An ultrasonic bonding device includes a stage and an ultrasonic horn. A first flat member and a second flat member to be bonded are placed on the stage. The ultrasonic horn includes a press part to be pressed on a laminated portion of the first flat member and the second flat member. The stage includes a lower-side surface, a higher-side surface, and a step wall surface. The first flat member is to be placed on the lower-side surface. The higher-side surface is positioned higher than the lower-side surface by a predetermined step height. The second flat member is to be placed on the higher-side surface. The step wall surface is positioned in a boundary between the lower-side surface and the higher-side surface.

An ultrasonic bonding device includes a stage and an ultrasonic horn. A first flat member and a second flat member to be bonded are placed on the stage. The ultrasonic horn includes a press part to be pressed on a laminated portion of the first flat member and the second flat member. The stage includes a lower-side surface, a higher-side surface, and a step wall surface. The first flat member is to be placed on the lower-side surface. The higher-side surface is positioned higher than the lower-side surface by a predetermined step height. The second flat member is to be placed on the higher-side surface. The step wall surface is positioned in a boundary between the lower-side surface and the higher-side surface.

A semiconductor device includes a semiconductor chip, an insulated circuit substrate including an insulating board and a circuit pattern on the insulating board electrically connected to the semiconductor chip, and a wiring member having a leg portion bonded to the circuit pattern. The leg portion includes a vertical portion, a first divided portion, and a second divided portion. The vertical portion extends in a vertical direction orthogonal to a plane of the circuit pattern, and has a split end provided at a side of the vertical portion at which the circuit pattern is disposed. The first divided portion extends from the split end in a first direction parallel to the plane of the circuit pattern and is bonded to the circuit pattern. The second divided portion extends from the split end in a second direction opposite the first direction and is bonded to the circuit pattern.

A semiconductor manufacturing apparatus includes a tool performing joining by ultrasonic vibration while applying a load to a metal terminal. The tool includes a plurality of protrusions arranged along the X-axis direction and the Y-axis direction on a pressing surface in a rectangular shape at a tip end portion facing the metal terminal. The intervals between the plurality of protrusions are equal in the X direction of the pressing surface, and are larger on the inner peripheral side than on the outer peripheral side in the Y-axis direction of the pressing surface.

A semiconductor manufacturing apparatus includes a tool performing joining by ultrasonic vibration while applying a load to a metal terminal. The tool includes a plurality of protrusions arranged along the X-axis direction and the Y-axis direction on a pressing surface in a rectangular shape at a tip end portion facing the metal terminal. The intervals between the plurality of protrusions are equal in the X direction of the pressing surface, and are larger on the inner peripheral side than on the outer peripheral side in the Y-axis direction of the pressing surface.

First and second operations are executed under control of a peeling inspection control apparatus functioning as a peeling and grasping control unit. In the first operation, a processed surface contact state in which a processed outer peripheral surface of a contact roller and a surface of a lead wire are in contact with each other is maintained, and contact roller rotation operation is executed in which the contact roller is moved on the surface of the lead wire while the contact roller is being rotated. During execution of the first operation, a tip portion of the lead wire is peeled from a glass substrate. Thereafter, in the second operation, grasping operation is executed in which the tip portion of the lead wire peeled from the glass substrate is grasped by a grasping mechanism.

First and second operations are executed under control of a peeling inspection control apparatus functioning as a peeling and grasping control unit. In the first operation, a processed surface contact state in which a processed outer peripheral surface of a contact roller and a surface of a lead wire are in contact with each other is maintained, and contact roller rotation operation is executed in which the contact roller is moved on the surface of the lead wire while the contact roller is being rotated. During execution of the first operation, a tip portion of the lead wire is peeled from a glass substrate. Thereafter, in the second operation, grasping operation is executed in which the tip portion of the lead wire peeled from the glass substrate is grasped by a grasping mechanism.

The present disclosure provides a circuit board, including a substrate on which a first conductive layer and an electronic device are disposed, wherein the first conductive layer is disposed on a first surface of the substrate, and wherein a bottom end of the electronic device is disposed on the first conductive layer through the substrate. The present disclosure provides a display device.

A substrate processing apparatus includes: a placement part whereon a substrate container is placed; a substrate retainer supporting the substrate; transfer mechanisms configured to transfer the substrate between the substrate container and the substrate retainer and to perform a transfer operation; a detector provided at one or more of the transfer mechanisms to detect vibration; a memory device that registers, in advance, natural frequencies of the substrate and one or more of the transfer mechanisms and threshold values of the substrate and the plurality of transfer mechanisms; and a monitoring part to monitor whether an intensity of the vibration, based on transformed data obtained by transforming detection data, exceeds at least one of the threshold values of the substrate and the plurality of transfer mechanisms and whether a vibration frequency is equal to at least one of the natural frequencies of the substrate and the plurality of transfer mechanisms.

First and second operations are executed under control of a peeling inspection control apparatus functioning as a peeling and grasping control unit. In the first operation, a processed surface contact state in which a processed outer peripheral surface of a contact roller and a surface of a lead wire are in contact with each other is maintained, and contact roller rotation operation is executed in which the contact roller is moved on the surface of the lead wire while the contact roller is being rotated. During execution of the first operation, a tip portion of the lead wire is peeled from a glass substrate. Thereafter, in the second operation, grasping operation is executed in which the tip portion of the lead wire peeled from the glass substrate is grasped by a grasping mechanism.