A packaging device and a manufacturing method thereof are provided. The packaging device includes: a bottom plate (1); a side plate (2) fixed to a surface of the bottom plate (1), the bottom plate (1) and the side plate (2) forming a containing cavity through joint enclosure; and a supporting piece (3) in the bottom plate (1). The bottom plate (1) completely wraps the supporting piece (3). An extending direction of the supporting piece (3) is roughly parallel to the surface of the bottom plate (1). A material of the supporting piece (3) is different from that of the bottom plate (1), and a strength of the supporting piece (3) is greater than that of the bottom plate (1).

A microLED mass transfer stamping system includes a stamp substrate with an array of trap sites, each configured with a columnar-shaped recess to temporarily secure a keel extended from a bottom surface of a microLED. In the case of surface mount microLEDs, the keel is electrically nonconductive. In the case of vertical microLEDs, the keel is an electrically conductive second electrode. The stamping system also includes a fluidic assembly carrier substrate with an array of wells having a pitch separating adjacent wells that matches the pitch separating the stamp substrate trap sites. A display substrate includes an array of microLED pads with the same pitch as the trap sites. The stamp substrate top surface is pressed against the display substrate, with each trap site interfacing a corresponding microLED site, and the microLEDs are transferred. Fluidic assembly stamp substrates are also presented for use with microLEDs having keels or axial leads.

A tray assembly includes a base tray, and an anti-slip pad disposed on the base tray, wherein the anti-slip pad has a friction coefficient in a range of about 0.5 to about 20 based on ASTM D1894, and a surface resistance in a range of about 10{circumflex over ( )}6 Ω/cm.sup.2 to about 10{circumflex over ( )}9 Ω/cm.sup.2 based on ASTM D257, and the anti-slip pad includes at least one of a thermoplastic olefinic elastomer (TPO), natural rubber, styrene-butadiene rubber (SBR), and polypropylene (PP).

A microLED mass transfer stamping system includes a stamp substrate with an array of trap sites, each configured with a columnar-shaped recess to temporarily secure a keel extended from a bottom surface of a microLED. In the case of surface mount microLEDs, the keel is electrically nonconductive. In the case of vertical microLEDs, the keel is an electrically conductive second electrode. The stamping system also includes a fluidic assembly carrier substrate with an array of wells having a pitch separating adjacent wells that matches the pitch separating the stamp substrate trap sites. A display substrate includes an array of microLED pads with the same pitch as the trap sites. The stamp substrate top surface is pressed against the display substrate, with each trap site interfacing a corresponding microLED site, and the microLEDs are transferred. Fluidic assembly stamp substrates are also presented for use with microLEDs having keels or axial leads.

A method of manufacturing a semiconductor device may include: exposing a surface of a gallium oxide substrate to an acidic or alkaline chemical solution so as to increase a surface roughness of the surface; and forming an electrode on the surface having the increased surface roughness.

A microLED mass transfer stamping system includes a stamp substrate with an array of trap sites, each configured with a columnar-shaped recess to temporarily secure a keel extended from a bottom surface of a microLED. In the case of surface mount microLEDs, the keel is electrically nonconductive. In the case of vertical microLEDs, the keel is an electrically conductive second electrode. The stamping system also includes a fluidic assembly carrier substrate with an array of wells having a pitch separating adjacent wells that matches the pitch separating the stamp substrate trap sites. A display substrate includes an array of microLED pads with the same pitch as the trap sites. The stamp substrate top surface is pressed against the display substrate, with each trap site interfacing a corresponding microLED site, and the microLEDs are transferred. Fluidic assembly stamp substrates are also presented for use with microLEDs having keels or axial leads.

A microLED mass transfer stamping system includes a stamp substrate with an array of trap sites, each configured with a columnar-shaped recess to temporarily secure a keel extended from a bottom surface of a microLED. In the case of surface mount microLEDs, the keel is electrically nonconductive. In the case of vertical microLEDs, the keel is an electrically conductive second electrode. The stamping system also includes a fluidic assembly carrier substrate with an array of wells having a pitch separating adjacent wells that matches the pitch separating the stamp substrate trap sites. A display substrate includes an array of microLED pads with the same pitch as the trap sites. The stamp substrate top surface is pressed against the display substrate, with each trap site interfacing a corresponding microLED site, and the microLEDs are transferred. Fluidic assembly stamp substrates are also presented for use with microLEDs having keels or axial leads.

A microLED mass transfer stamping system includes a stamp substrate with an array of trap sites, each configured with a columnar-shaped recess to temporarily secure a keel extended from a bottom surface of a microLED. In the case of surface mount microLEDs, the keel is electrically nonconductive. In the case of vertical microLEDs, the keel is an electrically conductive second electrode. The stamping system also includes a fluidic assembly carrier substrate with an array of wells having a pitch separating adjacent wells that matches the pitch separating the stamp substrate trap sites. A display substrate includes an array of microLED pads with the same pitch as the trap sites. The stamp substrate top surface is pressed against the display substrate, with each trap site interfacing a corresponding microLED site, and the microLEDs are transferred. Fluidic assembly stamp substrates are also presented for use with microLEDs having keels or axial leads.

A tray assembly includes a base tray, and an anti-slip pad disposed on the base tray, wherein the anti-slip pad has a friction coefficient in a range of about 0.5 to about 20 based on ASTM D1894, and a surface resistance in a range of about 10{circumflex over ()}6 ?/cm.sup.2 to about 10{circumflex over ()}9 ?/cm.sup.2 based on ASTM D257, and the anti-slip pad includes at least one of a thermoplastic olefinic elastomer (TPO), natural rubber, styrene-butadiene rubber (SBR), and polypropylene (PP).

The present invention provides a stopper for a substrate cassette and a substrate cassette assembly, belonging to the technical field of manufacturing of display devices, which can solve the problem that an existing substrate cassette easily damages a substrate. The stopper for the substrate cassette of the present invention is strip-shaped, and arranged, in a length direction, on an inner side of a mullion of the substrate cassette; the stopper has a contact surface configured to contact the mullion of the substrate cassette and an exposed surface opposite to the contact surface, and the exposed surface, at least on a side facing the outside of the substrate cassette, is a convex cambered surface.