The present disclosure relates a lithographic substrate marking tool. The tool includes a first electromagnetic radiation source disposed within a housing and configured to generate a first type of electromagnetic radiation. A radiation guide is configured to provide the first type of electromagnetic radiation to a photosensitive material over a substrate. A second electromagnetic radiation source is disposed within the housing and is configured to generate a second type of electromagnetic radiation that is provided to the photosensitive material.

A tape roll includes a cylindrical core, a strip-shaped tape wound on the core, and a marking portion that represents type information of the strip-shaped tape and that is applied to an inner peripheral surface of the core. Preferably, the type information of the strip-shaped tape includes at least one piece of type information selected from a group consisting of a width, a length, a material, an adhesive force, and a shelf life of the tape, and the marking portion has slots or an identification code representing the at least one piece of type information. A tape mounter for bonding, to a workpiece, the tape which is wound on the core of the tape roll is also disclosed.

An apparatus includes a substrate; circuit components disposed on the substrate; and a location identifier layer over the circuit, wherein the location identifier layer includes one or more section labels for representing physical locations of the circuit components within the apparatus.

A technique for marking semiconductor devices with an identifiable mark or alphanumeric text yields a high-contrast, easily distinguishable mark on an electrical terminal of the device without impacting the device's breakdown voltage capability and without compromising the solderability and wire bondability of the terminal. This approach deposits the mark on the terminal as a patterned layer of palladium, which offers good contrast with the base metal of the terminal and maintains the solderability and bondability of the terminal.

A laser machining apparatus includes, a processing chamber, a window disposed in a surface of the processing chamber, a substrate carrier disposed inside the processing chamber and facing the window, a laser irradiator which irradiates a laser onto the substrate carrier through the window, a protector supplier disposed on a side of the processing chamber, a protector retriever disposed on an opposite side of the processing chamber opposite to the side of the processing chamber, and a protector which connects the protector supplier with the protector retriever, where at least a portion of the protector is disposed between the substrate carrier and the window in the processing chamber.

The application relates to the technical field of semiconductor manufacturing, and in particular relates to a front opening unified pod, a wafer transfer system and a wafer transfer method. The front opening unified pod includes a body, a wafer scanning device and a cover. The body is provided with an opening communicating with an interior of the body. The wafer scanning device includes a first wafer scanning device, is arranged on an inner wall of the body, and is configured to scan a storage condition of wafers in the body. The cover is fastened at the opening. The wafer scanning device is arranged on the inner wall of the body of the front opening unified pod, and the wafer scanning device scans and confirms the storage condition of the wafers in the front opening unified pod in real time.

An apparatus includes a substrate; circuit components disposed on the substrate; and a location identifier layer over the circuit, wherein the location identifier layer includes one or more section labels for representing physical locations of the circuit components within the apparatus.

A laser processing apparatus includes a laser oscillator configured to emit a laser beam, a slit configured to narrow a width of the laser beam emitted from the laser oscillator to a width corresponding to a dividing groove to form the dividing groove of a predetermined width, a slit moving mechanism configured to move the slit in a direction corresponding to a width direction of the dividing groove, and an adjusting unit configured to make the center of the slit and the cross-sectional center of the laser beam entering the slit coincide with each other in a direction in which the slit moving mechanism moves the slit.

A dividing apparatus includes a table having a transparent plate having a holding surface for holding a workpiece thereon and a lower illumination unit for illuminating the holding surface from below, a first storage section for storing a first image including a white portion where illumination light from the lower illumination unit is transmitted through the workpiece and displayed as white and a black portion where the illumination light is blocked by the workpiece and displayed as black when an image of a kerf defined by a dividing unit in the workpiece held on the holding surface is captured by an image capturing unit with the lower illumination unit being energized, and a white pixel detecting section for detecting whether or not there are pixels in the white portion of the first image in directions perpendicular to directions along which a street extends.

A control part of a semiconductor fault analysis device outputs an alignment command that moves a chuck to a position at which a target is detectable by a first optical detection part and then aligns an optical axis of a second optical system with an optical axis of a first optical system with the target as a reference, and outputs an analysis command that applies a stimulus signal to a semiconductor device and receives light from the semiconductor device emitted according to a stimulus signal with at least one of a first optical detection part and a second optical detection part in a state in which a positional relationship between the optical axis of the first optical system and the optical axis of the second optical system is maintained.