A transportation system for semiconductor module base plates includes a plurality of spacer elements. Each spacer element includes a distance holding element, a first pin on a first side of the distance holding element, and a second pin on a second side of the distance holding element. Each spacer element is configured to be arranged between two of a plurality of semiconductor module base plates. Each of the first pin and the second pin is configured to engage with a corresponding counterpart of one of the semiconductor module base plates when the corresponding spacer element is arranged between two of the semiconductor module base plates.

A conveying device, a conveying method, and an evaporation apparatus are provided. The conveying device comprises a carrying mechanism for carrying a substrate; and a fastening mechanism for fastening the substrate on the carrying mechanism in a mechanical manner. In the conveying device, the substrate is fastened on the carrying mechanism in a mechanical manner by the fastening mechanism. As compared with electrostatic fastening and adhesive fastening, this reduces damage to the substrate, increases the reliability for fastening the substrate, and makes it easy to receive and detach the substrate. (FIG. 1)

Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.

A pre-jig wafer carrier disc installation/uninstallation device and a method thereof, including a first displacement mechanism, a wafer frame installation/uninstallation mechanism, a wafer installation/uninstallation mechanism, a mask installation/uninstallation mechanism and a robotic arm arranged around the first displacement mechanism. The said mechanisms sequentially stack the wafer frame, the wafer and the mask on the first displacement mechanism to form an assembly. An installation/uninstallation mechanism is disposed at a movable end of the robotic arm. The robotic arm drives the installation/uninstallation mechanism to remove and lock the assembly on an assembly carrier section of a carrier disc for successive processing. After the wafers are processed, the robotic arm drives the installation/uninstallation mechanism to move the assembly back onto the first displacement mechanism. The said mechanisms sequentially disassemble the assembly and recover the mask, the wafer and the wafer frame.

A wafer separating apparatus is provided which includes a wafer supporting member having an upper surface on which a bonded wafer formed of two wafers bonded with each other is placed; an arm portion arranged outside of the wafer supporting member, the arm portion being movable closer to and away from a bonded portion of the bonded portion of the bonded wafer supported by the supporting portion; and an inflating portion provided in an distal end portion of the arm portion, the inflating portion being inflatable in a direction intersecting the upper surface of the wafer supporting member.

A tensioning device, including a base configured to carry a mask plate, a clamp configured to clamp the mask plate, and a deformation adjusting assembly provided on the base or on the clamp, wherein the deformation adjusting assembly is configured to adjust a deformation of an end portion of the mask plate protruding from the base in a direction of gravity when the base carries the mask plate, so as to make the deformation less than a preset deformation threshold. A base, a clamp and a clamping for the mask plate are also provided.

A carrier spacer includes an annular main body, a first tapered part formed on an inner peripheral part of a front surface of the main body, a second tapered part formed on the inner peripheral part of a reverse surface of the main body, a flat surface formed on the outer peripheral side of the first tapered part on the front surface of the main body and holding the reverse surface of the outer peripheral part of a semiconductor wafer, a peripheral edge part formed on the outer peripheral side of the flat surface of the main body and provided with a step having a height position higher than a height position of the flat surface, an arcuate cutout part formed from the peripheral edge part to the flat surface of the main body, and a pair of handles protruding from the peripheral edge part toward the outer peripheral side.

A carrier tray includes a housing, an ingot accommodating recess that accommodates a semiconductor ingot, and a wafer accommodating recess that accommodates a wafer. The housing has an upper wall, a lower wall, a pair of side walls connecting the upper wall and the lower wall to each other, and a tunnel defined by the upper wall, the lower wall, and the pair of side walls. A plurality of levers each of which has a point of application projecting from a bottom surface of the ingot accommodating recess, a point of action projecting from a side surface of the ingot accommodating recess, and a fulcrum formed between the point of application and the point of action are each attached to the housing so as to be rotatable around the fulcrum.

Disclosed is a container that receives a substrate type sensor. The container includes a body having a reception space, one side of which is opened, a door that selectively opens and closes the reception space, a shelf part that supports the substrate type sensor in the reception space, and a charging module that charges the substrate type sensor supported by the shelf part, and the charging module includes a charging part that moves between a standby location and a charging location that charges the substrate type sensor supported by the shelf part.

In an embodiment a method includes arranging a plurality of semiconductor chips on a carrier, arranging an auxiliary carrier on sides of the semiconductor chips facing away from the carrier, removing the carrier, separating the auxiliary carrier between the semiconductor chips to form auxiliary carrier-chip units, each of the auxiliary carrier-chip units has at least one semiconductor chip and an auxiliary carrier part adjoining the semiconductor chip, arranging each of the auxiliary carrier-chip units on a connecting carrier and removing the auxiliary carrier parts from each auxiliary carrier-chip unit.