H01L22/00
Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
H01L22/00
Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
H01L22/30
Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
H01L22/30
Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
H01L22/32
Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
H01L22/32
Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors