A substrate holder includes a first boat configured to hold a substrate in a shelf-like manner, and a second boat coaxial with the first boat and provided to move up and down relative to the first boat. The second boat holds a substrate in a shelf-like manner. The first boat includes a first bottom plate and a first ceiling plate provided to face each other, a first support column connecting the first bottom plate and the first ceiling plate to each other, and a first placement surface on which the substrate is placed. The second boat includes a second bottom plate and a second ceiling plate provided to vertically face each other, a second support column connecting the second bottom plate and the second ceiling plate, and a second placement surface on which the substrate is placed. The second ceiling plate overlaps the first ceiling plate in a plan view.

A SiC film structure for obtaining a three-dimensional SiC film by forming the SiC film in an outer circumference of a substrate using a vapor deposition type film formation method and removing the substrate, the SiC film structure including: a main body having a three-dimensional shape formed of a SiC film and having an opening for removing the substrate; a lid configured to cover the opening; and a SiC coat layer configured to cover at least a contact portion between the main body and an outer edge portion of the lid and join the main body and the lid.

The present invention provides a quartz clip device and a manufacturing method thereof and an OLED high-temperature oven having the quartz clip device. The quartz clip device includes: a base (20), a plurality of quartz posts (30) mounted on the base (20), a quartz bottom board (40) arranged above the base (20), and a plurality of quartz plates (50) arranged above the quartz bottom board (40) and secured to the quartz posts (30). The quartz bottom board (40) includes a plurality of circular holes (42) formed therein to respectively correspond to the quartz posts (30). The circular holes (42) have a diameter that is slightly greater than a diameter of the quartz posts (30). The quartz posts (30) are received through he circular holes (42) and fastening members (60) are provided under the circular holes (42) to have the quartz bottom board (40) supported on the quartz posts (30). Slightly enlarging the diameter of the circular holes of the quartz bottom board ensures slight tipping of the quartz posts does not result in contact with the quartz bottom board so as to prevent cracking of the quartz bottom board from being caused by the contacts and affecting the production.

Systems and methods to improve an industrial heater are disclosed. The heater comprises a horizontal cylinder oriented parallel to the ground and may encase an interior recess running the length of the heater. The heater may be divided into a plurality of sections or zones. One or more mid-rings may support the structure of the heater, and may be disposed at the intersections of adjacent sections or zones. A plurality of interior boards and/or insulation layers may line the interior façade, and may be configured to overlap each other and/or interlock together. The interlocking structure may be absent of any gap or space to prevent heat loss from the interior recess. One or more heat strips may be configured in a sinusoidal pattern. The strips may be mirrored on the opposite side of the interior recess, and may be configured to elongate in the direction opposite of gravity.

Disclosed is a graphite plate to solve a problem of poor performance uniformity of an epitaxial wafer obtained during carrying on epitaxial growth of material using the graphite plate. A graphite plate includes: a graphite plate body, includes a carrying recess and a recess located on one side of the carrying recess away from a central point of the graphite plate body; and a stopper, which is embedded in the recess in a matching manner, and the stopper protrudes from the bottom surface of the carrying recess to form a limiting structure.

A manufacturing method of the ESD protection device includes the following steps. A surface treatment is performed on the substrate. A link layer is formed on the substrate after the surface treatment, wherein a material of the link layer includes a metal material. A progressive layer is formed on the link layer, wherein a material of the progressive layer includes a non-stoichiometric metal oxide material, and an oxygen concentration in the non-stoichiometric metal oxide material is increased gradually away from the substrate in a thickness direction of the progressive layer. A composite layer is formed on the progressive layer, wherein the composite layer includes a stoichiometric metal oxide material and a non-stoichiometric metal oxide material, and a ratio of the non-stoichiometric metal oxide material and the stoichiometric metal oxide material in the composite layer may make a sheet resistance value of the composite layer 1×10.sup.7 to 1×10.sup.8 Ω/sq.

A substrate processing apparatus, provided with a substrate carrier support to support a substrate carrier thereon. The carrier support comprises a top support surface to support the substrate carrier; a thermally insulating body of thermally insulating material; and, a primary heater to heat the carrier support. The thermally insulating body is provided at least between the support surface and the primary heater.

There is provided a technique that includes: forming a film on a substrate including a recess formed on a surface of the substrate by performing a cycle a predetermined number of times, the cycle including: (a) supplying a precursor gas to the substrate; and (b) supplying a reaction gas to the substrate, wherein in (a), the precursor gas is supplied to the substrate separately a plurality of times, and a processing condition under which the precursor gas is supplied for a first time is set to a processing condition under which self-decomposition of the precursor gas is capable of being more suppressed than a processing condition under which the precursor gas is supplied for at least one subsequent time after the first time.

An electronic component includes a body and one or more protrusions. The body includes a first side surface, a second side surface opposite to the first side surface, and a first principal surface. The one or more protrusions are provided on at least one of the first side surface, the second side surface, or the first principal surface.

Systems and methods to improve an industrial heater are disclosed. The heater comprises a horizontal cylinder oriented parallel to the ground and may encase an interior recess running the length of the heater. The heater may be divided into a plurality of sections or zones. One or more mid-rings may support the structure of the heater, and may be disposed at the intersections of adjacent sections or zones. A plurality of interior boards and/or insulation layers may line the interior façade, and may be configured to overlap each other and/or interlock together. The interlocking structure may be absent of any gap or space to prevent heat loss from the interior recess. One or more heat strips may be configured in a sinusoidal pattern. The strips may be mirrored on the opposite side of the interior recess, and may be configured to elongate in the direction opposite of gravity.