A substrate-conveying support tape includes: a support film; a primer layer provided on the support film; and a temporary fixing material layer provided on the primer layer, in which the support film is a polyimide film, the temporary fixing material layer contains a thermoplastic resin, and the primer layer contains at least one selected from the group consisting of a silane coupling agent having an epoxy group or a ureido group, an epoxy resin, a polyurethane rubber, and an acrylic rubber having an acid value of 5 mgKOH/g or more.

Systems and methods for releasing semiconductor dies during pick and place operations are disclosed. In one embodiment, a system for handling semiconductor dies comprises a support member positioned to carry at least one semiconductor die releasably attached to a support substrate. The system further includes a picking device having a pick head coupleable to a vacuum source and positioned to releasably attach to the semiconductor die at a pick station. The system still further incudes a cooling member coupleable to a cold fluid source and configured to direct a cold fluid supplied by the cold fluid source toward the support substrate at the pick station. The cold fluid cools a die attach region of the substrate where the semiconductor die is attached to the substrate to facilitate removal of the semiconductor die.

A protective sheeting for use in processing a semiconductor-sized wafer has a substantially circular base sheet and a substantially annular adhesive layer applied to a peripheral portion of a first surface of the base sheet. The inner diameter of the adhesive layer is smaller than the diameter of the wafer. Further, the outer diameter of the adhesive layer is larger than the inner diameter of an annular frame for holding the wafer. A related method includes attaching the protective sheeting to a front side or a back side of the wafer via the adhesive layer on the first surface of the base sheet so that an inner peripheral portion of the adhesive layer adheres to an outer peripheral portion of the front side or the back side of the wafer, and processing the wafer after the protective sheeting has been attached to the front side or the back side thereof.

The present application discloses a separating apparatus for separating an object to be separated including two plate-shaped structures stacked on each other. The separating apparatus includes: an electrical signal generating unit and an acoustic wave signal output unit connected to each other, the electrical signal generating unit is configured to generate a target electrical signal; and the acoustic wave signal output unit is configured to convert the target electrical signal into a target acoustic wave, and output the target acoustic wave to the object to be separated, wherein a frequency of the target acoustic wave is different from a natural frequency of any one of the two plate-shaped structures.

Provided are a kit and a laminate which are capable of suppressing residues derived from a temporary adhesive in manufacture of a semiconductor. The kit for manufacturing a semiconductor device includes a composition which contains a solvent A; a composition which contains a solvent B; and a composition which contains a solvent C, in which the kit is used when a temporary adhesive layer is formed on a first substrate using a temporary adhesive composition containing a temporary adhesive and the solvent A, at least some of an excessive amount of the temporary adhesive on the first substrate is washed using the composition containing the solvent B, a laminate is manufactured by bonding the first substrate and a second substrate through the temporary adhesive layer, one of the first substrate and the second substrate is peeled off from the laminate at a temperature of lower than 40° C., and then the temporary adhesive remaining on at least one of the first substrate or the second substrate is washed using the composition containing the solvent C, and the solvent A, the solvent B, and the solvent C respectively satisfy a predetermined vapor pressure and a predetermined saturated solubility.

Provided are: a wafer processing temporary adhesive that is for temporarily adhering a wafer to a support and that comprises a thermosetting resin composition containing a non-functional organopolysiloxane; a wafer laminate; and a thin wafer manufacturing method.

A process for bonding chips to a substrate by direct bonding includes providing a support with which the chips are in contact, the chips in contact with the support being separate from one another. This bonding process also includes forming a liquid film on one face of the substrate, bringing the chips into contact with the liquid film, where the action of bringing the chips into contact with the liquid film causes attraction of the chips toward the substrate, and evaporating the liquid film in order to bond the chips to the substrate by direct bonding.

An adhesive sheet for temporary fixation which may have excellent heat resistance to exhibit a sufficient adhesive force even though it undergoes a high temperature process during a process of manufacturing a semiconductor device and may also exhibit a sufficient reduction of the adhesive force by photocuring during the step of peeling off, and a method of manufacturing a semiconductor device using the same, are provided.

The present invention relates to a film-shaped firing material (1) which contains: sinterable metal particles (10); a binder component (20) that is a solid at room temperature; and a liquid component (30) that is a liquid at room temperature, the liquid component having a boiling point from 300 to 450° C.

A laminated device wafer forming method includes a laminating step of laminating a first device wafer and a second device wafer to each other, the laminating step including a position adjusting step of imaging, by an imaging unit, a first predetermined line formed on a peripheral portion on the front surface side of the first device wafer and located outside rectangular regions corresponding to devices and a second predetermined line formed on a peripheral portion on the front surface side of the second device wafer and located outside the rectangular regions corresponding to the devices, and adjusting relative positions of the first device wafer and the second device wafer by using the first predetermined line and the second predetermined line.