H
ELECTRICITY
H
ELECTRICITY
H01
ELECTRIC ELEMENTS
H01
ELECTRIC ELEMENTS
H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L21/70
Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
H01L21/70
Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
H01L21/71
Manufacture of specific parts of devices defined in group H01L21/70
H01L21/71
Manufacture of specific parts of devices defined in group H01L21/70
H01L21/768
Applying interconnections to be used for carrying current between separate components within a device; comprising conductors and dielectrics
H01L21/768
Applying interconnections to be used for carrying current between separate components within a device; comprising conductors and dielectrics
H01L21/76838
characterised by the formation and the after-treatment of the conductors
H01L21/76838
characterised by the formation and the after-treatment of the conductors
H01L21/76877
Filling of holes, grooves or trenches, e.g. vias, with conductive material
H01L21/76877
Filling of holes, grooves or trenches, e.g. vias, with conductive material