various embodiments, a counter electrode is fabricated to include a base anodically coloring material and one or more additives.

Magnetron sputtering source (1) for coating of a substrate (2), the sputtering source (1) comprising: a target (5) having a target surface at a front side a magnetron arrangement (511, 512) at a backside of the target (5) for creating a magnetic field near the target surface, to define a loop shaped erosion zone (20) at the target surface between an inner magnet assembly (512) and an outer magnet assembly (511), wherein the erosion zone (20) comprises a middle section with two parallel tracks (26) having a distance (d) and two curved end loop sections (27) each of which connects adjoining ends of the parallel tracks (26) and has a loop width (w) in the direction of the distance (d) which is greater than the distance (d) resulting in a double-T-shaped primary geometry of the erosion zone to provide an increased coating material flux from the end loop sections (27) to the substrate.

Provided is an oxide-containing magnetic material sputtering target wherein the oxides have an average grain diameter of 400 nm or less. Also provided is a method of producing an oxide-containing magnetic material sputtering target. The method involves depositing a magnetic material on a substrate by the PVD or CVD method, then removing the substrate from the deposited magnetic material, pulverizing the material to obtain a raw material for the target, and further sintering the raw material. An object is to provide a magnetic material target, in particular, a nonmagnetic grain-dispersed ferromagnetic sputtering target capable of suppressing discharge abnormalities of oxides that are the cause of particle generation during sputtering.

A coated cylinder liner 20 comprises a wear resistant layer 22, such as a DLC coating, and a metallic adhesive layer 24, such as chromium or titanium, deposited on an inner surface 26 thereof. The layers 22, 24 each have a thickness t.sub.w, t.sub.n varying by not more than 5% along at least 70% of the length of the inner surface 26. The metallic adhesive layer 24 is deposited by sputtering a consumable metallic electrode 28 onto the inner surface 26. The sputtering can be magnetron sputtering. The consumable metallic electrode 28 can include a hollow opening 40 with orifices 50 for providing a carrier gas into the deposition chamber 52. In addition, the inner surface 26 of the cylinder liner 20 can provide the deposition chamber 52 by sealing a first opening 36 and second opening 38 of the cylinder liner 20.